2 results about "Hydrogenated terphenyls" patented technology

The present application relates to the technical field of heat conducting oil, in particular to a hydrogenated terphenyl high-temperature heat conducting oil and a preparation process thereof.The solid acid catalyst is first applied to the alkylation reaction of cyclohexylbenzene and cyclohexene, and then a partial dehydrogenation reaction is carried out through a dehydrogenation catalyst; the dehydrogenation catalyst comprises HY molecular sieve modified by ammonium fluoride and cobalt-doped activated carbon formed by high-temperature carbonization of a chitosan-cobalt complex loaded on the surface of the HY molecular sieve.The prepared dehydrogenation catalyst can adapt to the fixed-bed continuous reaction process, the hydrogenated terphenyl high-temperature heat conducting oil prepared has stable quality, can meet the needs of industrialized continuous production, and has good industrial application prospect.

The application relates to the technical field of non-silicon heat-conducting paste processing, in particular to a non-silicon heat-conducting paste with ultra-low thermal resistance and high-temperature resistance and a preparation method thereof, which is prepared from the following raw materials in parts by weight: alkyl naphthalene 30-50 parts, alkyl benzene 5-15 parts, hydrogenated terphenyl 10-20 parts, polyether base oil 5-10 parts, superfine heat-conducting filler 60-80 parts, structure directing agent 4-8 parts, perfluoropolyether phosphate 0.5-1 part and antioxidant 1-3 parts. By adopting the above formula, a non-silicon compound oil phase system is constructed, the superfine heat-conducting filler, the structure directing agent and the perfluoropolyether phosphate are combined, high thermal conductivity, ultra-low thermal resistance and excellent interface adhesion are realized, the risk of silicon volatilization pollution is completely eliminated, high-temperature oxidation resistance and long-term reliability are improved, and the urgent needs of 5G, AI and other high-heat-density electronic equipment for non-silicon high-performance thermal interface materials are effectively met.