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3results about How to "Lower the pressure value" patented technology

Composite solid electrolyte material and preparation method and application thereof

This invention relates to the field of solid-state battery technology, and particularly to a composite solid-state electrolyte material, its preparation method, and its application. The composite solid-state electrolyte material contains a crystalline phase substance with the general chemical formula: B%A a RE b X 1 c D g +C%A d M e X 2 f D h Where A represents charge carriers; RE represents rare earth elements; M represents metallic elements; X represents... 1 X 2 D is a halide anion; A is an anion doping element or group; a RE b X 1 c D g and A d M e X 2 f D h It is a crystalline phase substance; B% is A a RE b X 1 c D g The mass fraction of the composite solid electrolyte material; C% is A d M e X 2 f D h The mass fraction of the composite solid electrolyte material is defined as follows: 0 ≤ a ≤ 3, 0 < b ≤ 1, 0.5 < c ≤ 12, 0 < d ≤ 5, 0 < e ≤ 2, 1 < f ≤ 20, 0 ≤ g ≤ 4, 0 ≤ h ≤ 5; 85 < B + C < 98, 10% < B% ≤ 85%; 10% < C% ≤ 85%, 0.2 ≤ C / B ≤ 10. The composite solid electrolyte material of this invention includes crystalline and amorphous phase components, giving it high ionic conductivity. The use of moisture-resistant non-metallic halide components instead of traditional halides and oxyhalides in the raw materials also provides it with good air stability.
Owner:GUOKE RE ADVANCED MATERIALS CO LTD +1

A method and application of metal hot pressing bonding

ActiveCN114899115Bimprove bindingNo oxidationBond interfaceEngineering
This invention discloses a method for metal hot-press bonding and its application. The method specifically includes: providing a first substrate and a second substrate, the first substrate having a first metal bonding surface and the second substrate having a second metal bonding surface; aligning the first and second substrates to bring the first and second metal bonding surfaces into contact; and performing hot-press bonding by controlling temperature and applying pressure. The hot-press bonding includes a heating and high-pressure stage, a heat-holding and low-pressure stage, and a cooling and pressure-releasing stage; the temperature of the heat-holding and low-pressure stage is the bonding temperature. This invention achieves hot-press bonding of metals in an air environment through coordinated temperature and pressure control, resulting in a well-bonded interface that is free of oxidation, dense, and pore-free.
Owner:SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS

System energy-saving self-air supply powder concentrator and self-air supply method thereof

ActiveCN115569842BTo achieve the purpose of self-supply of windLower the pressure valueDrive shaftRotational flow
The application discloses a system energy-saving type self-air-supply powder concentrator and a self-air-supply method thereof, which comprises a shell, a first driving device, a first transmission shaft, a second driving device, a second transmission shaft, a rotating cage, guide vanes, a material returning device and an air outlet. The first transmission shaft is connected with the rotating cage, a plurality of first axial flow vanes are arranged on the first transmission shaft, the first axial flow vanes are arranged inside the rotating cage and are arranged at a certain angle with the first transmission shaft. A plurality of second axial flow vanes are arranged on the second transmission shaft, the second axial flow vanes are arranged between the rotating cage and the air outlet and are arranged at a certain angle with the second transmission shaft. When the self-air-supply is performed, the rotating speed of the second axial flow vanes is greater than or equal to the rotating speed of the first axial flow vanes, so that the rotational flow kinetic energy generated by the two groups of axial flow vanes and the rotating cage is used to discharge the separated materials from the air outlet. The self-air-supply purpose of the powder concentrator is achieved, the pressure value at the inlet of the system fan is reduced, and thus the system resistance and energy consumption are reduced.
Owner:天津中材工程研究中心有限公司 +2