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68results about How to "Guaranteed a stable bond" patented technology
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Rotor blade for a wind turbine and method for its production
A rotor blade for a wind turbine comprising at least one pair of girders lying opposite each other which extend in the longitudinal direction of the rotor blade and carry forces acting on the rotor blade, and at least one shear web which has two front surfaces, each of which is facing one of the two girders, and two lateral surfaces, wherein that shear web extends between the two girders in the longitudinal direction of the rotor blade and is permanently joined to the two girders, wherein at least one connecting profile having a single- or multi-piece cross-section is running in the longitudinal direction of the rotor blade and comprises a collet, into which the at least one shear web is inserted, wherein a first surface of the connecting profile is glued to one of the girders and a second surface of the connecting profile is glued to a lateral surface of the at least one shear web.
Owner:NORDEX ENERGY
Organic light-emitting display device having touchscreen and method of manufacturing the same
ActiveUS20180358413A1Convenient ArrangementIncreased form factorFinal product manufactureSolid-state devicesDisplay boardDisplay device
Disclosed is an organic light-emitting display device having a touchscreen in which the configuration of a pad unit and a circuit board connected to the pad unit is simplified, resulting in bonding stability and an improved form factor of the device, and a method of manufacturing the same. In the organic light-emitting display device having the touchscreen in which a touch electrode is directly provided on an encapsulation layer, a touch pad and a display pad are disposed parallel to each other on the same side so as to be connected to a flexible printed circuit board with a difference in height therebetween. Thereby, increased bonding reliability and an increased effective display area are achieved.
Owner:LG DISPLAY CO LTD
Polymer-metal chelator conjugates and uses thereof
InactiveUS20090092664A1Stability of disulfide bondPrevent oxidationOrganic active ingredientsPeptide/protein ingredientsPenicillamineGelatin product
The present invention provides prodrugs comprising a polymer conjugated to a metal chelator via a disulfide bond. For example, D-penicillamine may be conjugated to a polymer (e.g., gelatin, chitosan, polyglutamic acid) via a linker, such as SPDP. Thus, the cellular delivery and pharmacokinetics of D-penicillamine can be substantially improved. Methods for the treatment of cancer using compositions of the present invention are also disclosed.
Owner:UNIV OF KENTUCKY RES FOUND
Light-absorbent resin composition for laser welding, light-absorbent resin molding, and method for manufacturing light-absorbent resin molding
ActiveUS20080116426A1Simple moldingImprove thermal stabilityDiffusing elementsShaping conveyorsNanoparticleLaser light
The present invention provides a light-absorbent resin composition for laser welding whereby transparency can be maintained and stable laser welding is possible. The light-absorbent resin composition for laser welding includes a resin and laser-light-absorbent nanoparticles, wherein the laser-light-absorbent nanoparticles are nanoparticles of tungsten oxide indicated by the general formula WyOz, and / or nanoparticles of composite tungsten oxide indicated by the general formula MxWyOz.
Owner:SUMITOMO METAL MINING CO LTD
Label having transparent and opaque areas
InactiveUS20060057313A1Manufactured smallImplemented cost-effectivelyStampsEnvelopes/bags making machineryPunchingEngineering
A strip-shaped label has a transparent plastic film layer partially covered by an opaque film layer. A window area not covered by the opaque film layer remains. The film layers are bonded to one another using an adhesive layer. Before attachment, the label is positioned on a carrier. A bow-shaped suspension tab is produced through punching, on whose bottom non-adhesive areas are provided, which allow a suspension tab to be pulled out of the label plane easily for suspension of the container. Two printed voucher sections are implemented in the opaque label film. The transparent film layer has an adhesive-repellent coating, which is also transparent, below the voucher sections. In the stuck-on state, the label area in which the voucher sections are positioned overlap the transparent window area. After removal of one of the voucher sections, the window area is visible and the container contents may be viewed.
