50results about How to "Guaranteed breakdown voltage" patented technology

The invention discloses an epoxy resin composition, a continuous glue film made of the same and a preparation method. The epoxy resin composition comprises solid ingredients and organic solvents, wherein the solid ingredients comprise epoxy resin (A), thermoplastic resin or/and synthetic nitrile rubber (B), solidified agents (C), curing accelerators (D) and inorganic heat-conducting fillers (E). In addition, the invention also relates to the continuous glue film made of the epoxy resin composition and the preparation method. Because the continuous glue film is made by automated equipment, thecontinuous glue film has good consistency on thickness and performance, so that the breakdown voltage of a metal based copper-clad laminate and the stability of thermal resistance are ensured. The product made by the invention has good heat-conducting performance and electric insulation performance.

The invention relates to a power device and a manufacturing method of the power device, in particular to a fast recovery diode chip of a low-concentration doped emitter region and a manufacturing method of the fast recovery diode chip of the low-concentration doped emitter region. The fast recovery diode chip of the low-concentration doped emitter region comprises a metal cathode, a metal anode, a P-type doped layer, an N-type doped layer, an N-type substrate arranged between the P-type doped layer and the N-type doped layer, field oxide layers and passivation protective layer structures, wherein the metal anode is a low-concentration P-type doped region, the metal cathode is a low-concentration N-type buffer doped region and a low-concentration N-type reinforced doped region, the special manufacturing mode of injection doped of the reverse side is formed through an obverse side protection technology, and a device structure is formed through the special manufacturing mode of injection doped of the reverse side. According to the fast recovery diode chip of the low-concentration doped emitter region and the manufacturing method of the fast recovery diode chip of the low-concentration doped emitter region, due to the fact that the doped concentration of an anode emitter region and the doped concentration of a cathode emitter region are reduced, the self-key electric potential difference of a PN-junction is reduced, the total number of injection holes of the P-type doped region is reduced, performance of a fast recovery diode is integrally optimized, it is ensured that the fast recovery diode has low forward communication voltage drop, and the dynamic performance of a device is improved.

The present invention discloses a super junction device. P-type columns of at least one super junction unit are internally provided with N-type electric field barrier layers, and the N-type electric field barrier layers are configured to segment the P-type columns into first and second P-type columns which are respectively located at the top portions and the bottom portions of the electric field barrier layers; the N-type electric field barrier layers are configured to realize segmentation exhaustion of super junction structures at a top portion and a bottom portion; when a source-drain voltage of a super junction device is smaller than or equal to a first voltage value, the super junction structure at the top portion is only exhausted; and when the source-drain voltage of the super junction device is larger than the first voltage value, the super junction structures at the top portion and the bottom portion are exhausted. The present invention further discloses a manufacturing methodof a super junction device. According to the invention, a gate-drain capacitance and the minimum value of the gate-drain capacitance can be improved to effectively reduce the electromagnetic interference performance of the device in an application circuit and effectively reduce current and voltage overshoot caused by the device in the application circuit, reversely recovered soft factors of the device can be increased, and a breakdown voltage of the device can be maintained.

The invention relates to a planar insulated gate bipolar transistor and a preparation method thereof, belonging to the technical field of power semiconductors. A semiconductor layer or Schottky contact metal having a relatively small band gap is introduced into the upper surface of the base region of the device adjacent to the outer side of the emitter region, By using heterojunction or Schottky contact as minority carrier barrier to enhance the conductivity modulation effect, the conduction voltage drop is reduced and the tradeoff between forward voltage drop and turn-off loss is optimized. As the heterojunction or Schottky contact introduced by the invention can replace the CS layer functionally, the electric field strength of the PN junction formed in the base region and the drift region is reduced to improve the breakdown voltage of the device; And the electric field intensity of the gate oxide layer is below the safe value (3MV/cm), so the reliability of the gate oxide layer is ensured. In addition, the fabrication process of the device is simple and controllable, and the device has strong compatibility with the existing process.

The invention discloses an N-type LDMOS device and a technical method thereof. According to the device, a low resistance substrate is provided with an N-type buried layer thereon. The N-type buried layer is provided with an N-type epitaxy thereon. The N-type epitaxy is provided with a P-well and a drift region therein. The drift region is also provided with an N-well and an STI structure therein. The P-well is also provided with a source region of the LDMOS device therein. The N-well of the drift region is provided with a drain region of the LDMOS device therein. The P-well is also provided with a heavily doped P-type region therein so as to draw forth the P-well. The surface of the N-type epitaxy is provided with a gate oxide layer and a polycrystalline silicon gate of the LDMOS device, and the two sides of the polycrystalline silicon gate are side walls. The bottom portion of the STI structure in the drift region is provided with heavily doped polycrystalline silicon. The P-type doped polycrystalline silicon layer is added to the bottom portion of the STI structure in the drift region, a P-type auxiliary exhaustion region is formed above the drift region, and a surface electric field intensity is lowered, which enable the LDMOS device to have a lower on-resistance and at the same time a higher breakdown voltage. The invention also discloses a technical method of the N-type LDMOS device.

