84results about How to "Uniform profile" patented technology

The shapes of the photo-resist layer “banks” which define pockets for inkjet printing or other patterned processes are optimized to provide a more uniform drying profile for substances which are to be deposited in those pockets and dried therein. Preferably, the shapes of the banks are “mushroom” shaped such that a portion of the photo-resist layer overhangs the exposed lower electrode layer.

Apparatus for ophthalmic surgery, especially non-penetrating filtration surgery, comprising a laser source that ablates sclera tissue at steps of intermediate thickness. Optionally, the beam is scanned using a scanner and its results viewed using an ophthalmic microscope.

This invention is an apparatus for ophthalmic surgery comprising a laser source (52) that generates a laser beam (54); a scanner (56) comprising an input for said laser beam, and an output of a spatially scanned laser beam (54); controlling circuitry that drives said scanner (56) to remove tissue in a desired pattern on the eye (40); a microscope (58) for viewing said tissue removal; and a beam combiner (70) comprising a first input for a line of sight of said microscope (58) and second input for said spatially scanned beam (54).

The composition of a organic (e.g. conducting polymer) solution is reformulated and the device upon which the organic solution is to be deposited is plasma treated to provide a more uniform and flat drying profile for the resulting dried film. This reformulation and treatment induces a more uniform and flatter profile when the reformulated organic solution is allowed to dry into a film on the treated device.

A method of controlling wafer critical dimension (CD) uniformity on a track lithography tool includes obtaining a CD map for a wafer. The CD map includes a plurality of CD data points correlated with a multi-zone heater geometry map. The multi-zone heater includes a plurality of heater zones. The method also includes determining a CD value for a first heater zone of the plurality of heater zones based on one or more of the CD data points and computing a difference between the determined CD value for the first heater zone and a target CD value for the first heater zone. The method further includes determining a temperature variation for the first heater zone based, in part, on the computed difference and a temperature sensitivity of a photoresist deposited on the wafer and modifying a temperature of the first heater zone based, in part, on the temperature variation.

A semiconductor processing chamber, capable of withstanding low pressures while transmitting radiant energy, is provided in a lightweight, compact design. The inner surface of the window is preferably substantially flat and parallel to the wafer to be processed. The window is thin in a center portion and thicker in a surrounding peripheral portion. The thickness increases in the radially outward direction, defined between the flat inner surface and a concave outer surface. Deposition uniformity is improved by employing multiple outlet ports for distributing gas laterally in a short length, enabling a compact, symmetrical geometry. Preferably, a quadra-flow system of gas distribution is used, whereby the chamber contains one inlet port and three outlet ports distributed approximately at 90 degrees around a cylindrical side wall defining the chamber space.

The invention discloses a method for forming a shallow trench isolation structure and the shallow trench isolation structure. In the process of forming the shallow trench isolation structure, double-layer hard masking films are adopted, namely that an oxide, such as a silicon oxide film is additionally arranged on an original nitride, such as a silicon nitride film. Because the selection ratio ofetching to the silicon oxide is higher than that of the silicon nitride, the surface of the silicon nitride film can not be damaged in the etching process, and the surface of the silicon nitride filmis still smooth and uniform after being etched. The invention ensures that after CMP, the height difference generated between each active region and each adjacent field oxide region on same Wafer plane is consistent, thereby ensuring a uniform outline of grown multi-crystal silicon and ensuring the performance of an integrated circuit.

The invention is based on a method of producing bent spring elements from a spring steel strip (14), wherein a feed unit (16) delivers the spring steel strip (14) from a supply roll (12) to a bending unit (32) having at least three bending rollers (34) and a reverse bending roller (36), of which at least one bending roller (34) and the reverse bending roller (36) can be adjusted transversely to the spring steel strip (14) by bending motors (60, 62), and wherein a cutting-off unit (44) adjoins the bending unit (32), said cutting-off unit (44) cutting off the spring steel strip (14) into individual spring elements by means of cutting-off tools (46, 48; 76, 78). It is proposed that the cutting-off tools (46, 48; 76, 78) be movable in the longitudinal direction of the spring steel strip (14) in a numerically controlled manner and that they be synchronized with the feed movement of the spring steel strip (14) during the cutting-off operation.

