4results about How to "Reduce stress concentration effects" patented technology

The utility model discloses a light photovoltaic assembly and photovoltaic power generation equipment, and relates to the technical field of photovoltaic assemblies. The light photovoltaic module comprises a battery piece, a flexible welding strip, a conductive plate and a bus bar; a plurality of battery pieces are sequentially arranged along a first direction; the plurality of battery pieces arranged along the first direction form a group, and a plurality of groups of battery pieces are arranged along the second direction; the flexible welding strip is in welding connection with the first electrodes of the battery pieces arranged in the first direction; the current-conducting plate is sequentially connected with the second electrodes of the battery pieces arranged along the first direction in a welding manner; the bus bars are provided with a plurality of sections, each section of bus bar is correspondingly arranged between two adjacent groups of battery pieces, and the bus bars are respectively connected with the adjacent flexible welding strips and the current-conducting plates in a welding manner; according to the light photovoltaic module provided by the utility model, the battery pieces are grouped and connected in parallel, and then each group of battery pieces are connected in series and boosted, so that the circuit connection stability of each battery piece can be effectively ensured, and the overall use reliability of the light photovoltaic module is improved.

The application discloses a low-rigidity thin-wall gear ring end face grinding tool, which comprises an electric permanent magnetic chuck, three fine-tuning precision lifting platforms, three arc-shaped clamping blocks and a flatness measuring device, the three fine-tuning precision lifting platforms and the three arc-shaped clamping blocks are alternately arranged on the surface of the electric permanent magnetic chuck with equal intervals. The application changes the traditional end face adsorption clamping into gear ring cylindrical surface clamping, changes the clamping force from axial to radial, and transfers the error to the non-sensitive direction of machining, so that the gear ring positioning can be rapidly realized, and the machining efficiency of the gear ring is improved; the end face will not be deformed and the error reflection problem will not occur under the large magnetic force, and the clamping force will not affect the precision of the end face grinding process. The electric permanent magnetic chuck is adopted for clamping, so that the deformation problem of the clamping position in the traditional clamping mode is avoided, and the end face grinding production efficiency is improved.

The utility model discloses a spiral heating pipe structure for a vehicle-mounted instant water boiler, which relates to the technical field of heating pipes and comprises a spiral heating pipe main body, a main body buffer mechanism is mounted in the spiral heating pipe main body, and two ends of the spiral heating pipe main body are respectively and fixedly connected with a connecting hose. According to the utility model, through the flexible connection design of the connecting hose and the two ends of the spiral heating pipe main body, the heating pipe and the vehicle-mounted instant water boiler main body form an elastic connection structure capable of buffering, so that when a vehicle bumps, external vibration energy can be absorbed through flexible deformation of the hose, and direct stress conduction caused by rigid connection is avoided; and the connection stability of the end part of the heating pipe and the equipment main body can be ensured, and direct pulling and impact of vibration on the spiral section are reduced.

The invention provides a flip chip ball grid array packaging structure, a preparation method thereof and electronic equipment. The preparation method at least comprises the following steps: providing a substrate provided with a bonding pad for welding a chip resistor required by flip chip ball grid array packaging and a corresponding solder resist window; solder paste is applied to the bonding pad, and a chip resistor is mounted on the bonding pad; reflow soldering is carried out, so that the solder paste is melted and a welding spot is formed; and integrally wrapping the chip resistor body and the solder paste welding spots by adopting epoxy resin so as to encapsulate and fix the chip resistor and the solder paste area at the bottom of the chip resistor, thereby obtaining the flip chip ball grid array package. By means of the method, the shape of the welding spot is optimized, the stress concentration effect is weakened, and the welding spot shows excellent anti-fatigue performance in the follow-up temperature cycle test.