82results about How to "Poor reliability" patented technology

The present invention provides a method of data management for a flash memory medium, characterized in that the status flag of the memory block of said flash memory medium is set as an unfinished state during operating the memory block; after finishing the manipulation, the status flag is set from the unfinished to a finished state. This method ensures that the original data in the flash memory medium will not be lost even if the false power cut occurs when writing the data into the flash memory medium. The present invention also provides a method of writing and a method of recovering the data in the flash memory medium using the above-mentioned data management method.

A transparent conductive oxide contact layer to enhance the spectral output of a light emitting device and a methodology for its deposition. The transparent conductive oxide deposited on the light emitting device so as to have a columnar structure. The transparent conductive oxide contact layer may be preferably ZnO doped with a conductive element. Light emitting phosphors may also be deposited within the transparent conductive oxide contact layer.

A contact pad structure disposed on a peripheral region of a substrate is provided. The contact pad structure includes a transparent conductive pattern, a metal conductive pattern, and a protection layer. The transparent conductive pattern has a bonding region, a first side region, a second side region, a third side region and a fourth side region. The first, the second, the third, and the fourth side regions sequentially surround the bonding region. The metal conductive pattern without overlapping the bonding region has a first contact region, a second contact region and a first connection region. The first contact region contacts the first side region. The second contact region contact the third side region. The first connection region is connected between the first contact region and the second contact region. The protection layer covering the metal conductive pattern has a protection layer opening exposing the bonding region.

A lithium primary battery including a positive electrode, a negative electrode, an organic electrolyte, and a separator interposed between the positive electrode and the negative electrode: the negative electrode including a negative electrode active material; the negative electrode active material being at least one selected from the group consisting of lithium metal and a lithium alloy; at least a surface layer portion of the negative electrode including a composite of amorphous carbon material and the negative electrode active material; and the surface layer portion facing the positive electrode with the separator interposed therebetween.

The invention discloses a noise reduction and temperature control system based on a semiconductor refrigeration mechanism. The noise reduction and temperature control system based on the semiconductor refrigeration mechanism comprises a heat radiating system, a refrigeration system and a temperature control system. The heat radiating system adopts a heat tube heat radiating fin, the refrigeration system comprises a circuit chip, a semiconductor refrigerator and a temperature sensor, and the temperature control system comprises a driving circuit, a D/A converter, a single chip microcomputer and a temperature displayer. The noise reduction and temperature control system is designed based on the Peltier effect and can create a low-temperature working environment for a circuit chip, reduce multiple types of noise relevant with the temperature, effectively improve signal to noise ratio and widen a dynamic range. The noise reduction and temperature control system based on the semiconductor refrigeration mechanism is simple in structure and low in cost and has the advantages of being free of refrigerants, good in environment-friendly performance, free of moving parts, low in vibration and noise and the like.

According to the concepts of the present disclosure, laser diode waveguide configurations are contemplated where the use of Al in the waveguide layers of the laser is presented in the form of InGaN/Al(In)GaN waveguiding superstructure comprising optical confining wells (InGaN) and strain compensating barriers (Al(In)GaN). The composition of the optical confining wells is chosen such that they provide strong optical confinement, even in the presence of the Al(In)GaN strain compensating barriers, but do not absorb lasing emission. The composition of the strain compensating barriers is chosen such that the Al(In)GaN exhibits tensile strain that compensates for the compressive strain of InGaN optical confinement wells but does not hinder the optical confinement.

The invention provides an assessment method and device for the risk degree of a person and electronic equipment. The method comprises the steps that target data is obtained; through the target data, person relationship networks are built; according to a target algorithm, the person relationship networks are treated to obtain characteristic vector information of each node in the person relationshipnetworks; the characteristic vector information is input to a deep convolutional neural network to determine the risk degree, of each type, of the person to be assessed. According to the assessment method for the risk degree of the person, the data resources are wide and not limited to dialog data but relates to person relationship data and consumption data, and based on the data, the multiple person relationship networks are built, so that the problem of single data resource is solved; moreover, the risk degrees, of the multiple types, of the person to be assessed can be determined, and thetypes are not limited to a certain criminal type, so that the technical problems are solved that according to existing risk degree assessment methods, the data source is single, and assessment can only be conducted on specific criminal crimes, so that the limitation is large.

