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34results about How to "Will not affect the process" patented technology

Verification method and verification system for surgical operation tool

The invention provides a verification method and verification system for a surgical operation tool. The verification method comprises the following steps of: acquiring virtual characteristics of a characteristic part of the surgical operation tool by using non-contact equipment; acquiring coordinates of a tool target in a base coordinate system, and fitting to obtain a tool target coordinate system; acquiring a pose parameter of the virtual characteristic in the tool target coordinate system to obtain a pose parameter of the characteristic part in the tool target coordinate system; comparing an error value between the pose parameter of the characteristic part in the tool target coordinate system and a standard parameter; and, if the error value is greater than the expected value, determining that the surgical operation tool deforms. Due to the configuration, the disinfection step is omitted; the infection risk in the operation is reduced; the operation process is not influenced; the device is free of extra abrasion to the surgical operation tool, good in universality and capable of adapting to various surgical operation tools of different forms; and the non-contact equipment of thedevice cannot be adjusted.
Owner:SUZHOU MICROPORT ORTHOBOT CO LTD

Integrated full-automatic boxing system

The invention relates to an integrated full-automatic boxing system. The integrated full-automatic boxing system comprises box feeding units, a roller conveying line, a finished box pushing-in unit, a box expanding unit, a box wing folding unit and a box bundling unit. The two box feeding units are symmetrically arranged. Finished boxes are conveyed to an inlet of the box expanding unit through the roller conveying line, and a box plate unit is arranged at the other inlet of the box expanding unit. After the box plate unit conveys box plates into the box expanding unit, box bodies are expanded and pushed into the stacked finished boxes. After cover plates of the box bodies are folded in half through the box wing folding unit, the cover plates are fed in the box bundling unit to be packaged. The system is stable in performance, reliable in quality, high in applicability and packaging efficiency and long in service life. Machine parts are precise and durable in performance, the structural design is strict, vibration is avoided in the running process, and running is stable and reliable. The automation degree is high, automatic box opening, automatic cover plate folding and automatic packaging are achieved, operation is greatly facilitated, and the integrated full-automatic boxing system is an unnecessary device for automatic large-scale production.
Owner:天津惠坤诺信包装设备有限公司

Chip encapsulation structure, manufacture method thereof and electrostatic powder spraying device

The present invention provides a chip encapsulation structure, a manufacture method thereof and an electrostatic powder spraying device. The chip encapsulation structure includes a circuit substrate, an adhesive layer arranged on the circuit substrate, and a chip arranged on the adhesive layer; and the side wall of the chip is provided with a non-stick material layer. The manufacture method of the chip encapsulation structure includes the following steps that: a chip for encapsulation is provided; a non-stick material layer is arranged on the side wall of the chip; a circuit substrate for carrying the chip is provided; an adhesive layer is arranged on the circuit substrate; the chip is arranged on the adhesive layer, and the bottom of the chip is completely covered with the adhesive layer; and the adhesive layer is heated, so that the adhesive layer can be cured. According to the chip encapsulation structure, the manufacture method thereof and the electrostatic powder spraying device of the invention, the non-stick material layer is arranged on the side wall of the chip, so that the overflowed adhesive layer will not adhere to the upper surface of the chip, and therefore, the malfunctioning of the chip can be avoided, the reliability of the chip can be ensured, and the quality of the chip encapsulation structure can be improved.
Owner:SEMICON MFG INT TIANJIN +1

Novel flame-retardant hollow wallboard and preparation method thereof

The invention discloses a novel flame-retardant hollow wallboard and a preparation method thereof. The preparation method comprises the steps that extrusion is conducted through a hollow board extruder, concave portions and convex portions are arranged alternately on the upper surface and the lower surface of a hollow board, the concave portions of the upper surface and the lower surface are filled with magnesium powder paste and sealed, two layers of glass fiber gridding cloth are laid on the upper surface and the lower surface correspondingly, and screeding is conducted on the magnesium powder paste; and in addition, supporting racks are additionally arranged in the interior hollow space. According to the flame-retardant hollow wallboard, on the premise that the partition function of the wallboard is guaranteed, the light weight property, the sound insulation property, the anti-aging property, the thermal insulation property, the flame-retardant property and the like are improved, the cost can be reduced, and the environment protection requirements of sustainable development are met. The preparation method of the flame-retardant hollow wallboard is simple and can be widely used for building wall construction under various conditions, and industrialization can be achieved easily.
Owner:无锡市天聚科技有限公司

Chip package structure and manufacturing method thereof, electrostatic powder coating device

