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135results about How to "Precise motion control" patented technology

Active driving ankle foot orthosis with plantar pressure detection function

ActiveCN104083237APrevent foot dropEffectively provide powerMedical scienceAccelerometerGear wheel
The invention discloses an active driving ankle foot orthosis with a plantar pressure detection function. The active driving ankle foot orthosis comprises a shank fixing component, a foot sensing component and an active driving component. The active driving component drives a driving bevel gear through a direct current motor; the driving bevel gear is meshed with a driven bevel gear; the driven bevel gear is mounted on a transmission shaft; a synchronous pulley, a synchronous belt and a tensioning screw are respectively formed at two ends of the transmission shaft. Seven film pressure sensors and an accelerometer are arranged in the foot sensing component. The active driving ankle foot orthosis has the advantages that on one hand, an intelligent pressure sensing foot is designed according to body bionics, a sensing heel and a sole are mutually connected through a spring steel sheet, the segmented structure of a human foot is simulated, and toes and the sole can be freely bent during walking, and on the other hand, active driving free degree is designed on the sagittal plane of an ankle joint, foot drop of a patient is prevented, meanwhile, power for the patient to go ahead is effectively provided through the driving of the direct current motor, and the walking load of the patient is reduced.
Owner:BEIHANG UNIV

Integrated active-passive compliant one-dimensional variable force grinding and polishing device and control method

The invention belongs to the technical field of intelligent processing and manufacturing, and particularly discloses an integrated active-passive compliant one-dimensional variable force grinding andpolishing device and a control method. The integrated active-passive compliant one-dimensional variable force grinding and polishing device comprises a linear module servo motion platform, a mountingflange, a limiting plate, a position and orientation sensor, a speed-adjustable compliant grinding and polishing mechanism and a controller, and the linear module servo motion platform is used for driving the grinding and polishing mechanism to perform linear motion; the mounting flange and the limiting plate are mounted on a base of the linear module servo motion platform, and the position and orientation sensor and the speed-adjustable compliant grinding and polishing mechanism are installed on the limiting plate; and the position and orientation sensor is used for measuring position and orientation of the one-dimensional variable force grinding and polishing device and sending the position and orientation to the controller, a force sensor is arranged between the compliant grinding and polishing mechanism and sliding blocks, the force sensor is used for collecting a contact force signal and send to the controller which can calculate speed control quantity, and the speed-adjustable compliant grinding and polishing mechanism is driven to move by rotation of a servo motor according to the speed control quantity. According to the integrated active-passive compliant one-dimensional variable force grinding and polishing device and the control method, the contact status of a abrasive belt and a workpiece can be adjusted in real time, and a stable and compliant grinding and polishingprocess is realized.
Owner:HUAZHONG UNIV OF SCI & TECH

Laser navigation AGV high-precision positioning and target alignment control method

ActiveCN111352420ASolve the problem of high precision positioningSmooth motion controlPosition/course control in two dimensionsVehiclesEngineeringMotion controller
The invention discloses a laser navigation AGV high-precision positioning and target alignment control method, and relates to the technical field of mobile robot navigation. Point cloud segmentation and extraction is performed on the target environment features based on the laser point cloud to realize the capability of the AGV to acquire the target feature point cloud in real time; based on a nearest neighbor method, the problems of finding corresponding points in point cloud matching and establishing a target function are solved; a multi-resolution search matching method based on gradient point cloud density is designed, and branch and bound optimization search is carried out. High-precision and low-delay matching of the AGV for the target feature point cloud is realized, and the problemof high-precision positioning of the laser navigation AGV at a specific task point is solved; based on an AGV smooth motion controller, the capability of AGV smooth and accurate motion control to reach a target point is realized. The problems of laser navigation AGV high-precision positioning, pose alignment, charging butt joint and other target alignment control are solved, and the defects thatthe positioning precision of the SLAM technology is insufficient, and a traditional alignment control method is too high in cost are overcome.
Owner:XIAMEN UNIV +1

Automatic dielectric material surface charge measuring device on basis of two-axis slide table

The invention discloses an automatic dielectric material surface charge measuring device on the basis of a two-axis slide table, and belongs to the field of solid dielectric material surface charge measurement. The automatic dielectric material surface charge measuring device comprises the two-axis movement slide table, an electrometer probe support, a high-voltage electrode support and an upper PC (personal computer). A dielectric test specimen support is connected with the two-axis movement slide table and can be driven by the two-axis movement slide table to move in a plane; the electrometer probe support and the high-voltage electrode support are arranged in an upper space of the movement plane of the dielectric test specimen support; the upper PC is in communication connection with the two-axis movement slide table, the electrometer probe support and the high-voltage electrode support, and surface charge detection can be carried out on test specimens on the dielectric test specimen support by the two-axis movement slide table, the electrometer probe support and the high-voltage electrode support under the control of the upper PC. Compared with the prior art, the automatic dielectric material surface charge measuring device has the advantages that the automatic dielectric material surface charge measuring device is easy to operate and accurate in movement control; acquireddata can be processed in real time, and surface charge distribution conditions of materials can be visually displayed by the aid of software.
Owner:SICHUAN UNIV

Wafer bonding process for transferring multiple wafers at one time

The invention discloses a wafer bonding process for transferring multiple wafers at one time. The process comprises a step of arranging the wafers in an array form and bonding the wafers on an adhesive layer base film with a cross-linking property on the surface, a step of obtaining the position information of at least two wafers which are to be transferred and are in a linear continuous arrangement, a step of pressing the at least two wafers which are to be transferred and are in a linear continuous arrangement by using a vacuum suction nozzle device in a direction from the wafers to the basefilm such that an adhesive layer on the base film loses viscosity, a step of starting the negative pressure of the vacuum suction nozzle device and sucking the at least two wafers which are to be transferred and are in a linear continuous arrangement on the base film which loses viscosity after the adhesive layer on the base film loses viscosity, and a step of lifting the vacuum suction nozzle device and integrally moving the at least two wafers which are to be transferred and are in a linear continuous arrangement to a substrate which is provided with a pad coated with a viscous material. According to the invention, a row of wafers can be transferred at a time, the transfer efficiency is doubled, and the time required for transferring chips is reduced.
Owner:SHENZHEN FONTAI IND TECH CO LTD
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