39 results about "Plasma volume" patented technology

A semiconductor wafer processing apparatus includes a first electrode exposed to a first plasma generation volume, a second electrode exposed to a second plasma generation volume, and a gas distribution unit disposed between the first and second plasma generation volumes. The first electrode is defined to transmit radiofrequency (RF) power to the first plasma generation volume, and distribute a first plasma process gas to the first plasma generation volume. The second electrode is defined to transmit RF power to the second plasma generation volume, and hold a substrate in exposure to the second plasma generation volume. The gas distribution unit includes an arrangement of through-holes defined to fluidly connect the first plasma generation volume to the second plasma generation volume. The gas distribution unit also includes an arrangement of gas supply ports defined to distribute a second plasma process gas to the second plasma generation volume.

Automated systems and methods for providing platelet concentrates and synthetic storage media with reduced residual plasma volumes are disclosed. The disclosed systems and methods reduce the residual volume of plasma in platelet concentrate to obtain a platelet product having a volume of plasma that is approximately 5% or less of the total platelet product volume. The disclosed systems and methods also reduce the residual volume of plasma in platelet concentrate to obtain a washed platelet product, wherein the volume of plasma in the washed platelet product is approximately 1% or less of the total washed platelet product volume. Storage media for platelets including less than approximately 10% plasma are also disclosed.

An extracorporeal circuit for removing toxins from the blood and plasma volume control in patients suffering from sepsis and renal failure. The extracorporeal circuit disclosed herein comprises a plasma filter, a toxin removal device and optionally a hemofilter that minimizes electrolyte and protein depletion from the treated plasma while effectively removing both free and protein-bound toxins. The toxin removal device comprises adsorbent materials selected from the group consisting of activated carbon, ion exchange resins and non-ionic exchange resins and the adsorbent materials are coated with albumin. Also provided are associated methods for treating patients suffering from sepsis and renal failure using the disclosed extracorporeal circuit and toxin removal device.

Provided herein are approaches for dynamically modifying plasma volume in an ion source chamber by positioning an end plate and radio frequency (RF) antenna at a selected axial location. In one approach, an ion source includes a plasma chamber having a longitudinal axis extending between a first end wall and a second end wall, and an RF antenna adjacent a plasma within the plasma chamber, wherein the RF antenna is configured to provide RF energy to the plasma. The ion source may further include an end plate disposed within the plasma chamber, adjacent the first end wall, the end plate actuated along the longitudinal axis between a first position and a second position to adjust a volume of the plasma. By providing an actuable end plate and RF antenna, plasma characteristics may be dynamically controlled to affect ion source characteristics, such as composition of ion species, including metastable neutrals.

A plasma deposition source for transferring a deposition gas into a plasma phase and for depositing, from the plasma phase, a thin film onto a substrate moving in a substrate transport direction in a vacuum chamber is described. The plasma deposition source includes a multi-region electrode device adapted to be positioned in the vacuum chamber and including at least one RF electrode arranged opposite to the moving substrate, and an RF power generator adapted for supplying RF power to the RF electrode. The RF electrode has at least one gas inlet arranged at one edge of the RF electrode and at least one gas outlet arranged at the opposed edge of the RF electrode. A normalized plasma volume is provided by a plasma volume defined between an electrode surface and an opposite substrate position, divided by an electrode length. The normalized plasma volume is tuned to a depletion length of the deposition gas.

The invention discloses a method for controlling water seepage from cracks in concrete floor and wall, which starts from one side of the structural surface of the concrete floor and wall to search for leaks one by one, and marks them with red spray paint; The red mark is to be drilled at an angle of 45° to the base surface at 3~4cm next to the leak point. The drilling depth is between 1 / 2 of the structure thickness and 2 / 3 of the structure thickness. Install grouting at the place where the hole is drilled Nozzle; use an electric grouting machine for grouting, when the grouting volume of each hole section is less than 5L / min, and the water absorption per meter of the inspection hole is less than 1.0L / min, the grouting is over, and then the next construction will be carried out; seal Hole out: After the grouting is finished, chisel off the grouting nozzle, and then seal it tightly with leak-stopping materials. During grouting, because one end of the grouting hole is blocked, the grouting pressure increases, and the cracks and seepage holes are quickly filled, thereby improving the anti-seepage effect; the amount of grouting fluid and cement is greatly reduced, economical and practical, and the construction period is shortened, and there will be no leakage. Large cracks and damage.