4results about How to "Large pumping capacity" patented technology

This utility model relates to the field of vacuum pump technology, specifically a reciprocating vacuum pump. It includes: a first housing with an inlet and an outlet; a first cavity formed on the first housing and connected to the inlet; a second cavity formed on the first housing and connected to the outlet; a valve plate located at the lower end of the first housing and equipped with a one-way valve; a second housing located at the lower end of the valve plate and equipped with a third cavity and a fourth cavity; the third cavity is connected to the first and second cavities via a one-way valve, and the fourth cavity is connected to the first and second cavities via a one-way valve. A cylindrical cavity is provided inside the second housing, with its two ends connected to the third and fourth cavities respectively, and a piston is slidably disposed within the cylindrical cavity. A rotatable crank and a slidable slide rod are provided inside the second housing, with a connecting rod between the crank and the slide rod, and the slide rod connected to the piston. The reciprocating motion of the piston can generate a vacuum, resulting in higher working efficiency.

The invention provides a screw vacuum pump, and belongs to the technical field of pump bodies. The screw vacuum pump solves the problem that in an existing screw vacuum pump, the length of a screw needs to be increased in order to achieve high air exhaust efficiency. The screw vacuum pump comprises a pump body, two rotors are arranged in the pump body, and the screw vacuum pump is characterized in that each rotor is provided with K spiral turns, the total length of each rotor is L, the screw pitches of the rotors from the air inlet end to the air outlet end are P1-Pi in sequence, the two rotors are respectively a left-handed rotor and a right-handed rotor, and the two rotors are meshed with each other, wherein the rotating angle of one rotor end face molded line around the rotating center is a central angle theta, the rotor has a spiral line coordinate equation, and the peripheral surface of the rotor is formed by rotating each section of curve on the end face molded line along a spiral line. According to the screw vacuum pump, the screw pitch of the rotor is adjusted according to specific requirements, the optimal screw pitch is achieved, and therefore the length of the rotor can be reduced while high air exhaust efficiency can be guaranteed.

The utility model discloses a distillation system, including controller and the distillation reation kettle, first condenser, vacuum buffer tank, air pump, second condenser and gas collection tank that are connected in proper order in series, be equipped with first pressure sensor on the distillation reation kettle, and the connecting pipeline between distillation reation kettle and first condenser is equipped with first electric control valve, and the connecting pipeline between vacuum buffer tank and air pump is equipped with second electric control valve, and air pump includes first vacuum pump and second vacuum pump, and first vacuum pump is roots vacuum pump, and second vacuum pump is reciprocating vacuum pump, first pressure sensor, first electric control valve, second electric control valve, first vacuum pump and second vacuum pump all are electric connection with controller. The utility model embodiment can realize automation and optimize distillation condition.

This application provides a wafer adsorption carrier, comprising: a first carrier body, the first carrier body including a sealing portion disposed circumferentially and a plurality of independently disposed grooves, the sealing portion being located radially outside the plurality of grooves, the plurality of grooves being uniformly distributed circumferentially on the first carrier body; wherein each groove includes a radially extending first groove and a circumferentially extending second groove, the first groove and the second groove being interconnected; and a second carrier body, the second carrier body being disposed below the first carrier body, the second carrier body including a first air channel, the plurality of grooves of the first carrier body having first suction holes at their radial ends, the plurality of first suction holes being respectively connected to the first air channel. The wafer adsorption carrier of this application can stably adsorb wafers.