11 results about "Continuous wave laser beam" patented technology

The present invention discloses a system and method for fabricating a double-ring structure in one step based on laser direct writing. The system includes a continuous laser, a beam expansion system, an attenuation plate, a half-wave plate, an optical shutter, a spectrometer, an oil-immersion objective lens, and a positive-negative adjustable photoresist sample arranged along an optical path; further includes a three-dimensional high-precision nanopositioning translation stage, a lens, a CCD camera, and a computer; the spectrometer focuses an incident continuous-wave laser beam onto the surface of the positive-negative adjustable photoresist sample via the oil-immersion objective lens, and a portion of the laser beam incident on the sample surface is reflected back onto the spectrometer and then irradiated onto a third lens; the oil-immersion objective lens focuses the laser beam onto the sample, thereby fabricating the double-ring structure in one step. The present invention can obtain the double-ring structure in one step through a single process at a lower cost, rather than through two or more cumbersome steps; and the inner and outer diameters of the desired double-ring structure can be flexibly changed by changing the power density and the direct writing time.

The invention relates to a method (100) for treating a surface (S) of a sample (SAM) made of metallic or ceramic material (MM), comprising a treatment step (ETAt) consisting of scanning said surface (S) to be treated with a continuous wave laser beam called the treatment laser beam (LBT) having a treatment power (Pt) and a treatment spot (ST) on said surface, the treatment spot having a diameter (DST) called the treatment diameter, said treatment spot moving at a scanning speed (vt) called the treatment speed on said surface, the treatment diameter (DST) being less than or equal to 100 µm, the treatment power (Pt), the treatment diameter (DST) and the treatment scanning speed (vt) being determined such that a point on the surface of said sample receives a treatment surface energy density (Est) determined such that the material (MM) of the sample at this point reaches a melting temperature,the treatment process being carried out under an inert atmosphere or under vacuum. No figure.,

Embodiments disclosed herein relate to measuring thermal properties. At least one embodiment includes a method including heating a location of an object with an excitation laser beam, the excitation laser beam being a continuous-wave laser beam modulated by a square-wave modulation waveform. The method may also include measuring temperature at the location over time by measuring changes in one or more reflective properties at the location. Related apparatuses are also disclosed.

The invention relates to a treatment method for treating (100) a surface (S) of a sample (SAM) made of metal or ceramic material (MM), the method comprising a treatment step (ETAt) consisting in scanning the surface (S) to be treated with a continuous wave laser beam referred to as the treatment laser beam (LBT) having a treatment power (Pt) and a treatment spot (ST) on the surface, wherein the treatment spot has a diameter (DST) referred to as the treatment diameter, and wherein the treatment spot moves at a scanning speed (vt) referred to as the treatment scanning speed on the surface; - wherein the treatment diameter (DST) is less than or equal to 100 µm; - wherein the treatment power (Pt), the treatment diameter (DST) and the treatment scanning speed (vt) are determined such that a point on the surface of the sample receives a treatment surface energy density (Est) determined such that the material (MM) of the sample at this point reaches a melting temperature; - and wherein the treatment method is carried out under an inert atmosphere or under vacuum.

To acquire both of molecular information and element information from the same portion of a measurement sample with a single analysis device.SOLUTION: A spectroscopic analysis device for spectroscopic analysis of light that is generated by irradiating a measurement sample with laser light, comprises: a first laser light source to emit a continuous wave laser beam; a second laser light source to emit a pulse laser beam; a radiation optical system for guiding the laser beam emitted from the respective laser light sources to the measurement sample to irradiate the measurement sample therewith; a spectroscopic detection optical system for spectrally decomposing the light generated at the measurement sample irradiated with the laser beam and detecting a spectrum; a spectrum analysis unit for analyzing the spectrum on the basis of the detected spectrum; and an analysis mode switching unit which switches the radiation optical system between the first laser light source and the second laser light source, thus switching between a first analysis mode in which Raman scattered light which is generated by irradiating the measurement sample with the continuous wave laser beam is spectrally analyzed, and a second analysis mode in which emitted light from plasma which is generated by irradiating the measurement sample with the pulse laser beam is spectrally analyzed.SELECTED DRAWING: Figure 1

