4 results about "Transformation optics" patented technology

The invention discloses a nonlinear lens based on a transformation material and a Kerr effect and a design method, and belongs to the field of optical signal processing and transformation materials. The nonlinear lens is a rectangular lens and is made of a nonlinear material. The spatial refractive index distribution is designed by changing the optical principle, the path instability in a dynamic system is combined with the optical Kerr effect, and the circular lens is adjusted into the square lens with the unstable system path by utilizing the spatial distribution of special material parameters; the weak refractive index change is converted into violent offset of a light beam output position under the instability characteristic of a dynamic system, and under the specific refractive index distribution, the lens has a focusing effect on the light beam propagating in the lens, so that the light beam is enhanced in a local area, and then the nonlinear effect is enhanced; and an optical system with higher speed and lower energy consumption is realized on a simpler device. According to the invention, conformal transformation is adopted, the isotropy of a lens material is ensured, and manufacturing of a nonlinear lens is facilitated.

This invention relates to a method and system for fabricating an ultra-small AWG chip, comprising: using ICP-VD technology on a silicon substrate to controllably grow a low-stress, low-optical-absorption silicon nitride thin film by adjusting plasma power and gas flow rate; covering the silicon nitride thin film with a hybrid mask, and determining a reactive ion etching combination with a primary etching gas and an auxiliary passivation gas according to a target volume ratio; etching the silicon nitride thin film based on the reactive ion etching combination to form a silicon nitride waveguide structure with a sidewall roughness less than a preset roughness threshold; adjusting the thickness and width of the waveguide to achieve a design goal of ultra-thin and ultra-wide waveguide compatible with single-mode transmission characteristics and low bending loss, and designing the bending transition section of the waveguide as a gradually curved structure by transforming optical principles; integrating the designed waveguide into the AWG chip in a preset array configuration, and using a Rowland circle overlapping lithography to compress the overlapping area between the input and output waveguides in the array.

The invention relates to a microminiature AWG chip manufacturing method and system, and the method comprises the steps: employing an ICPCVD technology on a silicon substrate, and carrying out the controllable growth of a low-stress and low-optical-absorption silicon nitride film through adjusting the plasma power and gas flow; covering the mixed mask on the silicon nitride film, and determining a reactive ion etching combination which takes a main etching gas as an auxiliary passivation gas according to a target volume ratio; the silicon nitride thin film is etched based on the reactive ion etching combination, and a silicon nitride waveguide structure with the side wall roughness smaller than a preset roughness threshold value is formed; the thickness and width of the waveguide are adjusted under the design target of the ultrathin and ultra-wide waveguide compatible with the single-mode transmission characteristic and the low bending loss, and the bending transition section of the waveguide is designed into a gradually-changed bending structure by changing the optical principle; and integrating the designed waveguides in an AWG chip according to a preset array form, and compressing an overlapping region between the input waveguide and the output waveguide in the array by adopting Rowland circle overlapping layout.

This invention proposes a rapid prediction method for the curing process of composite materials based on transformation optics. By introducing transformation optics theory and utilizing equivalent transformations of material parameters, the method maintains the stability of electromagnetic fields, temperature fields, and stress-strain fields when the thickness of the composite material in the simulation model is artificially increased. This reduces the spatial scale differences of components in the simulation model, decreases the number of meshes and computational complexity, and shortens the simulation time. While ensuring computational accuracy, it achieves rapid prediction of the composite material curing process (curing parameters).