The invention discloses a miniaturized photoelectric oscillator
chip based on SIP packaging technology, comprising a photoelectric oscillator
optical module, a photoelectric oscillator electrical module and a
metal ceramic shell for packaging; the components of the
optical module are sintered on a gold-plated surface by a
gasket. On the bottom surface of the housing, the components of the electrical module are sintered on the bottom surface of the gold-plated housing by digging holes in the
microstrip plate, and transmit signals through the
microstrip plate; the
optoelectronic oscillator chip presents modular isolation, and the
optical module and the electrical module are isolated by a
metal partition , and the light-absorbing material and the wave-absorbing material are respectively coated on the outside of the partition. Signals such as power supply and output of the
optoelectronic oscillator chip are transmitted through the pins of the
Ceramic Quad Flat Package (CQFP). The invention utilizes the SIP packaging technology to realize the chip-based three-dimensional integration of the low-
phase noise photoelectric oscillator, realizes integrated, light and small, tunable,
electromagnetic compatibility design, greatly reduces the volume and weight of the photoelectric
oscillator system, and satisfies the future
radar frequency synthesis system. Modularization, high reliability,
miniaturization and other development needs.