31results about How to "Increase carbon concentration" patented technology

A method of forming a conformal dielectric film having Si—N bonds on a semiconductor substrate by plasma enhanced chemical vapor deposition (PECVD) includes: introducing a nitrogen- and hydrogen-containing reactive gas and a rare gas into a reaction space inside which a semiconductor substrate is placed; applying RF power to the reaction space; and introducing a hydrogen-containing silicon precursor as a first precursor and a hydrocarbon gas as a second precursor in pulses into the reaction space wherein a plasma is excited, thereby forming a conformal dielectric film doped with carbon and having Si—N bonds on the substrate.

Material for forming an underlayer film for lithography, which has a high carbon concentration, a low oxygen concentration, a relatively high heat resistance and also a relatively high solvent solubility, and which can be applied to a wet process is disclosed. Material for forming an underlayer film for lithography contains a compound represented by general formula (1).

A semiconductor device has at least two main carbon-rich regions and two additional carbon-rich regions. The main carbon-rich regions are separately located in a substrate so that a channel region is located between them. The additional carbon-rich regions are respectively located underneath the main carbon-rich regions. The carbon concentrations is higher in the main carbon-rich regions and lower in the additional carbon-rich regions, and optionally, the absolute value of a gradient of the carbon concentration of the bottom portion of the main carbon-rich regions is higher than the absolute value of a gradient of the carbon concentration of the additional carbon-rich regions. Therefore, the leakage current induced by a lattice mismatch effect at the carbon-rich and the carbon-free interface can be minimized.

There is provided a method of manufacturing a semiconductor device, including: forming a film containing a specific element, nitrogen, and carbon on a substrate, by alternately performing the following steps a specific number of times: a step of supplying a source gas containing the specific element and a halogen element, to the substrate; and a step of supplying a reactive gas composed of three elements of carbon, nitrogen, and hydrogen and having more number of a carbon atom than the number of a nitrogen atom in a composition formula thereof, to the substrate.

The aromatic hydrocarbon resin can be used as a coating material and a resist resin for a semiconductor, and has a high carbon concentration and a low oxygen concentration. A composition for forming an underlayer film for lithography that has excellent etching resistance as an underlayer film for a multilayer resist process, an underlayer film formed with the same, and a pattern forming method using the same are disclosed. An aromatic hydrocarbon is reacted with an aromatic aldehyde in the presence of an acidic catalyst, thereby providing an aromatic hydrocarbon resin that has a high carbon concentration of from 90 to 99.9% by mass and a low oxygen concentration of from 0 to 5% by mass. A composition for forming an underlayer film for lithography contains the resin and an organic solvent, an underlayer film is formed with the same, and a pattern forming method uses the same.

Methods for fabricating semiconductor devices may provide enhanced performance and reliability by recovering quality of a low-k insulating film damaged by a plasma process. A method may include forming a first interlayer insulating film having a trench therein on a substrate, filling at least a portion of the trench with a metal wiring region, exposing a surface of the metal wiring region and a surface of the first interlayer insulating film to a plasma in a first surface treatment process, then exposing the surface of the first interlayer insulating film to a recovery gas containing a methyl group (—CH3) in a second surface treatment process, and then forming an etch stop layer on the metal wiring region and the first interlayer insulating film.

An improved SIV resistance and an improved EM resistance are achieved in the coupling structure containing copper films. A semiconductor device includes: a semiconductor substrate; a second insulating layer formed on or over the semiconductor substrate; a second barrier metal film, formed on the second insulating film, and being capable of preventing copper from diffusing into the second insulating film; and an electrically conducting film formed on the second barrier metal film so as to be in contact with the second barrier metal film, and containing copper and carbon, wherein a distribution of carbon concentration along a depositing direction in the second electrically conducting film includes a first peak and a second peak.

The invention provides a rapid carburizing heat treatment process for a driving gear used in an automobile differential, comprising the following steps: 1) heating up; 2) strong infiltration; 3) diffusion; 4) quenching; 5) cleaning; 6) tempering. The carburizing period of the treatment process is obviously shortened, the production efficiency is improved, the output is increased, the energy saving effect is achieved, the carburizing cost is obviously reduced, and the economic benefit is significantly improved.

To reduce ungrown region or abnormal grain growth region in growing a Group III nitride semiconductor through a flux method. A seed substrate has a structure in which a Group III nitride semiconductor layer is formed on a ground substrate as a base, and a mask is formed on the Group III nitride semiconductor layer. The mask has a plurality of dotted windows in an equilateral triangular lattice pattern. A Group III nitride semiconductor is grown through flux method on the seed substrate. Carbon is placed on a lid of a crucible holing the seed substrate and a molten mixture so that carbon is not contact with the molten mixture at the start of crystal growth. Thereby, carbon is gradually added to the molten mixture as time passes. Thus, ungrown region or abnormal grain growth region is reduced in the Group III nitride semiconductor crystal grown on the seed substrate.

A surface-treated mold that includes a mold, a metal layer that is provided on a surface of the mold and contains at least one metal selected from nickel, chromium, tungsten and brass, and a carbon film that is provided on a surface of the metal layer, wherein the metal layer contains carbon, and the carbon concentration in the metal layer is higher between the boundary with the carbon film and the center of the metal layer than that between the boundary with the mold and the center of the metal layer.

The present application relates to a cyclic carburizing treatment method for a carburized layer on the surface of a heavy-duty gear. The surface of the gear to be treated is bombarded with supersonic particles before the gear to be treated is subjected to vacuum carburizing treatment, so that the surface of the gear to be treated is subjected to compound catalytic infiltration. The treatment causes plastic deformation on the surface of the gear to be treated, forming a composite modified layer with fine grains and many grain boundaries, which facilitates the diffusion and penetration of carbon atoms into the surface of the gear to be treated. After completing a cyclic carburizing cycle of composite catalysis-vacuum carburizing, by repeatedly performing multiple cyclic carburizing cycles of composite catalysis-vacuum carburizing, the surface of the gear to be treated generates a higher carbon concentration, a larger thickness, Carburized layer with strong surface hardness. The cyclic carburizing treatment method for the surface carburizing layer of a heavy-duty gear involved in the present application can obtain a higher carbon concentration, greater thickness, and greater surface strength and hardness in a relatively short period of time compared with the traditional atmosphere carburizing method. Carburized layer to meet the service requirements of heavy-duty gears.

An embodiment of the invention discloses a carburization processing method. Composite carburization is adopted in the carburization processing method. First a workpiece is placed in a carburization medium of 900-980 DEG C, thermal insulation and cooling are carried out, then the workpiece is continuously placed in the carburization medium of 900-980 DEG C, and thermal insulation is performed. After carburization for the first time, the surface of the workpiece has a certain carbon concentration distribution and macroscopic thickness. Meanwhile, carburization for the second time in the step (b) is utilized to improve carbon concentration of the surface of the workpiece, and accordingly macrohardness and surface hardness of the surface of the workpiece are improved. Experimental results show that the macroscopic thickness of the workpiece processed by the method is 0.78-1mm, and the hardness at the position of 0.15mm is larger than 700HV.