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This invention relates to the technical field of circuit board edge grinding. More specifically, this invention relates to an HDI circuit board cutting and edge grinding device and method. It includes a support frame and a housing; the housing is fixedly connected to the support frame; a grinding block is connected to a drive assembly; at least eight electric push rods are connected to the drive assembly; all electric push rods are evenly divided into two groups, and the telescopic end of each group of electric push rods is commonly fixedly connected to a ring; a second ring is rotatably connected to each ring; a clamping plate is fixedly connected to each second ring; at least four elastic telescopic rods are fixedly connected to each clamping plate; and an electric suction cup is slidably connected to each clamping plate. In use, the four edges of the circuit board sequentially contact the grinding block immersed in clean water and undergo grinding, effectively preventing dust diffusion. After grinding, only the four edges of the circuit board are wetted with clean water, which, compared to the prior art that wets the entire circuit board, improves drying efficiency.