The utility model provides an apparatus for assisting
wafer ring to take off
wafer, including stage,
wafer ring and material taking device, the stage is cylindrical, and the top surface of stage is provided with a through groove in the radial direction, and the through groove penetrates through the lateral surface of stage, the inner side wall of wafer ring is radially protruded to form a step surface, and the wafer is placed on the step surface, and the
diameter of wafer ring is larger than the
diameter of stage, when wafer ring is placed on the bottom of stage from top to bottom along with wafer, the wafer on wafer ring leaves the step surface and is left on the top surface of stage, and material taking device takes off wafer from the top surface of stage or from the through groove of stage. The utility model has simple structure, and the wafer is supported on the top surface of stage and then taken off, so the operation is convenient, the taking-off efficiency and stability can be improved, the wafer edge is prevented from contacting and
rubbing with the inner side wall of wafer ring caused by dumping, and the wafer quality is improved.