Owner:SCHREINER GRP GMBH & CO KG
Bonding wire for semiconductor
ActiveUS20110120594A1Reduce tensionLarge spanSolid-state devicesWelding/cutting media/materialsWire rodHydrogen concentration
It is an object of the present invention to provide a multilayer wire which can accomplish both ball bonding property and wire workability simultaneously, and which enhances a loop stability, a pull strength, and a wedge bonding property. A semiconductor bonding wire comprises a core member mainly composed of equal to or greater than one kind of following elements: Cu, Au, and Ag, and an outer layer formed on the core member and mainly composed of Pd. A total hydrogen concentration contained in a whole wire is within a range from 0.0001 to 0.008 mass %.
Owner:NIPPON STEEL CHEMICAL CO LTD +1
Laminated core, method and apparatus for manufacturing laminated core, and stator
ActiveUS20090195110A1Improve accuracyStable bonding strengthMagnetic circuit stationary partsSalient polesEngineeringMechanical engineering
A laminated core block includes a plurality of core members made of magnetic sheets stacked one on top of another, the plurality of core members including first and second core members which adjoin in a laminating direction, and a thermoplastic resin strand placed between the first and second core members. The thermoplastic resin strand is arranged to pass along one side surface of the first core member, between the first and second core members and along a side surface of the second core member on a side opposite to the aforementioned side surface of the first core member in this order. The first and second core members are bonded to each other by melting and curing the thermoplastic resin strand.
Owner:MITSUBISHI ELECTRIC CORP
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same
ActiveUS20070080439A1Stable wire bonding characteristicImprove connection reliabilitySemiconductor/solid-state device detailsPrinted circuit aspectsInsulation layerSemiconductor device
A wiring board comprising a first surface on which a first electrode is disposed and a second surface on which a second electrode is disposed; at least a single insulation layer and at least a single wiring layer; and one or a plurality of mounted semiconductor elements, wherein the second electrode disposed on the second surface is embedded in the insulation layer, the surface on the opposite side of the exposed surface on the second surface side of the second electrode is connected to the wiring layer, and all or part of the side surface of the second electrode does not make contact with the insulation layer.
Owner:RENESAS ELECTRONICS CORP
Light emitting device
InactiveUS20070228391A1Guaranteed a stable bondImprove long-term reliabilitySolid-state devicesSemiconductor devicesSimple Organic CompoundsConductive materials
A light emitting device has an LED (light emitting diode) element, and a power feeding member through which electrical power is fed to the LED element, the power feeding member comprising an electrically conductive material. The power feeding member has a light reflecting layer formed on the surface of the power feeding member, the light reflecting layer being formed of a metal, and a protecting layer formed on the surface of the light reflecting layer, the protecting layer being formed of an organic compound.
Owner:TOYODA GOSEI CO LTD
Covalent disulfide-linked diabodies and uses thereof
ActiveUS20120283418A1Guaranteed a stable bondEase of site-specific chemical modificationHybrid immunoglobulinsAntibody mimetics/scaffoldsDelivery vehicleAntibody fragments
The present invention provides recombinant antibody fragments which include a variable domain which has been modified by the addition of a tail sequence to its C-terminal end. The tail sequence comprises a terminal cysteine residue and an amino acid spacer and does not substantially affect the fragment's target-binding affinity. The present invention also provides pharmaceutical compositions comprising the described antibody fragments and a pharmaceutically acceptable carrier and methods of delivering an agent to cells of interest in a subject using the fragments as delivery vehicles. The invention further provides compositions comprising the described antibody fragments for the in vitro detection and measurement of target molecules which bind to the fragments and method of determining the presence or amount of such targets in a biological sample by contacting the sample with such compositions.
Owner:CITY OF HOPE
Solder paste and printed board
ActiveUS20060261131A1Readily flow timeLow melting pointPrinted circuit assemblingCooking-vessel materialsPowder mixtureAlloy
In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a Sn—Ag based alloy. The alloys powders are blended so that the composition of the powder mixture is 5-10 mass % of Zn; 0.005-1.5 mass % of Ag; optionally at least one of 0.002-1.0 mass % of Cu, 0.005-15 mass % of Bi, 0.005-15 mass % of In, and 0.005-1.0 mass % of Sb; and a remainder of Sn.
