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75results about How to "Avoid uneven surfaces" patented technology

Semiconductor light-emitting device and manufacturing method thereof

ActiveCN104733579AImprove recombination radiation efficiencyAvoid uneven surfacesSemiconductor devicesIndiumQuantum well
The invention discloses a semiconductor light-emitting device and a manufacturing method thereof. The semiconductor light-emitting device comprises a substrate, a crystallizing layer formed on the substrate, a gallium nitride buffering layer, an N-type gallium nitride layer, a transition layer, a multi-quantum-well layer and a P-type gallium nitride layer and further comprises a low-temperature gallium nitride layer and a stress release layer, wherein the low-temperature gallium nitride layer is formed on the N-type gallium nitride layer, a plurality of concave pits are formed in the low-temperature gallium nitride layer, the thickness of the stress release layer is smaller than 100 nm, the stress release layer is composed of 1-K layers of Inx(k)Ga1- x(K)N which are sequentially formed on the low-temperature gallium nitride layer, the thickness d<k> of the kth layer of Inx(k)Ga1- x(K)N is smaller than the thickness d<k-1> of the (k-1)th layer of Inx(k-1)Ga1- x(K-1)N, x(k) is larger than x(k-1), k is equal to 1,...,K, and K is smaller than or equal to 5; the concave pits are covered with the P-type gallium nitride layer. The number of the InGaN layers in the stress release layer and the overall thickness are adjusted according to In components of quantum wells so that the In components of the InGaN layers can be gradually increased from the bottom layer to the surface, the thickness is gradually reduced, and the purpose of gradually releasing stress is achieved.
Owner:扬州德豪润达光电有限公司

Novel food processer

A novel food processer comprises a cup body and a cup seat. A lower opening is formed in the bottom end of the cup body, an upper opening matched with a cup cover is formed in the top end of the cup body, a cup mouth is arranged on the upper opening, a plurality of disturbed flow convex ribs are arranged on the inner wall of the cup body, a turbulent flow convex rib is arranged at the position, between every two adjacent disturbed flow convex ribs, of the inner wall of the cup body, and the thickness of protrusions of the turbulent flow convex ribs is smaller than that of protrusions of the disturbed flow convex ribs, so that a stereoscopic turbulent flow cavity is formed between every two adjacent disturbed flow convex rib and turbulent flow convex rib. A screwing portion is arranged at the bottom end of the cup body, the lower opening of the cup body is formed by the bottom end of the screwing portion, a step-shaped transition face is formed between the inner wall of the screwing portion and the inner wall of the cup body, and the tail ends of the bottoms of the disturbed flow convex ribs and the tail ends of the bottoms of the turbulent flow convex ribs extend to the lower opening along the transition face. The novel food processer is good in flow disturbing and smashing effect, mounting of a heating disc is simple and fast, detaching, mounting and maintaining are convenient, a pre-locating structure is arranged, and sealing performance between the heating disc and the cup body is better.
Owner:广东昌盛电器有限公司

Automatic stamping and laminating equipment of PI reinforcement plates for FPC

The invention discloses automatic stamping and laminating equipment of PI reinforcement plates for an FPC. The automatic stamping and laminating equipment comprises a work bench, a transit transfer station, an FPC storage tray, an FPC feeding manipulator, a PI reinforcement plate stamping device, a first PI reinforcement plate laminating manipulator, a second PI reinforcement plate laminating manipulator, a finished product receiving tray and a finished product receiving manipulator, wherein the transit transfer station comprises a transit transfer plate which slides in a reciprocating manner along the work bench; the first PI reinforcement plate laminating manipulator and the second PI reinforcement plate laminating manipulator are provided with suction laminating devices; each suction laminating device comprises a bracket, a driving lever, a first lifting part and a second lifting part; the driving lever is rotationally arranged on the bracket; the first lifting part is vertically arranged on the bracket in a sliding manner; the second lifting part is vertically arranged on the bracket in the sliding manner; and two ends of the driving lever are propped against or separated from the first lifting part and the second lifting part respectively. According to the automatic stamping and laminating equipment, automatic stamping and laminating work of the PI reinforcement plates on the FPC is achieved; the overall process is smooth and fast; and the production working efficiency is greatly improved.
Owner:SANKYO PRECISION HUIZHOU

Surface enhanced Raman scattering substrate and preparation method thereof

The invention discloses a surface enhanced Raman scattering substrate and a preparation method thereof. The method comprises the following steps: firstly, growing a layer of gold nano film on a flexible polymer substrate, and enabling the gold film to generate regular and uniform cracks along with the extension of a polymer through adoption of a two-way mechanical stretching method; and then, transferring the gold film with the stretched microstructure to a clean glass substrate, and a layer of uniform and compact SnSe2 nanosheets grow on the gold film. The structure combines the advantages of a traditional metal SERS substrate, that is, a metal tip has a hot spot, and a local electric field is enhanced; and the two-dimensional material SnSe2 has the advantages that the two-dimensional material SnSe2 and the semiconductor SERS substrate are combined, surface non-uniformity caused by agglomeration due to weak adsorption capacity of the metal SERS substrate can be avoided, in addition, the two-dimensional material SnSe2 is large in specific surface area, the structure has a light limiting effect, and light can be limited in the structure. The advantages of a semiconductor SERS substrate and a traditional metal substrate are combined, and the effect of enhancing Raman scattering is achieved.
Owner:江苏度微光学科技有限公司
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