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48results about How to "Step can be unnecessary" patented technology

Automatic Device Capabilites Change Notification

The present invention relates to an improved approach to mobile device capability management. Heretofore, a capability management device is provided at a mobile communication network. Upon change of a mobile device capability, a related notification is sent to the capability management device which applies a policy decision whether to track the capability change at the network side or not. Should the decision be ‘yes’, the capability management device starts a device management session to collect further information on a mobile device capability change beyond the information made available with the mobile device capability change notification. After retrieval of the mobile device capability change information, the capability management device will update its mobile device capability state accordingly. Optionally, the capability management device may share the generated information with third party cooperating with the mobile device for, e.g., service delivery.
Owner:TELEFON AB LM ERICSSON (PUBL)

Display device and electronic device including the display device

To provide a display device including a transistor that includes an oxide semiconductor and has favorable characteristics, a pixel electrode electrically connected to the transistor, and a capacitor electrically connected to the pixel electrode. To provide a display device that can be manufactured at low cost. The display device includes a display element including a pixel electrode, a transistor that performs switching of the display element and includes a first oxide semiconductor layer serving as a channel formation region, a capacitor that is electrically connected to the display element and includes a dielectric layer between a pair of electrodes. The pixel electrode is a second oxide semiconductor layer formed on the same surface as that on which the first oxide semiconductor layer is formed, and also serves as one electrode of the capacitor.
Owner:SEMICON ENERGY LAB CO LTD

Manufacturing method of semiconductor device, semiconductor device, circuit substrate and electronic equipment

A method of manufacturing a semiconductor device is provided. The method includes embedding and forming a coupling terminal as an external electrode of an electronic circuit on an active surface side of a substrate having an active surface formed with a plurality of electronic circuits, exposing a part of the coupling terminal by polishing a back surface side of the substrate, mounting a semiconductor chip on the back surface side of the substrate via the coupling terminal, sealing the semiconductor chip mounted on the substrate by a sealing material, and cutting the substrate for every forming area of each electronic circuit and dividing it into a plurality of semiconductor devices.
Owner:SAMSUNG ELECTRONICS CO LTD

Method for Manufacturing Crystalline Semiconductor Film and Method for Manufacturing Thin Film Transistor

The present invention relates to a method for manufacturing a polycrystalline semiconductor film that can be used for a semiconductor device. In the method, an amorphous semiconductor film is irradiated with a femtosecond laser to be crystallized. By laser irradiation using a femtosecond laser, when an amorphous semiconductor film over which a cap film is formed is crystallized with a laser, it becomes possible to perform crystallization of the semiconductor film and removal of the cap film at the same time. Therefore, a step of removing the cap film in a later step can be omitted.
Owner:SEMICON ENERGY LAB CO LTD

Circuit substrate and method of manufacturing the same

In a method of manufacturing a circuit substrate of the present invention, a first through hole is formed in a semiconductor substrate and a first insulating layer is formed on the entire surface of the semiconductor substrate, and then first wiring layers connected to each other via an outer through conducting portion provided on the inner surface of the first through hole are formed on both sides of the semiconductor substrate, and then a second insulating layer is formed which covers the first wiring layers on both sides of the semiconductor substrate and the outer through conducting portion on the inner surface of the first through hole, the second insulating layer has a structure in which a second through hole is provided in a central portion of the first through hole, and then second wiring layers connected to each other via an inner through conducting portion provided in the second through hole are formed on the second insulating layer on both sides of the semiconductor substrate.
Owner:SHINKO ELECTRIC IND CO LTD

Manufacturing method of semiconductor device, semiconductor device, circuit substrate and electronic equipment

A method of manufacturing a semiconductor device is provided. The method includes embedding and forming a coupling terminal as an external electrode of an electronic circuit on an active surface side of a substrate having an active surface formed with a plurality of electronic circuits, exposing a part of the coupling terminal by polishing a back surface side of the substrate, mounting a semiconductor chip on the back surface side of the substrate via the coupling terminal, sealing the semiconductor chip mounted on the substrate by a sealing material, and cutting the substrate for every forming area of each electronic circuit and dividing it into a plurality of semiconductor devices.
Owner:SAMSUNG ELECTRONICS CO LTD

Ice composition containing hydrogen peroxide and method of storing perishable food

