The application provides a method for preparing an ultrasonic
transducer for transparent rigid piezoelectric material. The method first cuts from the piezoelectric layer side of the piezoelectric
wafer with a transparent matching layer, leaving a certain
thin layer without
cutting through completely, to provide overall mechanical support and ensure that the array elements are arranged at a predetermined interval. Then, a transparent organic elastic material is injected into the
array element gap, and the support after solidification further fixes the
array element position to realize precise bonding of high-density array elements and flexible circuit electrodes. In the subsequent
cutting through of the remaining
thin layer, the array elements are effectively supported by the transparent elastic material and are not easily damaged, thereby significantly improving the process reliability and
array element yield. The method effectively protects the brittle piezoelectric material and supports the manufacture of high-density, large-array flexible arrays. The obtained device realizes high flexibility with the aid of the transparent elastic material in the array element gap and the flexible circuit; and high sensitivity ultrasonic performance is obtained through the design of the double-layer matching layer and the backing.