32results about How to "Increase lifetime" patented technology

The idea of the invention is to coat the free surface of patterned Cu conducting lines in on-chip interconnections (BEOL) wiring by a 1-20 nm thick metal layer prior to deposition of the interlevel dielectric. This coating is sufficiently thin so as to obviate the need for additional planarization by polishing, while providing protection against oxidation and surface, or interface, diffusion of Cu which has been identified by the inventors as the leading contributor to metal line failure by electromigration and thermal stress voiding. Also, the metal layer increases the adhesion strength between the Cu and dielectric so as to further increase lifetime and facilitate process yield. The free surface is a direct result of the CMP (chemical mechanical polishing) in a damascene process or in a dry etching process by which Cu wiring is patterned. It is proposed that the metal capping layer be deposited by a selective process onto the Cu to minimize further processing. We have used electroless metal coatings, such as CoWP, CoSnP and Pd, to illustrate significant reliability benefits, although chemical vapor deposition (CVD) of metals or metal forming compounds can be employed.

The present invention relates to an improvement to rotorcraft rotors (1) fitted with inter-blade drag dampers (15) such that for each blade (4), the two joints (16) connecting said blade (4) to two inter-blade drag dampers (15) are disposed on either side of the pitch variation axis (101) of said blade, at least one of the two joints (16) being offset to above the plane P containing the pitch variation axis (101) and the vertical flapping axis (102).

The present disclosure relates, according to some embodiments, to a data writing method in a storage system. The method comprises receiving data by the storage media controller, reading a non-volatile memory operation mode in the memory unit by a central control unit, in which the mode corresponds to a data reliability lower than the data reliability requirement of the storage system, reading a data reliability reduction condition in the memory unit by the central control unit, determining whether a system information related to the data meets the condition by the central control unit, and controlling the media control unit to write the data into the non-volatile memory according to the mode by the central control unit when the system information meets the condition.

Certain example embodiments of this invention relate to a rotatable magnetron sputtering target(s) for use in sputtering material(s) onto a substrate. In certain example embodiments, the target includes a cathode tube with a target material applied thereto via plasma spraying or the like. A bonding layer is provided on the tube, between the cathode tube and the target material. The bonding layer is thicker proximate at least one end portion of the target than at a central portion of the target in order to reduce the likelihood of burn-through to or of the cathode tube during sputtering.

A lens array includes a lens plate having a plurality of lenses arranged next to each other in a direction perpendicular to optical axes thereof, and a light blocking member for blocking light incident on the lenses. The light blocking member includes a light blocking portion and a plurality of light passing portions arranged at positions corresponding to the lenses. The light passing portions communicate with each other.

A far infrared ray ceramic bulb structure includes a light emitting element under a ceramic substrate, a far infrared thermal radiation film on the ceramic substrate, a circuit unit, a bulb shell, a bulb shade and a connector connected to an external power supply. The circuit unit in the connector is electrically connected to the light emitting element and the connector. The bulb shade encloses the light emitting element and the ceramic substrate. The bulb shell is connected to the connector and encloses the far infrared thermal radiation film. The far infrared thermal radiation film propagates the heat generated by the light emitting element by far infrared thermal radiation. The working temperature of the light emitting element is reduced and the stability and the efficiency of light emitting are improved to increase the lifetime and the safety.

The present invention relates to an organic light emitting element and an organic light emitting device including the same. An impurity layer close to an electrode is doped with a small amount, and an impurity layer for a p-n junction is doped with a large amount, such that a high current may flow under a low voltage.

A shoe, and production methods for such a shoe, having a single-piece sole construction, in which efficient air circulation in the shoe and thereby directly on the foot of the user of the shoe is made possible with every step of the walking movement of the user.

The present invention is characterized by a DC-driven inorganic EL element useful for mobile and other applications, the EL element including at least plural electrode layers, and a light emitter layer made of an inorganic composition, which is provided between the electrode layers, wherein the attainted brightness in the DC drive is 10000 cd / m2 or more.

A hot runner nozzle assembly includes a nozzle heater, a hot runner nozzle, a nozzle tip, a nozzle tip seal surrounding the nozzle tip and a connecting element positioned to removably couple the tip seal to the nozzle tip and to create a first contact seal between the nozzle tip and the tip seal and a second annular contact seal between the tip seal and a mold component. The nozzle tip is made or shaped via a sintering process from a metal matrix composite (MMC) material having a first coefficient of thermal expansion. The tip seal is made or shaped from a ceramic based powder material, having a second coefficient of thermal expansion that is different from the first coefficient of thermal expansion. In operation this hot runner nozzle assembly provides an improved heat profile and a reduced leakage at the tip area under a wider operating processing window.