The application discloses an ultra-thin woven
pile electronic
package material fabric and a preparation method thereof. The fabric is interwoven by warp
yarn,
weft yarn and terry
yarn through satin weave, the thickness of the fabric is 0.20-0.25 mm, the fabric surface has
pile formed by the terry
yarn after sanding, the height of the
pile is 0.05-0.10 mm, and the pile height H and the fabric thickness T satisfy H / T<=0.5. The warp yarn and the
weft yarn are high-shrinkage
polyester, the terry yarn is low-shrinkage
polyester, and the root of the terry yarn is clamped and fixed by the warp yarn and the
weft yarn in the shrinkage state. The application realizes accurate control and firm anchoring of the pile under the thickness of 0.20-0.25 mm through the cooperation of the satin weave and the high-shrinkage warp yarn and weft yarn, so that the woven pile fabric has the performances of ultra-thin, soft, size stability and non-falling of the
cut edge, and the problems of the existing ultra-thin pile fabric, i.e. the pile penetrating the fabric or easily falling off, are solved.