The invention discloses a
wafer level packaging structure, method and product for an LED
flip chip. The
wafer level packaging structure comprises the LED
flip chip, a
silicon substrate, a lens, a
printed circuit board and a
heat sink. The obverse side of the
silicon substrate is provided with a concave cavity in a machined mode, and the concave cavity is used for accommodating the LED
flip chip. The length of the bottom of the concave cavity is identical to the length of the LED flip
chip. The reverse side of the
silicon substrate is provided with two through holes in a machined mode, and the two through holes are communicated with the concave cavity. Insulating
layers are deposited on the surface of the concave cavity and the surfaces of the two through holes. A radiating
metal layer and a reflecting
metal layer are deposited on the insulating layer on the surface of the concave cavity.
Metal bodies are filled in the two through holes. The
metal bodies in the through holes are connected with the radiating metal layer on the surface of the concave cavity. An opening is formed between two metal
layers at the inner bottom of the concave cavity and used for isolating the metal
layers into two parts. An insulating layer is deposited on the reverse side of the silicon substrate, and a metal layer is arranged on the surface of the insulating layer in a wiring mode and used for
electrode connection. Fluorescent
powder is coated in the concave cavity. The periphery of the concave cavity is provided with an annular positioning cavity in a machined mode, and the annular positioning cavity is used for fixing the lens. The
wafer level packaging structure, method and product for the LED flip
chip can improve LED luminous efficiency, enhance heat dissipation capability and finish
self alignment.