The fixing equipment comprises a main
polishing head, the main
polishing head comprises a pressure plate and a plurality of clamping blocks installed in the circumferential direction of the pressure plate, a
ceramic disc is arranged on one side of the pressure plate in an abutting mode, and the clamping blocks abut against the circumferential direction of the
ceramic disc. A plurality of wafers are evenly arranged on the side, away from the pressure plate, of the
ceramic disc, a pressurizing
assembly is arranged in the pressure plate and comprises a pressurizing hole, a
piston structure, a pressurizing plate, a cover plate and an air inlet
nozzle, the pressurizing hole is formed in the center of the pressure plate and penetrates through the pressure plate, and the
piston structure is arranged in the pressurizing hole in a sliding mode; the
piston structure blocks the pressurizing hole, the pressurizing plate is installed on the side, facing the ceramic disc, of the piston structure, the cover plate is installed on the pressure plate on the side, away from the ceramic disc, of the pressure plate, the pressurizing hole is closed by the cover plate, and the air inlet
nozzle is installed on the cover plate and communicated with the pressurizing hole. The method has the effect of improving the flatness of the surface of the
wafer.