38results about How to "Improve isolation performance" patented technology

The invention discloses a CMOS radio frequency (RF) switch based on silicon-on-insulator (SOI) technology, which has the circuit structure adopting two-stage type closing isolation structure and two-stage type current release path structure, and utilizes a high resistance substrate and a buried oxide layer of an SOI technical device, thus remarkably reducing crosstalk and minimized parasitic capacitance, better screening substrate noise, obtaining ideal insertion loss and insulation performance at the two ends of the switch, inhibiting nonlinear effect and reducing harmonic distortion. The RFswitch has the circuit structure, reduces the channel resistance of a transistor connected in series, reduces the insertion loss, and further improves the closing performance of a transmitting terminal and a receiving terminal; furthermore, the switch can improve the insulation, leads harmonic quantity of every time to be in good grounding, improves the harmonic current of the substrate and inhibits harmonic component.

The invention provides a multipolar substrate electric connector. The connector comprises a male head and a female seat which are mutually inserted and matched, wherein the male head comprises a firstinsulating body, a first shielding shell fixed on the first insulating body, at least two columns of first connecting terminals fixed on the first insulating body, and a first isolating plate which is positioned between the at least two columns of first connecting terminals, is arranged on the first insulating body and is used for grounding; the female seat comprises a second insulating body, a second shielding shell which is fixed on the second insulating body, at least two columns of second connecting terminals which are fixed on the second insulating body, and a second isolation plate which is located between at least two columns of second connection terminals, is arranged on the second insulation body and is used for grounding. When the male head is matched with the female seat in a plugging way, the first isolation plate is electrically contacted with the second isolation plate. According to the invention, the isolation performance of the connector can be effectively improved.

The invention discloses a miniaturized broadband power divider circuit based on spur lines. The circuit includes a first port (1), a second port (2), a third port (3) and an isolation resistor (R1), wherein the isolation resistor (R1) is arranged between the second port (2) and the third port (3), a transmission path from the first port (1) to the second port (2) adopts a microstrip line, a transmission path from a first port (1) to a third port (3) adopts a microstrip line, a first spur line (20) is arranged on the microstrip line of the transmission path from the first port (1) to the second port (2), a second spur line (30) is arranged on the microstrip line of the transmission path from the first port (1) to the third port (3), and the first spur line (20) and the second spur line (30) are used for reducing the size of the power divider, reducing insertion loss and expanding the bandwidth of the power divider. The relative electrical length of the microstrip lines increase based on the spur lines, the actual length is shortened, the size of the power divider is reduced, and stepped impedance lines and branch lines are equivalently introduced to the transmission paths to expand the bandwidth of the power divider, and the power divider is smaller in size than a traditional Wilkinson power divider, and has larger bandwidth and smaller insertion loss.

The invention discloses a method for performing gold backing on a printed circuit board of a Ku waveband microstrip type switch circuit, which selectively performs gold backing treatment on the printed circuit board in the process of performing the gold backing treatment on the printed circuit board in the Ku waveband microstrip type switch circuit so as to separate the part between the printed circuit board and the back face of a microstrip line grounded base plate, inhibit the coupling effect of microwave signals, avoid the introduction of more parasitic parameters in the circuit, and improve the isolation performance of the microstrip type switch circuit. The method effectively inhibits the coupling effect of the microwave signals, avoids the introduction of more parasitic parameters in the circuit, and finally improves the isolation performance of the microstrip type switch circuit. The method has the characteristics of simple manufacturing, good repeatability, low cost, wide application range and the like.

The present invention provides a multi-polar substrate electrical connector, which includes a male head and a female seat that are mated with each other, the male head includes a first insulating body, a first shielding shell fixed to the first insulating body, and At least two rows of first connecting terminals fixed on the first insulating body, and a first isolation plate located between at least two rows of the first connecting terminals and provided on the first insulating body for grounding; The female seat includes a second insulating body, a second shielding shell fixed to the second insulating body, at least two rows of second connection terminals fixed to the second insulating body, and at least two rows of the second A second isolation plate between the connection terminals and provided on the second insulating body for grounding. When the male head is mated with the female socket, the first isolation plate and the second isolation plate electrical contact. The invention can effectively improve the isolation performance of the connector.

The invention relates to a microstrip array antenna structure capable of improving isolation between antennas. The structure comprises a dielectric board; the front side of the dielectric board is provided with transmitting microstrip array antennas and receiving microstrip array antennas at intervals; the back surface of the dielectric board is a metal floor; first isolated antenna arrays and second isolated antenna arrays are introduced between the transmitting microstrip array antennas and the receiving microstrip array antennas; first metallized through holes are introduced between the transmitting microstrip array antennas and the first isolated antenna arrays; second metallized through holes are introduced between the receiving microstrip array antennas and the second isolated antenna array; and at least one circle of peripheral metallized through holes are formed along the outer sides of the transmitting microstrip array antennas and the receiving microstrip array antennas. Thefirst isolated antenna arrays and the second isolated antenna arrays are introduced between the transmitting microstrip array antennas and the receiving microstrip array antennas, so that the isolation performance is improved by 7.5dB under the condition that the distance between the transmitting and receiving antennas is unchanged, and the isolation between the transmitting and receiving antennasin a working frequency band is smaller than 70dB; and the structure is suitable to transmit and receive electromagnetic waves in a continuous wave radar system.

The embodiment of the present invention discloses a WSS. The output port arrangement scheme of the optical fiber array of the WSS is that the centers of the output ports are arranged along a curve or along a combination line including line segments, and the centers of any two output ports on the curve or combination line The connected straight line cannot pass through the input port; the light beam received from the input port is diffracted to the output port through the LCoS panel, and the straight line passed by each order of diffraction generated by the diffraction intersects the curve or line segment, and there is only one intersection point. The WSS provided by the embodiment of the present invention can effectively improve the number of output ports and the isolation performance, and has strong practicability.