1 results about "Base free" patented technology

This invention provides a resin composition and its application. The resin composition, by weight, comprises the following components: (A) 1-10 parts of a nitrogen-containing polyether resin containing unsaturated double bonds; (B) 45-75 parts of filler; and (C) 1-10 parts of a compounded free radical initiator. The compounded free radical initiator (C) comprises an organic peroxide free radical initiator and a carbon-based free radical initiator in a mass ratio of (0.2-5):1. By introducing free radical initiators with different half-lives into the resin composition, combined with the nitrogen-containing polyether resin containing unsaturated double bonds and filler, the prepreg prepared from this resin composition exhibits thick copper filler properties, and its cured product has high Tg, low XY-CTE, and good electrical and PS properties. It can be applied in thin HDI, carrier plates, and high-speed applications, showing broad application prospects.