The utility model provides a wire structure. The wire structure comprises a first
dielectric layer; the seed layer is arranged on the first
dielectric layer; the conductive trace is arranged on the upper surface, deviating from the first
dielectric layer, of the seed layer; and the second
dielectric layer covers the conductive trace and is in contact with the upper surface of the seed layer. In the prior art, in the wet
etching process of a seed layer, an
etching solution etches a conductive trace at the same time, so that the conductive trace is thinned, and the bending strength of the conductive trace is easily reduced and even broken, the
photoresist is used as a protective layer before
etching, the conductive trace is separated from the etching solution, and the conductive trace is prevented from being damaged. Therefore, when the seed layer is etched, the conductive traces are not etched, the conductive traces are prevented from being thinned, the bending strength of the conductive traces is ensured, the normal work of the whole
lead structure is ensured, and the problems of open circuit and the like are avoided.