The invention discloses a
heat sink structure double-carrier LED (Light-Emitting
Diode) drive circuit
package and a manufacturing method thereof. The
package comprises a power device and a control
chip both fixed on base islands, the control
chip is connected with the power device and an inner pin, the power device is connected with the inner pin, the inner pin is connected with an external pin, and
sealant bodies are arranged on the base islands by
plastic packaging; the base islands are two mutually isolated base islands, the power device is adhered on one base island through a conductive
adhesive film, and the bottom surface of the base island, opposite to the power device, is located outside the
sealant body; and an IC control
chip is adhered on the other base island through an insulating
adhesive film. The back surface of a
wafer is coated with an insulation paste, the
wafer is adhered on the base island after being
cut into single crystalline grains, the power device is adhered on the other base island, and pressure
welding,
plastic packaging, curing and detection are carried out through the existing technology; the bottom surface of the first base island, without any adhered device, is located outside the
sealant body, and thus, the
heat sink structure double-carrier LED drive circuit
package is obtained. The package can quickly dissipate a large amount of heat, the insulation paste is not liable to be broken down, and the insulation paste and the conductive
adhesive are not interpenetrative to each other.