The invention relates to a layer stripping method in a chip failure analysis process, comprising the following steps: (1) providing a chip, the chip has a multi-layer structure, and includes at least one target analysis layer, and the target analysis layer includes a layer to be analyzed area; (2) using ion beams to carry out peeling treatment from the surface of the chip, remove one or more layers above the target analysis layer, and expose the area to be analyzed, wherein the ion The beam includes at least one broad ion beam with a beam spot diameter not less than 1 mm. In this peeling method, the ion beam formed by at least one wide-beam ion beam can be used to obtain a relatively uniform peeling surface, which avoids a single beam of high-energy focused ion beam directly hitting the surface of the chip, causing damage to the target analysis area. The precision of peeling is effectively improved, and the processing range is expanded at the same time, and the peeling efficiency is high.