An improved rotating anode x-ray tube housing is disclosed. In the preferred embodiment: a single cable, insulated with Ethylene-Propylene Rubber (“EPR”), has an extended Federal Standard terminal or plug mounted within an extended Federal Standard receptacle, attached to an anode end of the housing; the cable is designed to carry up to approximately 150 kV to power the cathode; and insulation of the plug also insulates the 150 kV from a grounded center portion of the x-ray tube and the anode disk area. The longitudinal axes of the anode and high-voltage plug are parallel to one another. This new configuration allows the cathode plug and receptacle to be moved virtually entirely inside the housing. This results in absolute minimal size of the assembly, and a single cable that exits parallel to the rotational axis of the housing.

The present invention provides a display substrate and a manufacturing method thereof, and a flexible display device having the display substrate, which belong to the field of display technology, and can solve the problem of poor reliability of display substrates due to the damage to thin film transistors when the existing display substrates are bent. In the display substrate provided by the present invention, by introducing stress absorption units made of resin material into the display substrate, the stress generated by the display substrate bent is released by the resin material, and thin film transistors on the display substrate are thus less likely to be damaged, so that the reliability of the whole display substrate is improved.

The invention discloses a network protection method and device, the method comprises: initiating a protection configuration request through a control plane of an automatically switched optical network (ASON); and realizing a protection configuration on each node of the network according to the protection configuration request. A safe and reliable recovery capability; a reliable efficiency guarantee and an effective guarantee of the coordination of the switching and recovery are provided.

The invention discloses a motor vehicle with a device for correcting an operation of stepping on an accelerator by mistake as an operation of braking, and belongs to a motor vehicle which can correct a mechanical operation of stepping on an accelerator by mistake as a mechanical operation of automatic braking through electrical signal conversion. The motor vehicle disclosed by the invention is characterized in that a sensor of the device for correcting the operation of stepping on the accelerator by mistake as the operation of braking is connected with a signal analyzer and used for transmitting accelerator signals to the signal analyzer; the signal analyzer is connected with a brake startup mechanism and used for transmitting brake startup signals to the brake startup mechanism; and the sensor of the device for correcting the operation of stepping on the accelerator by mistake as he operation of braking is connected with a movable mechanism of an auto accelerator system, and the brake startup mechanism of the device for correcting the operation of stepping on the accelerator by mistake as he operation of braking is connected with the movable mechanism of the auto accelerator system. The motor vehicle disclosed by the invention has the advantages that by using the motor vehicle, the mechanical operation of automatic braking can be obtained quickly and accurately by using a mechanical operation of viciously stepping on the accelerator by mistake, the installation and maintenance of the motor vehicle are convenient, and the reliability of mechanical transmission of the motorvehicle is good. When a driver viciously steps on the accelerator by mistake excessively or violently, the motor vehicle disclosed by the invention can be stopped automatically so as to avoid the occurrence of traffic accidents.

A microphone includes a substrate, an opening in the substrate, and a support structure in the opening. The support structure includes a first bracket formed in a closed-loop pattern and a second bracket connecting the first bracket to a periphery of the opening. The support structure in the opening increases the mechanical reliability of the microphone.

A burner includes a pilot burner, a combustion chamber, and a swirler located radially outwardly of the combustion chamber and being adapted to impose a swirling motion on a fuel/air mixture about an axial centerline of the combustion chamber. The pilot burner has a pilot burner face located radially inwardly of the swirler and forms an axially upstream wall of the combustion chamber, the pilot burner face incorporating a pilot fuel injector and an ignitor, both being positioned radially offset from the axial centerline. A recess is positioned radially offset from the axial centerline within the pilot burner face.

