3results about How to "Make it wearable" patented technology

The utility model relates to the field of intelligent back splint terminals, in particular to a wearable intelligent back splint terminal which comprises a shell, a scanning window arranged on the shell, a scanning key, a power key, a wrist strap fixing part, a power indicator light, a Bluetooth indicator light and an infrared indicator light. A control chip, a data receiving and transmitting module, a power-off and power-on control module, a timing module, a complementary reading module, a positioning module, a Bluetooth communication module, an infrared communication module, a safety module, a bar code scanning module and a battery module are arranged in the shell, the wearable intelligent back splint terminal is wearable while achieving multiple functions, operation is more convenient, and the working efficiency is improved.

This invention provides a flexible multi-gate single-channel OECT molecularly imprinted sensor and its fabrication method, belonging to the field of flexible chemical sensor technology. This sensor employs a unique multi-gate single-channel integrated structure with gates symmetrically arranged at equal intervals around the source and drain electrodes and synergistically controlled within the same channel. Combined with MIP and OECT technologies, it possesses both high-sensitivity amplification capability and highly specific recognition of three non-electroactive BCAAs (leucine, isoleucine, and valine), enabling the detection of multiple substances with a single device.

The application provides a method for preparing an ultrasonic transducer for transparent rigid piezoelectric material. The method first cuts from the piezoelectric layer side of the piezoelectric wafer with a transparent matching layer, leaving a certain thin layer without cutting through completely, to provide overall mechanical support and ensure that the array elements are arranged at a predetermined interval. Then, a transparent organic elastic material is injected into the array element gap, and the support after solidification further fixes the array element position to realize precise bonding of high-density array elements and flexible circuit electrodes. In the subsequent cutting through of the remaining thin layer, the array elements are effectively supported by the transparent elastic material and are not easily damaged, thereby significantly improving the process reliability and array element yield. The method effectively protects the brittle piezoelectric material and supports the manufacture of high-density, large-array flexible arrays. The obtained device realizes high flexibility with the aid of the transparent elastic material in the array element gap and the flexible circuit; and high sensitivity ultrasonic performance is obtained through the design of the double-layer matching layer and the backing.