The invention discloses a manufacture method for multiple surface treatments on one board. The manufacture method comprises the following steps of:
cutting:
cutting copper foils according to the design requirement of each layer; affixing of photosensitive dry films: affixing the photosensitive dry films to every
internal layer except for the outmost top layer and bottom layer; pattern transfer: transferring the pattern of every
internal layer to the surface of the board; pattern
etching: fully
etching off the unneeded positions with
etching chemical liquid; removal of dry films: fully removing the affixed dry films; pattern checking: checking the open short and other bad phenomena of a circuit by using a scanning instrument;
browning: mainly roughening the
copper surfaces and circuit surfaces in every
internal layer; lamination and pressing: completely laminating and pressing the internal / external
layers together; mechanical drilling: drilling to form conduction holes of every layer and element holes; P.T.H (plating of through hole): depositing
copper on the inner walls of each hole;
electroplating: thickening the copper
layers in the holes of the circuit board and the copper
layers on the surface of the board; affixing of a photosensitive dry film: affixing a photosensitive dry film to the whole surface of the external layer; transferring of patterns: transferring the patterns of the external layer to the surface of the board;
electroplating of patterns:
electroplating the patterns for thickening the copper layers in the holes of the circuit board and the copper layers of the patterns; etching of the patterns: fully etching off the unneeded positions with etching chemical liquid; checking of the patterns: checking the open short and other bad phenomena of the circuit by the scanning instrument; application of green oil: endowing the board with insulation action; affixing of a photosensitive dry film: affixing the photosensitive dry film to the whole surface of the external layer;
exposure: exposing the position to be gold-plated; development: developing the position to be gold-plated; gold deposition: fully plating gold on the developed positions of the photosensitive dry film, wherein the undeveloped positions of the dry film are protected by the dry film and can not be gold-plated; removal of the dry film: removing the dry film; shaping: finishing the produced circuit board until the size meets the finished product requirement; detection: testing the shaped circuit board to confirm that appearance and function problems are not existed; OSP (organic
solderability preservatives) treatment: carrying out OSP treatment on the positions which are not gold-plated by forming an anti-oxidation film; FQC (final
quality control): fully checking again to confirm that appearance and function problems are not existed; and final checking: checking after QA (
quality assurance).