An ice composition obtained by freezing a liquid containing, dissolved therein, hydrogen peroxide produced by electrolysis; and a method of food storage using the composition. Hydrogen peroxide has a lower rate of dissipation into the air and better suitability for long-term storage than ozone. Furthermore, since hydrogen peroxide is electrolytically produced, it eliminates the trouble of transportation, storage, and dissolution. When seawater is used as a feed water for electrolysis, the ice composition thus obtained has a higher cooling effect because it has a melting point lower than 0° C.
Owner:DE NORA PERMELEC LTD

Multi-layer film permeable to UV radiation

A multilayer film that is impermeable to liquids and is to some extent permeable to UV radiation, optionally in the form of a tubular film, having a layer sequence of a layer (a) comprising at least one thermoplastic olefin homo- or copolymer, as one of the external layers, an adhesive-promoter layer (b), an internal layer (c) comprising at least one homo- and / or copolyamide, an adhesive-promoter layer (d), and a layer (e) comprising at least one homo- and / or copolyamide, as one of the external layers, wherein the VICAT softening point of the thermoplastic olefin homo- or copolymer of the layer (a) is at least 100° C., and the use of said multilayer film as internally situated tube of an insertion tube for the renovation of subterranean pipes, an insertion tube of this type, and a pipe-renovation system suitable for the renovation of subterranean pipes.
Owner:BUERGOFOL

Method for removal of hemispherical grained silicon in a deep trench

A method for removal of hemispherical grained silicon (HSG) in a deep trench is described. A buried silicon germanium (SiGe) layer serving as an etch stop layer is formed in the collar region of the trench, followed by depositing a HSG layer. The HSG layer is then successfully striped by wet etching with a potassium hydroxide / propanone / water etchant, that is, without damage to the trench sidewalls, since a good etch rate selectivity between the HSG layer and the SiGe layer is obtained by the wet etchant. In addition, no etch stop layer exists between the HSG layer and the bottom of the trench when manufacturing trench capacitors in accordance with the method; capacitance degradation is therefore not of concern.
Owner:CHANG LIAO HLDG

Disk unit, yoke built in disk unit and process of manufacturing same

A disk unit has a voice coil motor to oscillate a suspension arm mounted at the leading end of a head with respect to a disk. The voice coil motor has a voice coil integrally attached to the tail end of the suspension arm, a magnet to cause a magnetic field to act on the voice coil, and a pair of yokes provided in such a positional relationship that the voice coil and magnet are sandwiched therebetween. At least one yoke has a roughly fan-shaped main body and a plate piece portion provided in a condition extended from one end side of the main body. After the formation of the main body and plate piece portion by press working, the yoke is formed by folding the plate piece portion on the main body.
Owner:KK TOSHIBA

Stator for inner rotor type rotating electric machine

A stator for an inner rotor type rotating electric machine including: an annular armature core comprised of a plurality of arcuate segmented cores circumferentially arranged; a bobbin assembly comprised of a plurality of arcuate segmented bobbins arranged circumferentially of the armature core to cover the armature core; and a coil wound around each salient pole portion of the armature core via a coil winding barrel of the bobbin assembly, wherein each segmented bobbin is placed across adjacent segmented cores, and when the armature core is covered with the plurality of segmented bobbins to assemble the bobbin assembly, the plurality of segmented cores that constitute the armature core are restrained and held by the bobbin assembly.
Owner:KOKUSAN DENKI CO LTD

Solder bump, method for forming a solder bump, substrate provided with solder bump, and method for manufacturing substrate

Provided is a solder bump forming method capable of forming solder bumps having a desired constant thickness, without any failure such as copper corrosion, on a mounting board such as a printed circuit board having fine copper electrodes. The solder bump forming method includes: a process in which a prepared mask (5) is placed on a prepared substrate (1) and then a molten solder jet is blown to fill an opening of the mask (5) with molten solder (11a) until the molten solder (11a) exceeds the thickness of the mask (5); a process of removing a part of the molten solder (11a) that exceeds the thickness of the mask (5) to form a solder bump (11) having a predetermined thickness; and a process of removing the mask (5). The molten solder (11a) is molten lead-free solder that includes tin as a main ingredient and at least nickel as a sub ingredient, and further includes one or more other ingredients such as silver, copper, and germanium. The part of the molten solder (11a) that exceeds the thickness of the mask (5) is removed by using a blade or an air cutter or by spraying a solution (18) that includes organic fatty acid having 12 to 20 carbon atoms.
Owner:TANIGUROGUMI CORP

