The invention relates to a
metal faced integral-linking
chip substrate insulated and decorated board and a manufacturing method thereof. The uppermost layer of the cast-in-situ molding integral-linking
chip substrate board is a decorated surface of
metal plate, a button stem is installed between the upper and the lower
layers of the integral-linking
chip substrate board, foaming insulation boards with holes are between the button stem and the upper and lower
layers of the cast-in-situ molding integral-linking chip substrate board, and the holes are used for forming the button stem. The preparation method is as follows: a steel bracket, a template and a mould are displaced on a vibration
workbench,
sizing agent is applied for the first time and the steel bracket, the template and the mould are put into the foaming insulation boards, the holes for forming the button stem are between the foaming insulation boards,
sizing agent is applied for the second time, a cast-in-situ molding internal-linking substrate board is formed, the upper-layer
fiber mesh and non-woven fabrics are paved smoothly, static maintenance and white-hard
drying are carried out, the
metal decorated board is pressed, bonded, and is edge-molded. The insulated decorated board has quick site operation, easy
processing and mounting in site, light weight, high integrated intensity, good insulation performance, good
weather resistance, good surface decorative performance, and difficult
ablation among
layers.