The present invention relates to a system (10) for processing and characterizing a sample, the system comprising: a scanning electron microscope (SEM) comprising: a chamber (Ch), a device (COL) configured to generate an electron beam (FE) and focus the electron beam onto the sample, at least one first detector (Det), a laser source (LAS) configured to generate a continuous wave laser beam (FL), a two-dimensional scanning device (DS) configured to scan the continuous wave laser beam (FL), the apparatus includes a moving device configured to move the laser beam on the sample at a defined velocity (v), a focusing device (DFOC) configured to focus the laser beam onto the sample through the window, and to modify a value of the focal length in a controlled manner, the laser source and the focusing device are configured such that a focused spot on the sample has a defined power (P) and a defined diameter (D).

A system for performing surface analysis on a material, includes a pulsed electron source that forms a monochromatic beam of incident electrons; means for conveying the incident electrons to the surface of a sample of material, so as to form backscattered electrons, and the backscattered electrons to detecting means, the conveying means comprising at least one electron optical system; means for detecting the backscattered electrons; the pulsed electron source comprising: a source of atoms; a continuous-wave laser beam configured to form a laser excitation zone able to excite the atoms to Rydberg states; a pulsed electric field on either side of the laser excitation zone, the pulsed electric field being configured to ionize at least the excited atoms and to form a monochromatic beam of electrons.

An additive manufacturing process for producing an object from a powder includes directing a pulsed-mode laser beam onto the surface of a powder material layer, and simultaneously directing a continuous-wave laser beam onto the surface of the powder material layer to form the object. The powder material layer includes a ceramic powder.

Provided is a coating removal device for removing an insulating coating on a surface of a conductor, the coating removal device comprising: a Galvano scanner for scanning and irradiating an object region of the conductor with a continuous wave laser beam; a gas injection mechanism for blowing an oxygen-containing gas and a blow gas to the object region of the conductor; and a control device for controlling the Galvano scanner and the gas injection mechanism so as to execute a step for oxidizing the insulating coating by scanning and irradiating the object region with the continuous wave laser beam while blowing the oxygen-containing gas to the object region, and a step for removing an oxide of the insulating coating by scanning and irradiating the object region with the continuous wave laser beam while blowing the blow gas to the object region.

One embodiment of the present application provides a measurement system capable of measuring a three-dimensional shape and vibration of an object with a simple configuration. A measurement system according to one embodiment of the present application includes a laser light source that outputs a frequency-modulated continuous wave laser beam, a laser scanner that scans an object with the frequency-modulated continuous wave laser beam, an interferometer that splits the frequency-modulated continuous wave laser beam into a reference light and a measurement light, inputs reflected lights of the reference light and the measurement light reflected on the object, and causes the reflected lights to interfere with each other, a shape measurer that measures a three-dimensional shape of the object based on a center frequency of a beat signal obtained through the interference, an FM demodulator that FM-demodulates a signal obtained through the interference to detect an FM sideband, and a vibration measurer that measures a vibration of the object based on the FM sideband obtained through the detection.

The invention relates to a method for treating (100) a surface (S) of a sample (SAM) made of metallic or ceramic material (MM), comprising a treatment step (ETAt) consisting of scanning said surface (S) to be treated with a continuous wave laser beam called the treatment laser beam (LBT) having a treatment power (Pt) and a treatment spot (ST) on said surface, the treatment spot having a diameter (DST) called the treatment diameter, said treatment spot moving at a scanning speed (vt) called the treatment speed on said surface, the treatment diameter (DST) being less than or equal to 100 µm, the treatment power (Pt), the treatment diameter (DST) and the treatment scanning speed (vt) being determined so that a point on the surface of said sample receives a determined surface energy density (Est) such that the material (MM) of the sample at that point reaches a melting temperature,The treatment process is carried out under an inert atmosphere or under vacuum. No figure.