7results about How to "Optimize cutting process" patented technology

The invention provides a control method for reducing wire breakage caused by insufficient cutting force, which comprises the following steps of: based on the diameter of a crystal bar, dividing the cutting depth into a plurality of equal feeding positions; in the cutting process, the machine speed and / or the wire using amount and / or the tension are / is controlled to be adjusted along with the increase of the cutting feeding position, so that the acting force of the crystal bar on the diamond wire is reduced. According to the control method for reducing wire breakage caused by insufficient cutting force, the cutting process is optimized, the technical problem that the cutting force of a diamond wire is insufficient is solved to the maximum extent, the cutting quality is improved, the wire breakage rate is reduced to 0.75% from 4.28% at present, the cutting efficiency is improved, and the production cost is reduced.

The utility model relates to a kind of hanging device, belong to safety belt hanging technical field, specifically a kind of sliding type safety belt hanging device, including H-shaped steel, further including clamping assembly and fixed component;The clamping assembly includes the U-shaped card of being arranged in H-shaped steel bottom one side, the L-shaped card is arranged in H-shaped steel bottom other side;The fixed component includes the adjusting hole of being opened in U-shaped card one end, the adjusting hole is opened with multiple;The utility model reaches the effect of convenient installation and disassembly, high security, solves the device directly in the existing device between steel column and sets up safety rope, can cause damage to steel surface, increase welding and cutting process;And safety belt hanging is mostly fixed point, when on the steel beam, cannot satisfy the demand of hanging set;If directly using the mode of safety belt around beam, around column, then lead to structure and safety belt wear seriously, security risk is big, not comply with green environmental protection concept problem.

The invention discloses an LED lamp batch type packaging method and an LED lamp, and belongs to the technical field of LED lamps, and the LED lamp batch type packaging method comprises the steps that a diffusion powder layer is bonded to a supporting plate in the environment of 100 DEG C, so that the supporting plate is provided with a first completed surface, and glue is coated on the first completed surface; bonding a fluorescent powder layer on the first finished surface in an environment of 150 DEG C, forming a second finished surface on the fluorescent powder layer, and baking for 6 hours in the environment of 150 DEG C; a plurality of LED chips are bonded on the second finished surface, a gap is formed between every two adjacent LED chips, and the LED chips are baked for 4 hours in the environment of 150 DEG C; and the gaps are filled with non-transparent white glue, the non-transparent white glue makes contact with the side walls of the LED chips, the non-transparent white glue forms a reflection wall after being cured, and packaging operation of the multiple LED lamps is completed. The height of the reflecting wall completely depends on the height of the LED chips, the fluorescent powder layer and the diffusion powder layer are both laid in a through mode, and after the LED chips are cut, the uniformity of the finished surfaces of the LED chips is kept consistent.

The invention provides a wafer cutting depth control method, a wafer cutting depth control system and a wafer scribing machine, which are used for solving the problem of insufficient cutting depth precision caused by uneven wafer thickness and uneven cutting table surface. The method comprises the following steps: firstly, establishing a fixed compensation relation value between a height measurement value of a cutting knife body and a laser distance measurement value through calibration; secondly, multiple points on the surface of the wafer are scanned through a laser range finder before cutting, and a curved surface model of the surface appearance of the wafer is fitted through an interpolation algorithm; and finally, in the cutting process, the predicted height is obtained from the curved surface model according to the coordinates of the current cutting point, and the position of the cutter body is calculated and adjusted in real time in combination with the fixed compensation relation value and the preset cutting depth. The system comprises corresponding hardware and a control module. According to the method, constant control over the cutting depth is achieved through dynamic compensation, and the precision and consistency of the cutting technology are greatly improved.

The utility model provides a multi-face turnover mechanism which comprises a displacement device and a fixing device, and the displacement device controls the fixing device to move in the horizontal direction perpendicular to a workpiece and the vertical direction. The fixing device comprises a rotating device driven by an independent motor, the rotating device is of a two-semicircular-ring structure, a workpiece hole is formed in the center of the two-semicircular-ring structure, a clamping device driven by hydraulic pressure is arranged on the inner wall of the two-semicircular-ring structure, and a workpiece is clamped through the clamping device after penetrating through the workpiece hole to enter the multi-face overturning mechanism. The rotating motor drives the rotating device to drive the workpiece to rotate. According to the multi-face turnover mechanism, after a workpiece passes through a central workpiece hole of the multi-face turnover mechanism, the workpiece can be clamped and fixed through the clamping device, the workpiece can be driven to rotate integrally through the rotating device, machining of the follow-up process is facilitated, and production efficiency is improved.

The invention relates to the technical field of semiconductor display, and particularly discloses a quantum dot Micro MIP device preparation method, which comprises the following steps: S1, preparing raw materials; s2, sapphire coating; s3, mass transfer is carried out; s4, forming a quantum dot groove; s5, spraying the quantum dots; s6, packaging the quantum dots; s7, laser stripping; s8, RDL packaging is carried out; s9, cutting the device; s10, separately measuring the devices; according to the invention, the blue light Micro COW is combined with the quantum dot material to realize color conversion, so that the red light and the green light can be generated, the color saturation and the fineness of the display device are further improved, the overall display image quality is improved, and the mass transfer technology and the laser lift-off technology are adopted. The chip transfer and packaging process is more efficient and accurate, the loss in the manufacturing process is reduced, the control of the manufacturing cost is facilitated, the cutting and packaging process of the device is also optimized, the performance and quality of the device are ensured, and meanwhile, the production efficiency is improved.

The invention relates to the technical field of semiconductor packaging, in particular to a UMCP packaging mode and product based on a carrier plate and RDL design, and the packaging mode comprises the following steps: S1, pasting a multi-laminated chip on the carrier plate, then carrying out the upward routing, and then carrying out the plastic packaging; s2, carrying out flat grinding on a plastic package material at the top of the preliminary product until a bonding wire is exposed, and then rewiring by using an RDL process; s3, mounting an FC flip chip and an NAND chip on the basis of the RDL wiring layer of the secondary product, and then routing; s4, performing plastic packaging on the FC + NAND part of the third product; and S5, removing the carrier plate to obtain a finished product. According to the invention, the RDL process is adopted for rewiring to change the original chip combination and lamination mode, and the trouble of'waterfall type routing 'of the high-difficulty bonding process caused by the conventional UMCP high-stack die in the Hybrid Bonding hybrid bonding process is avoided.