Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

47results about How to "High speed action" patented technology

Paper packaging machine

The invention discloses a paper packaging machine comprising a rack, wherein a bottle conveying device, a bottle allocating device, a paperboard bin, a paper feeding device, a bottle driving device, a side face folding device and a press box forming device are arranged on the rack; a pneumatic constant pressure paper pushing device is installed at the paperboard bin, the pneumatic constant pressure paper pushing device comprises a paper pushing upright column, a paper pushing frame, a paper pushing transmission mechanism, a paper pushing slide block, a stop lever and a locking cylinder component; a bottle clamping prevention device is arranged on a bottle moving frame, and the bottle clamping prevention device comprises a cylinder, a sliding seat, a slide rail and a chain guide block; a mechanical page taking device is arranged between the bottle driving device and the press box forming device; and the mechanical page taking device comprises a transmission mechanism, a connecting plate, a driving shaft, a front connecting rod, a connecting rod, a back connecting rod, a page taking frame and a page taking plate. By adoption of the structure of the paper packaging machine disclosed by the invention, constant thrust can be provided for the paperboard in the paperboard bin so as to ensure the paper feeding device to stably convey the paperboard. Bottle explosion or overload damage of parts caused by bottle clamping in a bottle moving process can be avoided. High-speed page taking action can be realized.
Owner:广州市万世德智能装备科技有限公司

Reciprocating insertion device

The present invention provides a reciprocating insertion device capable of inserting contents into a large number of bag bodies in a reduced time. The reciprocating insertion device (1), in a process in which bag bodies (3) having openings (2) are conveyed in a conveying direction (T), inserts contents (4) into the openings (2). The reciprocating insertion device (1) is provided with a moving means (6) for moving, in synchronism with the speed at which the bag bodies (3) are conveyed, the contents (4) in an attitude in which the contents (4) face the bag bodies (3), an in-and-out means (8) for advancing and retracting guide horns relative to the bag bodies (3), the guide horns guiding the contents (4) to the openings (2) of the bag bodies (3), an advancing and retracting means (7) for advancing and retracting pushers relative to the bag bodies (3), the pushers pushing out the contents (4) from the moving means (6) to the openings (2) of the bag bodies (3), and a reciprocating means (9) for moving forward or in the opposite direction the in-and-out means (8) and the advancing and retracting means (7) in the conveying direction (T) at the conveying speed. In the process in which the reciprocating means (9) moves forward the in-and-out means (8) and the advancing and retracting means (7), the in-and-out means (8) and the advancing and retracting means (7) perform the following operations. That is, the operations by the in-and-out means (8) are an operation in which the in-and-out means (8) advances the guide horns until the guide horns enter the openings (2) of the bag bodies (3) and an operation in which the in-and-out means (8) retracts the guide horns from the bag bodies (3).
Owner:GUNZE LTD

Semiconductor device and process for fabricating the same

A thin stacked semiconductor device suitable for high speed operation. A plurality of specified circuits are formed on one surface of a semiconductor substrate while being arranged, and wiring and insulating layers being connected electrically with the circuits are laminated and formed sequentially in a specified pattern to form a multilayer wiring part. At the stage for forming the multilayer wiring part, a filling electrode is formed on the semiconductor substrate such that the surface is covered with an insulating film, a post electrode is formed on specified wiring at the multilayer wiring part, a first insulating layer is formed on one surface of the semiconductor substrate, the surface of the first insulating layer is removed by a specified thickness to expose the post electrode, the other surface of the semiconductor substrate is ground to expose the filling electrode and to form a through-type electrode, forward end of the through-type electrode is projected by etching one surface of the semiconductor substrate, a second insulating layer is formed on one surface of the semiconductor substrate while exposing the forward end of the through-type electrode, bump electrodes are formed on both electrodes and then the semiconductor substrate is divided to form a semiconductor device. A plurality of semiconductor devices thus obtained are stacked and secured at the bump electrodes thus manufacturing a stacked semiconductor device.
Owner:阿奇里斯科技公司

Handover and turnover device and method for tubular container end face sealing paper sheets

The invention discloses a tubular container end face sealing paper sheet transferring and overturning device which comprises a paper receiving mechanism and a paper sheet conveying mechanism, a plurality of overturning gears and suction cups are distributed on a paper receiving wheel of the paper receiving mechanism in the circumferential direction, and paper suction discs of the overturning gears and the suction cups can suck sealing paper sheets; a paper sheet conveying mechanism is arranged on the outer side of the paper receiving mechanism, and a plurality of paper suction assemblies are arranged on the paper sheet conveying mechanism; when the overturning gear, the suction cup and the paper suction assembly move to the paper sheet connecting area at the same time, the paper suction assembly delivers the sucked sealing paper sheets to the overturning gear and the suction cup. The overturning gear and the paper suction disc of the suction cup receive the sealing paper sheets delivered by the paper suction assembly, and the sealing paper sheets in the vertical state are overturned to be in the horizontal state. Through the same paper receiving mechanism, not only can the handover action of paper sheets be completed, but also the overturning of the paper sheets can be realized, and the equipment integration degree is high. The invention further discloses a connecting and overturning method of the tubular container end face sealing paper piece.
Owner:杜国锋

Semiconductor device and process for fabricating the same

A thin stacked semiconductor device suitable for high speed operation. A plurality of specified circuits are formed on one surface of a semiconductor substrate while being arranged, and wiring and insulating layers being connected electrically with the circuits are laminated and formed sequentially in a specified pattern to form a multilayer wiring part. At the stage for forming the multilayer wiring part, a filling electrode is formed on the semiconductor substrate such that the surface is covered with an insulating film, a post electrode is formed on specified wiring at the multilayer wiringpart, a first insulating layer is formed on one surface of the semiconductor substrate, the surface of the first insulating layer is removed by a specified thickness to expose the post electrode, theother surface of the semiconductor substrate is ground to expose the filling electrode and to form a through-type electrode, forward end of the through-type electrode is projected by etching one surface of the semiconductor substrate, a second insulating layer is formed on one surface of the semiconductor substrate while exposing the forward end of the through-type electrode, bump electrodes areformed on both electrodes and then the semiconductor substrate is divided to form a semiconductor device. A plurality of semiconductor devices thus obtained are stacked and secured at the bump electrodesthus manufacturing a stacked semiconductor device.
Owner:TAIWAN SEMICON MFG CO LTD

A paper wrapping machine

The invention discloses a paper packaging machine comprising a rack, wherein a bottle conveying device, a bottle allocating device, a paperboard bin, a paper feeding device, a bottle driving device, a side face folding device and a press box forming device are arranged on the rack; a pneumatic constant pressure paper pushing device is installed at the paperboard bin, the pneumatic constant pressure paper pushing device comprises a paper pushing upright column, a paper pushing frame, a paper pushing transmission mechanism, a paper pushing slide block, a stop lever and a locking cylinder component; a bottle clamping prevention device is arranged on a bottle moving frame, and the bottle clamping prevention device comprises a cylinder, a sliding seat, a slide rail and a chain guide block; a mechanical page taking device is arranged between the bottle driving device and the press box forming device; and the mechanical page taking device comprises a transmission mechanism, a connecting plate, a driving shaft, a front connecting rod, a connecting rod, a back connecting rod, a page taking frame and a page taking plate. By adoption of the structure of the paper packaging machine disclosed by the invention, constant thrust can be provided for the paperboard in the paperboard bin so as to ensure the paper feeding device to stably convey the paperboard. Bottle explosion or overload damage of parts caused by bottle clamping in a bottle moving process can be avoided. High-speed page taking action can be realized.
Owner:广州市万世德智能装备科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products