The invention discloses an HBT (heterojunction bipolar transistor) circuit chip temperature analysis method based on MATLAB (matrix laboratory) programming. The method mainly solves the problems of small circuit scale and complicated manual input power consumption of the traditional finite element analysis method. The method comprises the following major steps that 1, the geometric dimension of an HBT device and the material heat conductivity are obtained; 2, the device is subjected to modeling, and in addition, the single device is subjected to finite element temperature analysis; 3, the temperature distribution of each device is subjected to function fitting; 4, circuit software is used for simulation, the power consumption of each device is obtained, and is marked on a territory; 5, a GDSII format territory file is exported, and then, the format is converted into a DXF format; 6, the MATLAB programming is used, the coordinate and the power consumption of the devices on the territory are extracted, the work temperature of each device is calculated, and a temperature distribution figure is made. The HBT circuit chip temperature analysis method has the advantages that the method can be used for the integrated circuit physical design time and can be used for predicting the stable state temperature of the HBT device in the work process of the circuit and the hotspot positions on the territory, and the work stability of the circuit is improved.