Owner:SENJU METAL IND CO LTD +1
Semiconductor device and manufacturing metthod thereof
InactiveUS20050212142A1Improve accuracyGuaranteed a stable bondSemiconductor/solid-state device detailsSolid-state devicesDevice materialSemiconductor chip
A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.
Owner:MIYAZAKI CHUICHI +16
Multi-chip package
InactiveUS20050200003A1Excellent electrical propertiesReduce package sizePrinted circuit assemblingSemiconductor/solid-state device detailsSemiconductor chipEngineering
A multi-chip package may be provided which may include a substrate, on which multiple substrate bonding pads may be formed and under which multiple terminals may be formed, first and second semiconductor chips, which may be deposited on the substrate, and a spacer, which may be formed between the first and second semiconductor chips to have at least power and ground pads. The spacer may be used as passive element, and the first and second semiconductor chips and the power and ground pads of the spacer may be electrically connected. The pads of the semiconductor chip which may be deposited on the spacer may also be electrically connected to substrate bonding pads via the pads which may be formed on the spacer.
Owner:SAMSUNG ELECTRONICS CO LTD
Direct methanol fuel cell electrode catalyst
InactiveUS20040224218A1Reduce methanol permeationReduce conductivityActive material electrodesSolid electrolyte fuel cellsFuel cellsProton
A method and device for reducing or substantially eliminating methanol crossover from the anode to the cathode of a direct methanol fuel cell and for increasing catalyst efficiency in which a catalyst ink layer comprising an electron conductive and proton conductive binder material is applied either to the anode electrode or the electrolyte layer of the direct methanol fuel cell.
Owner:GAS TECH INST
Squirrel-cage rotor
ActiveUS8836193B2Improve bindingAvoid tearingSynchronous motorsAsynchronous induction motorsElectrical conductorAlloy
The invention relates to a squirrel-cage rotor for an asynchronous machine. In order to increase the electrical efficiency for a cage rotor composed of two materials, the cage rotor comprises a rotor core (1) having grooves (3), end rings (5) of a first material that are cast onto the rotor core on the end face, and conductors (4) that are arranged in the grooves and that are made of a second material that has an electric conductivity that is higher than the electric conductivity of the first material, wherein the conductors (4) comprise a coating (8) made of a coating material on the surface of the conductors, wherein the coating adjoins the second material of the conductors (4) by means of a first alloy layer (2) made of the second material and the coating material and adjoins the cast first material by means of a second alloy layer (9); made of the first material and the coating material.
Owner:SIEMENS AG
Method of producing press-hardened and coated steel parts at a high productivity rate
ActiveUS20170268078A1Shorten cycle timeIncrease surface areaHot-dipping/immersion processesFurnace typesProduction ratePolymer science
A sheet or blank is provided which includes a substrate and pre-coating on at least one face of the substrate. A polymerized layer overlies at least a part of the pre-coating and has a thickness from 2 μm to 30 μm, a nitrogen content of less than 1% by weight, carbon pigments in a quantity from 3 to 30% by weight and does not include a polymer with silicon. A welded blank, part and fabrication methods are also provided.
Owner:ARCELORMITTAL INVESTIGACION Y DESARROLLO SL
Hydrophilic Organofunctional Silicone Copolymers
InactiveUS20110163254A1Simple mannerGuaranteed a stable bondSilicon organic compoundsTransportation and packagingPolymer chemistryMacromonomer
Hydrophilic silicone copolymers are the addition polymerization product of an unsaturated silicone macromer, and unsaturated polyoxyalkylene polyether, and optionally further unsaturated addition polymerizable monomers.