The invention discloses a display substrate, a display panel and a display device. According to the display substrate, by additional arrangement of a first functional layer, a second functional layerand a first polarization layer, an optical film and an optical path system of an original backlight module can be integrated to the display substrate; according to the display device, the display substrate is adopted, and the optical layer is additionally arranged on the display substrate, so that thinning and light weight of the display device or display equipment can be realized, and the reliability of the light source module can be improved.

This disclosure provides a package substrate, a flip-chip package circuit and their fabrication method. The package substrate includes: a first wiring layer having a first metal wire and a first dielectric material layer filling the remaining part of the first wiring layer except for the first metal wire; a conductive pillar layer formed on the first wiring layer and including a metal pillar connected to the first metal wire, a molding compound layer with a protrusion part surrounding the metal pillar, and a second dielectric material layer formed on the molding compound layer; a second wiring layer formed on the conductive pillar layer and including a second metal wire connected to the metal pillar; and a protection layer formed on the second wiring layer.

The invention aims to provide a method for confirming critical data in a CPU (Central Processing Unit) card safely. When a computer terminal which is possibly unsafe is used, the method can be used for confirming the critical data in the CPU card. The method can be used for online payment, the modification and the resetting of the critical data in the CPU card. After being combined with a good password protocol, the method can simply and safely realize that online banks, online games and other services can be used safely at a computer terminal which is possibly unsafe.

The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (F): (A) an epoxy resin; (B) a phenol resin; (C) a curing accelerator; (D) an inorganic filler; (E) a hydrotalcite compound; and (F) a carboxyl group-containing wax having an acid value of 10 to 100 mg KOH/g.

An image sensor module includes a substrate, a circuit layer, a flip chip, an insulating layer, and a conducting layer. The substrate has at least one transparent area and defines a first surface and a second surface. The circuit layer is provided on the first surface of the substrate. The flip chip is connected to the circuit layer. The insulating layer substantially encases the flip chip and a part of the circuit layer, wherein the insulating layer has at least one groove at a lateral side of said insulating layer thereof each provided with a metal layer. The conducting layer is provided on a top surface of the insulating layer, wherein the conducting layer is electrically connected to the circuit layer via the metal layer.

The present invention proposes a multi-chip semiconductor device having leads and a method for fabricating the same. The method includes the steps of: providing a substrate having a plurality of connection pads disposed on a surface thereof; mounting a plurality of semiconductor chips on the surface of the substrate, and electrically connecting the semiconductor chips to the surface of the substrate; forming an encapsulant on the substrate to encapsulate the semiconductor chips and expose the connection pads to form a package unit; and providing a lead frame having a plurality of leads, and electrically connecting the connection pads exposed from the package unit to the leads of the lead frame to form a multi-chip semiconductor device having leads, thereby forming a multi-chip semiconductor device having leads. By the multi-chip semiconductor device and the method for fabricating the same as proposed in the present invention, problems like poor reliability caused by stress induced by several types of materials in a semiconductor package into which a substrate and leads are integrated, moisture absorption by an encapsulated substrate, and cracks developed as a result of moisture absorption by the substrate can be avoided.

The present invention discloses a battery latch structure, wherein a battery slot for receiving a battery is located on the main body, a first end of said battery is latched to a first end of said slot through a first clamp structure, and a second end of said battery is latched to a second end of said slot through a second clamp structure. The second clamp structure includes a second fixed clamp located on the left and right sides of the second end of said slot, and a battery latch, a spring and two battery lock members located at the second end of said battery. The battery latch is located at the second end of the battery and may be slid upwards and downwards to be moveably connected with the two battery lock members. The spring is located between the two battery lock members. The said spring can push the two battery lock members protruding leftwards and rightwards respectively to insert into the second clamp. The said battery latch can be moved upwards by the action of outside force, to release the two battery lock members from the second clamp. The advantages of the present invention are simple in structure and convenient for operation.