The invention provides a semiconductor device with a super junction structure, a manufacturing method thereof, and a photomask. The layout plane of the semiconductor device comprises an active region and a potential dividing ring region located at the periphery of the active region. The semiconductor device is characterized in that the active region is internally provided with multiple first P-type doping regions extending along the first direction; the multiple first P-type doping regions are arranged at equal distances in the second direction; the potential dividing ring region is internally provided with multiple second P-type doping regions extending along the first direction; the multiple second P-type doping regions are arranged at equal distances in the second direction; the breakdown voltage of each first P-type doping region is smaller than that of each second P-type doping region; and the second direction is perpendicular to the first direction. Contradiction between conduction resistance and a device area can be overcome, the breakdown point of the device is constantly in the active region, and the device can be ensured to work normally.

The invention provides a metal capacitor structure and a preparation method thereof. The structure is characterized by comprising a substrate, a capacitor structure, a plurality of openings, a recess, and a side wall; the capacitor structure comprises a bottom metal layer, an interlayer dielectric layer and a top metal layer which are sequentially stacked on the substrate; the plurality of openings penetrate through the top metal layer and extend downwards into the interlayer dielectric layer; the recess is positioned on the side wall of the opening and extends downwards into the interlayer dielectric layer from the bottom of the opening; and the side wall is located in the opening and extends downwards from the side wall of the top metal layer to fill the recess; The breakdown voltage of the metal capacitor structure is improved.

The invention discloses a high-Early-voltage lateral transistor structure and a preparation method thereof. The lateral PNP transistor is formed by performing selective P-type impurity doping on an N-type epitaxial layer, that is, an emitter region of the PNP transistor is formed by a P-type doped region, a collector region of the PNP transistor is formed by a complete or partial annular P-type doped region outside the emitter region, and an N-type doped epitaxial layer is arranged between the two P-type doped regions to form a base region of the PNP transistor, so that a lateral P-N-P structure is formed, and the lateral PNP transistor is formed. Different from the traditional PNP transistor, the P-type collector region of the lateral PNP transistor with the novel structure is independently doped, the impurity concentration of the P-type collector region is lower than that of the N-type base region, when the CE voltage of the PNP transistor is increased, a CB junction space charge region is mainly expanded to the P-type collector region because the concentration of the P-type collector region of the lateral PNP transistor is lower than that of the N-type collector region, and thewidth change of the base region caused by the increase of the CE voltage is inhibited, so that a relatively high Early voltage is obtained.

The invention discloses a GaAs based composite collecting region trajectory transmitting heterojunction bipolar transistor comprising, a semi-insulating GaAs substrate, a N#+[+] adulterated GaAs collecting sub-region grown on the semi-insulating GaAs substrate, a composite collecting region grown on the N#+[+] adulterated GaAs collecting sub-region, a heavy type P GaAs base grown on the composite collecting region. On the base region a type N InGaP emitting region is formed the top of which is a cap layer used for making Ohm contact, an emitting electrode is formed on the cap layer, and a base electrode is formed on the type N InGaP emitting region on the base region.

The invention provides a semiconductor device and a fabrication method thereof. By arranging a poly-silicon inter-layer connection layer on the surfaces of a source region and a drain region of the device, the source region and the drain region of the device can extend to the surface of a substrate by the inter-layer connection layer, are connected with contact holes by the inter-layer connection layer and are connected other inter-connection layers at the upper part, so that the areas of source-drain regions are not needed to be excessive large due to catering to the contact holes, and the probability is provided for further reducing the areas of the source region and the drain region. Further, the poly-silicon inter-layer connection layer in the semiconductor device only covers the surface of an active region and are not arranged on the side wall of a grid or other regions, thus, parasitic capacitance between the source-drain regions and the grid cannot be generated, and meanwhile, the device is enabled to have required breakdown voltage.

The invention discloses an LDMOS and a manufacturing method thereof. The manufacturing method comprises the following steps: forming a substrate region on a semiconductor substrate, wherein the substrate region comprises a first region; manufacturing a first STI, a second STI, a drift region and a medium-voltage p well in the first region; forming an oxide layer above the first region; forming a first polycrystalline silicon layer above the oxide layer; arranging a first optical cement layer on the upper surface of the first polycrystalline silicon layer, wherein the first optical cement layercomprises a first transmission region and a first blocking region, and the first blocking region is used for blocking foreign ions from passing through; and injecting first impurity ions into the drift region at high energy through the first transmission region to form a first n-type doped region. According to the invention, impurity ions are injected into the drift region of the LDMOS at high energy, so that the on resistance of the drift region is reduced, and the breakdown voltage can be maintained.