The present invention provides a chip encapsulation structure, a manufacture method thereof and an electrostatic powder spraying device. The chip encapsulation structure includes a circuit substrate, an adhesive layer arranged on the circuit substrate, and a chip arranged on the adhesive layer; and the side wall of the chip is provided with a non-stick material layer. The manufacture method of the chip encapsulation structure includes the following steps that: a chip for encapsulation is provided; a non-stick material layer is arranged on the side wall of the chip; a circuit substrate for carrying the chip is provided; an adhesive layer is arranged on the circuit substrate; the chip is arranged on the adhesive layer, and the bottom of the chip is completely covered with the adhesive layer; and the adhesive layer is heated, so that the adhesive layer can be cured. According to the chip encapsulation structure, the manufacture method thereof and the electrostatic powder spraying device of the invention, the non-stick material layer is arranged on the side wall of the chip, so that the overflowed adhesive layer will not adhere to the upper surface of the chip, and therefore, the malfunctioning of the chip can be avoided, the reliability of the chip can be ensured, and the quality of the chip encapsulation structure can be improved.
Owner:SEMICON MFG INT TIANJIN +1

Installation and construction technology of large-diameter hdpe plastic-steel winding pipe

The invention discloses a large-diameter HDPE plastic steel winding pipeline installation construction process. The problems that a heat shrinkable tape anticorrosion repaired mouth is baked mainly though artificial flame, and especially for a large-diameter pipeline, heating is nonuniform during construction are solved. According to the main points of the technical scheme, the inside and the outside of a connector between pipelines is welded and sealed through a heat shrinkable tape; heat shrinkable tape welding and sealing comprise the steps that preheating is conducted through manual target baking heating till the temperature of the pipeline connector is 50 DEG C-70 DEG C; epoxy primer with the thickness not smaller than 150 [mu]m is brushed on the pipeline connector evenly; the rubber face of the heat shrinkable tape is attached to the outer side face of the pipeline connector; and annular heating equipment is installed on the outer side of a pipeline repaired mouth, and the repaired mouth is heated and based till complete fusion is achieved; and a good adhesion effect is ensured, thus the service life of the heat shrinkable tape is longer, zero leakage of the pipelines is achieved, fluid in the pipelines does not flow out, and a better environmental protection effect is archived.
Owner:ZHEJIANG MINGTONG CONSTR ENG CO LTD

Rotor structure of three-phase asynchronous motor

The invention relates to a rotor structure of a three-phase asynchronous motor. The rotor structure comprises a cast-aluminum rotor main body, wherein an iron core is arranged in the middle of the cast-aluminum rotor main body, and overlapped rotor punching is arranged outside the iron core. The rotor structure is characterized in that the cast-aluminum rotor main body is symmetrically divided into a left rotor and a right rotor from the middle part; connecting parts are arranged on opposite sides of the left rotor and the right rotor respectively; and the left rotor and the right rotor are connected through the connecting parts. The rotor structure of the three-phase asynchronous motor is simple in structure, and the iron core is divided into two sections, so that the length is shortened; two sections of the cast-aluminum rotor are combined after processed, so that the cast-aluminum process cannot be influenced and can be controlled well; and further, the cost is low, and the qualified rate is high.
Owner:WUXI ZHONGDA MOTORS

Industrial solid waste crushing and cleaning equipment and operation method thereof

The invention belongs to the technical field of solid waste crushing and cleaning, and particularly relates to industrial solid waste crushing and cleaning equipment and an operation method thereof. The equipment comprises a shell and a water storage box; the bottom end of the shell is fixedly connected with a group of supporting columns; a feeding cylinder is arranged at the top end of the shell;a crushing box is fixedly connected to the inner side wall of the top end of the shell; the crushing box communicates with the feeding cylinder; a crushing mechanism is arranged in the crushing box;the bottom end of the crushing box is fixedly connected with a cleaning box; the cleaning box communicates with the crushing box through a first filter screen; a cleaning mechanism is arranged in thecleaning box; a second filter screen is hinged to the side wall of the bottom end of the cleaning box; and an electric telescopic rod is hinged to the bottom end, away from the hinged end, of the second filter screen. According to the industrial solid waste crushing and cleaning equipment and the operation method thereof, the problems that solid waste crushing cannot reach the crushing standard, the crushed material cleaning effect is low, cleaning is not thorough enough, consequently, subsequent procedure treatment of the solid waste is troublesome and the efficiency is not high are solved.
Owner:沈会琼

Non-contact particle size analyzer and application method thereof

The invention discloses a non-contact particle size analyzer and an application method thereof, the non-contact particle size analyzer comprises a purging device, a signal acquisition device, a data analysis processing unit and an electrical connection unit, the signal acquisition device comprises a sensor and a radiator, the purging device is connected to the sensor, and the data analysis processing unit is connected to the radiator. The sensor is connected with the data analysis processing unit, the data analysis processing unit is connected with the electrical connection unit, and the electrical connection unit is connected with the power cable and the signal output cable. Based on a particulate matter electrostatic induction measurement core technology of a fluid/statistical model and digital signal processing, the system has an ultra-wide dynamic range and ultra-strong anti-interference capability; under the condition that the measurement requirement is met, any part of the sensor does not need to extend into the valve, and online installation and online maintenance can be realized; the non-contact measurement is realized, the sensitivity and the safety are ultrahigh, and the process is not influenced under the condition that the measurement accuracy is ensured; the adaptability is high.
Owner:杭州科灵威识精密仪器有限公司
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