Thin film magnetic head and method of manufacturing same

A thin film magnetic head capable of shortening a manufacturing time and a method of manufacturing the same are provided. After forming a write gap layer by using a non-magnetic conductive material such as copper, a top pole is formed on the write gap layer by growing a plating film with the write gap layer used as a seed layer. Unlike the case where the write gap layer is formed by using a non-magnetic insulating material such as alumina, a step of newly forming a seed layer aside from the write gap layer and a step of selectively removing the newly formed seed layer become unnecessary. Therefore, the number of manufacturing processes is reduced, and the manufacturing time of the thin film magnetic head is shortened.
Owner:SAE MAGNETICS (HK) LTD

Method for producing printing plates

A method for producing a printing plate, especially inside a printing press, wherein a printing plate with a rewritable surface is provided, and wherein to produce a permanent as well as an erasable image on the surface of the printing plate, the erasing of the surface and / or the imaging of the surface are carried out with the use of an atmospheric plasma.
Owner:MANROLANAD AG

Method and device for acquiring electronic information about transmission speeds in a network

The invention relates to a method and a device for acquiring electronic information about transmission speeds between nodes of an acyclical network, in particular of an IEEE 1394 bus network, precisely one transmission link being present between in each case two of the nodes of the network, and a respective PHY transmission speed of the transmission link being determined by a minimum value of PHY speeds of the nodes of the network lying on the transmission link, in the case of the method the respective PHY transmission speed being determined for one subset of the transmission links in the network by acquiring the PHY speeds of the nodes lying on the transmission links and electronically acquiring minimum values of the PHY speeds; and the respective PHY transmission speed being electronically acquired for another subset of the transmission links, which is different from the one subset of transmission links, on the basis of one of the PHY speeds which have been determined for the nodes lying on the transmission links of the one subset, and electronic topology information about a topology of the network being electronically acquired using optimization means which are formed in a node of the network. The device is provided for carrying out the method.
Owner:THOMSON LICENSING SA

Display device including pixel electrode including oxide

To provide a display device including a transistor that includes an oxide semiconductor and has favorable characteristics, a pixel electrode electrically connected to the transistor, and a capacitor electrically connected to the pixel electrode. To provide a display device that can be manufactured at low cost. The display device includes a display element including a pixel electrode, a transistor that performs switching of the display element and includes a first oxide semiconductor layer serving as a channel formation region, a capacitor that is electrically connected to the display element and includes a dielectric layer between a pair of electrodes. The pixel electrode is a second oxide semiconductor layer formed on the same surface as that on which the first oxide semiconductor layer is formed, and also serves as one electrode of the capacitor.
Owner:SEMICON ENERGY LAB CO LTD

Cigar cutter employing magnetic fields

A guillotine-style cigar cutter. The cutter includes a body with a central aperture and a pair of blades disposed on opposite sides of the aperture and configured to move translationally across the aperture to cut an end of a cigar in preparation for smoking. Magnets are disposed to each blade to provided movement of the cutter open or closed depending on the orientation of the magnetic poles relative to one another.
Owner:FISCHER BRETT WILLIAM

Methods and System for the Integrated Synthesis, Delivery, and Processing of Source Chemicals for Thin Film Manufacturing

An integrated system for synthesis of a film-forming precursor, consumption of the precursor and formation of a thin film on a substrate is provided. The integrated system includes a raw material source, a precursor synthesis chamber in communication with the raw material source, a thin film processing chamber in communication with the precursor synthesis chamber for supplying the precursor from the precursor synthesis chamber to the thin film processing chamber in a controlled manner for consumption of the precursor to form the thin film on the substrate, a monitoring system for monitoring of the thin film formation in the thin film processing chamber and / or the precursor synthesis in the precursor synthesis chamber, and a controller for controlling a rate of the precursor synthesis, precursor consumption and / or thin film formation. The rate of precursor synthesis is synchronized with the rate of precursor consumption for formation of the thin film.
Owner:GELEST

Switching regulator control circuit and switching regulator

InactiveUS20120194154A1Suppress manufacturing fluctuationImprove accuracyDc-dc conversionElectric variable regulationCapacitanceEngineering
Provided is a switching regulator including an overload protection circuit, which has high accuracy even without requiring adjusting means in a test step. The switching regulator includes: a first triangle wave generation circuit for generating a first triangle wave which controls Duty of a PWM signal; and a second triangle wave generation circuit for generating a second triangle wave for overload detection, which has a crest value smaller than that of the first triangle wave. A ratio between the crest value of the first triangle wave and the crest value of the second triangle wave is set based on respective capacitances or constant currents thereof.
Owner:ABLIC INC
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