Owner:WACKER CHEM GMBH
Noble metal-coated copper wire for ball bonding
InactiveUS20170125135A1Reliably dividedUniformly formedSemiconductor/solid-state device detailsConductive materialMetal coatingInter layer
A noble metal-coated copper wire for ball bonding, with a wire diameter between 10 μm or more, and 25 μm or less, includes a core material having a copper alloy having a copper purity of 98 mass % or higher, and a noble metal-coating layer formed on the core material. The noble metal-coating layer includes a palladium cavitating layer containing palladium; at least one element selected from the group consisting of Group 13 to 16 elements or an oxygen element, finely dispersed in the palladium; and a diffusion layer formed of copper diffused into the palladium. The noble metal-coating layer may include a palladium cavitating layer containing palladium, at least one element selected from the group consisting of Group 13 to 16 elements or an oxygen element, finely dispersed therein, and a nickel intermediate layer disposed between the core material and the noble metal-coating layer.
Owner:TANAKA DENSHI KOGYO KK
Bioconjugates of metal complexes of nitrogen-containing macrocyclic ligands
InactiveUS7407645B2Stability and hydrogen bondingGuaranteed a stable bondOrganic chemistryGeneral/multifunctional contrast agentsNitrogenCoordination complex
Owner:GALERA THERAPEUTICS +2
Transparent composite substrate, preparation method thereof and touch panel
ActiveUS20160109982A1Low costImprove stress resistanceLamination ancillary operationsLaminationComposite substrateOptoelectronics
A transparent composite substrate includes a first transparent substrate, a second transparent substrate, and a binding layer bonding the first transparent substrate and the second transparent substrate with a bond therebetween.
Owner:TPK TOUCH SOLUTIONS (XIAMEN) INC
Healing agent for self-healing cementious material
ActiveUS8911549B2Good treatment effectImprove workabilityFatty acid chemical modificationNon-macromolecular adhesive additivesBiotechnologyMicrobiology
Owner:GREEN BASILISK BV
Casting resin for adhesive bonding of fibers
InactiveUS20090260754A1Improve stabilityGuaranteed a stable bondLaminationLamination apparatusFiberMolecular sieve
The invention relates to a liquid 2K polyurethane composition of a polyol component A comprising at least one hydrophobic polyol with a molecular weight>300 g / mol and a hydrophilic polyol with a molecular weight<500 g / mol, and 1 to 50 wt. % of a powdered molecular sieve as well as a polyisocyanate or an NCO-reactive PU-prepolymer. In addition, a process is described for casting plastic or metallic moldings, particularly membrane substrates, by the use of an inventive 2K polyurethane composition.
Owner:HENKEL KGAA
Wiring boad, semiconductor device in which wiring board is used, and method for manufaturing the same
ActiveUS20100127405A1Improve reliabilityFirmly connectedSemiconductor/solid-state device detailsPrinted circuit aspectsInsulation layerEngineering
A wiring board comprising a first surface on which a first electrode is disposed and a second surface on which a second electrode is disposed; at least a single insulation layer and at least a single wiring layer; and one or a plurality of mounted semiconductor elements, wherein the second electrode disposed on the second surface is embedded in the insulation layer, the surface on the opposite side of the exposed surface on the second surface side of the second electrode is connected to the wiring layer, and all or part of the side surface of the second electrode does not make contact with the insulation layer.
Owner:RENESAS ELECTRONICS CORP
Functionalised antifouling compounds and use thereof
The present invention relates to derivatives of α,α-disubstituted amide compounds which comprise a substituted aryl at the α carbon such that the substituent provides a means for attachment or incorporation of the compound to or in a polymer. The provision of such a substituent on the aryl has surprisingly been found not only to permit attachment to or incorporation in a polymer but also retention of useful antifouling activity. In embodiments, the substituent is selected from hydroxyl, ethers, es ters, carboxyls, alkylsilyls and alkenyls. Experiments demonstrate that antifouling activity can be as good or better as the corresponding unsubstituted compound and that polymers functionalised so as to include or be formed from the substituted compound can be used to reduce settlement.