A sputter coating installation 1 comprises a vacuum chamber having an interior space 3′. The interior space 3′ of the vacuum chamber is defined by chamber walls 3. According to the present invention, an array of target units 9 is arranged in line inside the vacuum coating chamber. Particularly, the target units 9 are arranged tiltable relative to the vacuum chamber and relative to a transport path t of a substrate 2. The target units 9 are cathode units or magnetron units and comprise a target and a housing. The housing is attached to the target and defines an interior space of the target unit. Within the interior space of the target units a number of components are arranged, e.g. a combination of a magnet yoke and a magnet system, a magnet yoke drive, a cooling system (arranged near the target), an electric current supply for supplying energy for the sputter process, etc. The combination of the magnet yoke and the magnet system is movable on a linear path to perform a reciprocating movement relative to the target during the operation of the target unit. Outside the housing a vacuum pressure p_v is generated vacuum pumps 5 arranged in a chamber wall 3c of the vacuum chamber behind the target units 9 for enabling the sputter coating process. In the interior space of the housing another pressure p may prevail, particularly a considerably higher pressure p. For example, the pressure p in the interior space of the housing may be an atmospheric pressure. Therefore, the housing provides a vacuum sealing of the interior space of the housing relative to the outside of the housing.

A retroreflective structure is disclosed that has cube corner retroreflective elements. The structure includes a first array of retroreflective elements oriented in a first direction within a plane and a second array of retroreflective elements oriented in a second direction within the plane, wherein said second direction being about 90° to said first direction. The structure further includes a third array of retroreflective elements oriented in a third direction within the plane, wherein said third direction being about 180° to said first direction and a fourth array of retroreflective elements oriented in a fourth direction being about 270° to said first direction. In one embodiment, the retroreflective structure includes the retroreflective elements having cube corner elements having a pitch between elements in the range of between about 0.0035 and 0.0045 inches (0.088 and 0.114 millimeters). In a preferred embodiment, the retroreflective structure includes a metalized layer on the facet side of the retroreflective elements for specular reflection, and the retroreflective elements are tilted by about −3 degrees.

Methods for bonding substrates, forming assemblies using the same, along with improved methods for refurbishing said assemblies are disclosed that take advantage of at least one channel formed in an adhesive utilized to join two substrates to improve fabrication, performance and refurbishment of the assemblies. In one embodiment an assembly includes a first substrate secured to a second substrate by an adhesive layer. The assembly includes a channel having at least one side bounded by the adhesive layer and having an outlet exposed to an exterior of the assembly.

A smart label construction that provides a more uniform profile for improved print performance in a thermal label printer. The preferred label design has a layer of pressure sensitive piece of applied over the inlay and beyond the edges of the inlay to provide a smoother step transition and eliminates printing voids along the inlay edges. An oversized adhesive patch is applied at the insert. The adhesive patch extends beyond the perimeter edges of the inlay masking the thickness transition of the inlay base film. Alternatively, a coat of additional adhesive is applied only on the leading and trailing edges of the transponder. Alternatively, a low viscosity adhesive is applied to the backside of the inlay prior to singulating the inlay and inserting it into the label stock. The low viscosity adhesive flows beyond the perimeter of the transponder and fills voids. Alternativley, transponder may compress into a low viscosity of adhesive on the label substrate.

A fuel cell having a distributed fuel feed in which the heat generation profile can be better controlled. Fuel channel stack and system efficiency improvements are achieved.

A heating device utilizing electromagnetic induction is provided with an induction heating unit that is opposed to a heating member and causes the heating member to heat through electromagnetic induction. The induction heating unit has an exciting coil for generating a magnetic field and a coil guide member on which the exciting coil is wound. The exciting coil is formed in at least two layers in such a manner that a first layer is formed on a circumferential surface of the coil guide member by winding a plurality of turns and a second layer is formed around and outside the first layer on the side opposite to the coil guide member, and winding of each of the second layer and following layers is started from a position close to a winding start position of the first layer.