68results about How to "Guaranteed a stable bond" patented technology

A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.

The present invention is directed to bioconjugates of complexes represented by the formula:wherein R, R′, R1, R′1, R2, R′2, R3, R′3, R4, R′4, R5, R′5, R6, R′6, R7, R′7, R8, R′8, R9, R′9, M, X, Y, Z and n are defined herein for use as contrast agents in diagnostic imaging.

The invention provides a process for the production of a cementious material. The process comprises mixing cement starting materials and a particulate healing agent to provide the cementious material. The healing agent comprises coated particles, wherein the coated particles comprise bacterial material and additive. The bacterial material is selected from the group consisting of a bacterium, a lyophilized bacterium and a bacterial spore of a bacterium. The present invention solves these problems, as (substantially leakage-proof) tablets containing the actual healing agent may neither interfere with either the workability of the liquid mixture (“cementious material”) nor negatively affect properties of either mixture or final material (hardened concrete), even when applied in large quantities. During crack formation in cementious based constructions, the particles also crack, and healing agent is released.

A wiring board comprising a first surface on which a first electrode is disposed and a second surface on which a second electrode is disposed; at least a single insulation layer and at least a single wiring layer; and one or a plurality of mounted semiconductor elements, wherein the second electrode disposed on the second surface is embedded in the insulation layer, the surface on the opposite side of the exposed surface on the second surface side of the second electrode is connected to the wiring layer, and all or part of the side surface of the second electrode does not make contact with the insulation layer.

Hydrophilic silicone copolymers are the addition polymerization product of an unsaturated silicone macromer, and unsaturated polyoxyalkylene polyether, and optionally further unsaturated addition polymerizable monomers.

Disclosed is an organic light-emitting display device having a touchscreen in which the configuration of a pad unit and a circuit board connected to the pad unit is simplified, resulting in bonding stability and an improved form factor of the device, and a method of manufacturing the same. In the organic light-emitting display device having the touchscreen in which a touch electrode is directly provided on an encapsulation layer, a touch pad and a display pad are disposed parallel to each other on the same side so as to be connected to a flexible printed circuit board with a difference in height therebetween. Thereby, increased bonding reliability and an increased effective display area are achieved.

In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a Sn—Ag based alloy. The alloys powders are blended so that the composition of the powder mixture is 5-10 mass % of Zn; 0.005-1.5 mass % of Ag; optionally at least one of 0.002-1.0 mass % of Cu, 0.005-15 mass % of Bi, 0.005-15 mass % of In, and 0.005-1.0 mass % of Sb; and a remainder of Sn.