Owner:NAT UNIV OF SINGAPORE +2
Lead frame and semiconductor device using the lead frame and method of manufacturing the same
InactiveUS6909179B2Prevent short-circuitingReduce the possibilitySemiconductor/solid-state device detailsSolid-state devicesIntegrated circuitEngineering
A semiconductor device includes a substrate, a semiconductor chip mounted on one surface of the substrate, wherein the semiconductor chip has an integrated circuit and bonding pads formed on a main surface thereof. The main surface of the semiconductor chip has a quadrilateral shape with the bonding pads being disposed along four sides of the main surface. A plurality of conductors is disposed on the one surface of the substrate so as to surround the semiconductor chip along four sides thereof and a plurality of bonding wires electrically connect the bonding pads with tips of the conductors, respectively. A resin body seals the semiconductor chip, the conductors and the plurality of bonding wires. A pitch between adjacent bonding pads increases in a direction toward four corners defined by the four sides of the main surface of the semiconductor chip.
Owner:RENESAS ELECTRONICS CORP
Hydrophilic organofunctional silicone copolymers
InactiveUS8524849B2Guaranteed a stable bondSilicon organic compoundsTransportation and packagingPolymer scienceCopolymer
Hydrophilic silicone copolymers are the addition polymerization product of an unsaturated silicone macromer, and unsaturated polyoxyalkylene polyether, and optionally further unsaturated addition polymerizable monomers.
Owner:WACKER CHEM GMBH
Fluorescence dye tagging scheme for mercury quantification and speciation
ActiveUS20130040393A1Large extinction coefficientHigh fluorescence quantum yieldOrganic chemistryTesting metalsFluorophoreHydroxy group
A fluorescent dye or fluorophore capable of forming complexes with mercury comprises 6,8-difluoro-7-hydroxy-2-oxo-2H-chromene-3-carboxylate amide, wherein the amide is formed by reacting the succinimidyl ester (Pacific Blue™) with an amino acid containing a thiol group, such as cysteine or glutathione. Mercury complexes of the fluorophore fluoresce when excited by a UV or violet laser diode, and the detected intensity can be calibrated to quantify the concentration of mercury in a sample reacted with the fluorophore.
Owner:ABB RES LTD
Organic light-emitting display device having touchscreen and method of manufacturing the same
ActiveUS10566395B2Increased form factorGuaranteed a stable bondFinal product manufactureSolid-state devicesDisplay boardDisplay device
Owner:LG DISPLAY CO LTD
Solder paste and printed circuit board
ActiveUS7681777B2High melting pointGuaranteed a stable bondPrinted circuit assemblingCooking-vessel materialsPowder mixtureAlloy
In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a Sn—Ag based alloy. The alloys powders are blended so that the composition of the powder mixture is 5-10 mass % of Zn; 0.005-1.5 mass % of Ag; optionally at least one of 0.002-1.0 mass % of Cu, 0.005-15 mass % of Bi, 0.005-15 mass % of In, and 0.005-1.0 mass % of Sb; and a remainder of Sn.
Owner:SENJU METAL IND CO LTD +1
Al-Cu bonded structure and method for making the same
InactiveUS20050029333A1Stable bond characteristicImprove machinabilityWelding/cutting media/materialsWelding/soldering/cutting articlesCopperUltimate tensile strength
With an Al—Cu bonded structure, an Ag layer can be remained at the Al—Cu bonding interlayer, providing ductile deformation behavior and a tensile strength at the bonded interlayer similar to that of the Al base material. This results in superior bonding characteristics. Furthermore, a thin Al—Cu bonded structure can be obtained as a result of using the Al—Cu dissimilar material bonded section, which has superior workability, as the base material to perform rolling for wall-thickness reduction. The thin Al—Cu structure has superior dimensional accuracy and can meet diverse dimensional demands. The structure combines the light weight of Al with its particular heat transfer and heat dissipative characteristics and anti-corrosive properties of Cu, allowing it to meet the compact, thin, light-weight, and high-performance needs of electronic devices. The structure can be widely used in heat exchangers and heat transfer devices.
Owner:SUMITOMO PRECISION PROD CO LTD