The invention provides a computing device, a
memory module group, computing equipment and a computing equipment cluster, and belongs to the technical field of
chip packaging. The computing device comprises at least one
memory module group, a processor and a mainboard. Each
memory module in the memory module group is formed by stacking the memory chips with the bit width of at least 8 bits, the size is small, the stacking process is simple, each memory module is accessed through at least one memory channel, and the density of the memory channels in unit area is large, so that the memory module group in the computing device can provide a large bandwidth, and the computing device is suitable for the computing device. According to the method, the requirements of AI or large-scale computing scenes on bandwidth are met, an HBM with high process difficulty and high cost does not need to be adopted, the
engineering difficulty can be reduced, and the cost can be saved; besides, the processor and the memory module communicate based on the
DRAM interface, and compared with an HBM interface, the
delay is smaller, so that the
power consumption generated by the
delay is smaller, the data read-write efficiency is improved, and the
random access efficiency is obviously improved.