The invention discloses a trench type power semiconductor device and a manufacturing method thereof, and relates to a power semiconductor device. In order to solve the problems that the manufacturingcost of a device is increased and the parasitic gate capacitance is increased due to the presence of a gate bus, the invention provides the following technical scheme: a gate contact hole is formed inan interlayer dielectric layer above the initial section of a trench, the gate conductive material in the trench is connected with the gate electrode metal layer above the gate conductive material through the gate contact hole, the width of the gate contact hole is smaller than that of the initial section of the trench, and the width of the initial section of the trench is larger than that of theextension section of the trench. The beneficial effects of the invention are that: according to the trench type power semiconductor device, stable and reliable grid connection can be realized on thebasis of not causing negative influence on the performance of the device; and by omitting a gate bus board, the photoetching process steps of the device are reduced, and the manufacturing cost of thedevice is reduced; and meanwhile, the gate parasitic capacitance introduced by the gate bus board is reduced, and the switching speed of the device is improved.

The invention provides an insulated gate bipolar transistor and a manufacturing method thereof. The insulated gate bipolar transistor comprises a substrate; a buffer layer formed on the substrate; anepitaxial layer formed on the buffer layer; a junction type field effect structure JFET region formed in that epitaxial layer, and the width of the JFET region is 2.5 to 12 [mu]m; a CJI doped region formed in the JFET region, and the doped region is located at a thickness inflection point of the gate dielectric layer; A first gate dielectric layer formed on the epitaxial layer, the thickness of the first gate dielectric layer being 0.5 [mu]m to 1.2 [mu]m.

The invention discloses a CMOS device in a BCD process. The CMOS device comprises a first MOS transistor with a channel conduction type of a first conduction type, and an LDMOS device comprises a first LDMOS with a channel conduction type of a second conduction type; a second conduction type doped first doped region is formed in a second conduction type first well region on the source region sideof the first MOS transistor, and the first doped region also forms a drift region of the first LDMOS. A first lightly doped drain region doped with the first conductivity type is formed in the first well region on the drain region side of the first MOS transistor. The first source region and the first drain region are formed on the surfaces of the first doped region and the first lightly doped drain region on the two sides of the first gate structure respectively. The invention further discloses a manufacturing method of the CMOS device in the BCD process. According to the invention, the high-voltage CMOS device can be realized, the short-channel effect of the device can be delayed, and the breakdown voltage of the device can be ensured without adding an additional process, so the size ofthe device can be further reduced, the conduction current is improved, and the conduction resistance is reduced.

The invention provides a DDD UHV MOS device structure and a manufacturing method thereof. A grid electrode can be formed on a substrate, shallow doping regions are formed in the substrate on two sidesof the grid electrode, source and drain regions can be formed in the shallow doping regions, and metal silicide layers can be formed in the source and drain regions, so that when the source and drainregions are connected with a contact plug in a peripheral circuit, the metal silicide layers can be in good contact with the source and drain regions while the high breakdown voltage of UHV is ensured, and the contact resistance between the contact plug and the source and drain is reduced, thereby reducing the overall power consumption of the device and improving the performance of the device.

The invention provides a novel super-barrier power device and a manufacturing method thereof. The manufacturing method comprises the following steps: forming an oxide layer with a stepped structure onthe surface of an N-type epitaxial layer of an N-type substrate, forming a first P-type injection region and a first N-type injection region on the surface of the N-type epitaxial layer, forming a second P-type injection region in the first N-type injection region, and forming a second N-type injection region in the first P-type injection region; forming a polycrystalline silicon layer on the surface of the oxide layer; and depositing front and back metal layers. The comprehensive device performance of the novel super-barrier power device obtained by adopting the manufacturing method is superior to that of a device chip with a traditional structure, and the leakage current level is far lower than that of a traditional device.

The invention relates to the technical field of semiconductor manufacturing, in particular to an LDMOS device and a manufacturing method thereof. The method comprises the following steps: providing asemiconductor substrate, and forming a shallow trench isolation structure around the semiconductor substrate of the device, wherein the shallow trench isolation structure extends downwards from the front face of the semiconductor substrate; forming a drift region in the semiconductor substrate surrounded by the shallow trench isolation structure; forming a body region in the drift region of the source end region of the device; forming a gate structure bridged between the body region and the drain terminal region; forming a high-voltage LDD region in the drift region of the drain terminal region of the device; forming side walls at the side edges of the gate structures of the connector region and the high-voltage LDD region respectively; respectively forming a source region and a drain region in the body region and the high-voltage LDD region, wherein the source region and the drain region form overlapping regions with the corresponding side walls, wherein the device is manufactured bythe method.

The invention discloses an anti-vibrating optocoupler relay, and relates to the technical field of the encapsulation. The optocoupler relay comprises a first frame and a second frame in physical separation; the first frame and the second frame are arranged in parallel in a horizontal direction of the section, and the first frame and the second frame are partially overlapped on a vertical directionof the section; a signal sending send is arranged on at overlapping location on the first frame, and a signal receiving end is arranged at the overlapping location on the second frame; the signal sending end and the signal receiving end are in face to face, and the signal sending end and the signal receiving end are in physical isolation,; the signal sending end and the signal receiving end are sealed in internal resin, and external resin are encapsulated at the external of the internal resin. The problem that the optocoupler relay is sensitive to vibration, low in reliability, small in isolation voltage, bad in radiating effect and has follow current due to the unibody design is solved, and the effects of buffering the impact of external force, improving the reliability, increasing the isolation voltage, avoiding the flow current influence and guaranteeing the radiation are achieved.