The invention provides a profile forming device and method for a heat dissipation element with micro-channels arranged in an offset mode, and relates to the field of profile
extrusion forming, the profile forming device comprises a mold, flow dividing holes, a mold core and a forming cavity are arranged in the mold, the flow dividing holes are formed in the two sides of the mold core respectively, the sectional areas of the flow dividing holes in the two sides are different, and a mold
core needle at one end of the mold core stretches into a working tape; a forming cavity is formed between the mold
core needle and the working tape, and the distance between the mold
core needle and the thick-wall side working tape is larger than that between the mold core needle and the thin-wall side working tape; the
shunting hole in one side of the mold core is communicated with the thick-wall side of the forming cavity through the
welding chamber, and the
shunting hole in the other side of the mold core is communicated with the thin-wall side of the forming cavity through the
welding chamber; in order to solve the problem that an existing profile for a heat dissipation element with a micro-channel arranged in an offset mode is difficult to form, the diverting holes arranged in the offset mode are formed to reasonably divert
metal, so that the wall thickness distribution requirement of the profile with the micro-channel arranged in the offset mode is met, stress on the two sides of a die core is balanced, die abrasion and unbalance loading are reduced, the forming precision of the profile is improved, and the service life of a die is prolonged.