15 results about "Interfacial roughness" patented technology

According to one embodiment, a semiconductor device includes a tunnel insulating film, a charge trap film on the tunnel insulating film, and a block insulating film on the charge trap film. The charge trap film is between the tunnel insulating film and the block insulating film. A conductive film is on the block insulating film. The block insulating film is between the charge trap film and the conductive film. The conductive film includes a first metal film adjacent to the block insulating film and a second metal film on the first metal film. The first metal film is between the block insulating film and the second metal film. The first metal film has an interfacial roughness on a side facing the second metal film that is greater than an interfacial roughness on a side facing the block insulating film.

The invention relates to a composite buffer layer structure for a high-temperature superconducting tape, a preparation method of the composite buffer layer structure and the superconducting tape, and belongs to the technical field of high-temperature superconducting materials. The composite buffer layer structure comprises a first buffer layer and a flattened cap layer which is formed by epitaxial growth of lanthanum strontium manganese oxide (LSMO) on the first buffer layer through a pulse laser deposition technology. By introducing the LSMO flattening cap layer, the interface roughness is reduced to the atomic level while the excellent texture quality is maintained, and an almost ideal growth template is provided for the superconducting layer. According to the design, the problem that the quality of the superconducting layer is reduced due to the fact that the surface appearance of a traditional buffer layer is rough is effectively solved, the current-carrying performance of the superconducting tape is remarkably improved, and the high-temperature superconducting tape is a breakthrough solution for promoting the second-generation high-temperature superconducting technology to develop to higher performance.

The invention provides an interface bonding-oriented 3D printing concrete interface roughness measurement method, and belongs to the technical field of interface processing of 3D printing concrete.The method comprises the steps that original point cloud is constructed and preprocessed, and a roughness field is constructed according to the preprocessed point cloud; based on the roughness field, defining a roughness index system and a calculation mode of each index; a unified roughness-bonding semi-empirical model for multiple working conditions is constructed based on a roughness index system, roughness contribution is decomposed into an effective contact factor and a mechanical occlusion factor, and fillable penalty and time penalty are introduced. The method is used for uniformly representing a non-monotonic effect caused by insufficient filling in a new and old concrete interface and a 3D printing interlayer interface and refusion attenuation caused by an interlayer time interval; and calculating the effective roughness based on the constructed model. According to the scheme, the influence of the concrete interface roughness on the bonding performance can be quantitatively reflected, and calculable variables are provided for deducing process parameters of the optimal bonding performance.

The invention provides a canal lining joint structure based on multi-parameter optimization, and relates to the field of canal protection. The canal lining joint structure based on multi-parameter optimization is arranged between adjacent concrete precast slabs, and comprises a joint width, a joint width, a joint width, a joint width, a joint width, a joint width, a joint width, a joint width, a joint width and a joint width, the joint width ranges from 1.8 cm to 2.2 cm; the joint material is used for filling the joint and is made of emulsified asphalt mortar or cement mortar with the compressive strength not lower than 20 MPa; the contact interface of the concrete precast slab and the joint material is a rough interface, and the average roughness of the rough interface is 1.8-2.2 mm. Through optimization design, the ultimate bearing capacity and the shear strength of the joint structure are greatly improved, the falling risk of the lining plate under the action of uplift pressure is effectively restrained, the service life of a channel is prolonged, three key parameters including the joint width, the interface roughness and the joint material are systematically coupled and optimized for the first time, and the joint structure is optimized. The optimal matching relation among the three is found, and the limitation of single-factor research is overcome.

The invention discloses a method for testing and analyzing interface bonding performance of a double-material interface under the action of water pressure. Firstly, a composite interface test piece is prepared, a water pressure and displacement monitoring integrated sensor is pre-embedded in the interface position of the composite interface test piece, a water pressure loading pipe is embedded in the composite test piece, step-by-step water pressure loading is carried out on the interface of the composite test piece through a water pressure loading device, loading is carried out in a pressurization-pressure stabilization-pressurization mode, and the composite interface test piece is obtained. In the loading process, deformation, sound signal characteristics and water pressure characteristics in the test process are monitored through whole-process monitoring equipment, finally, data collected in the test process are sorted and analyzed, meanwhile, interface characteristics after the test are digitally extracted, and then damage and cracking mechanisms of an interface under the action of water pressure are analyzed. According to the test method provided by the invention, the RMS value of the interface roughness can be adjusted according to requirements by making the quantitative roughness template, so that the influence of the interface roughness on the interface bonding performance under the action of water pressure can be conveniently and efficiently researched.

The invention discloses a method for measuring the thickness of a surface film of a crystal material, which belongs to the technical field of precision measurement, and comprises the following steps: establishing a physical model of the crystal material, and calculating theoretical values of X-ray relative diffraction intensity of surface films with different thicknesses; the diffraction peak intensity ratio M of the surface film to the base material is used as a horizontal coordinate, the thickness d of the surface film is used as a vertical coordinate, and a relational expression between M and d is constructed according to data point fitting; carrying out X-ray diffraction scanning on the to-be-tested piece, extracting independent diffraction peak intensity, and correcting the independent diffraction peak intensity; according to the corrected independent diffraction peak intensity, a representative diffraction peak is selected, the diffraction peak intensity ratio is substituted into the relational expression, and the thickness of the corresponding surface film is calculated. The method can be used for measuring the thickness of metal, ceramic, organic and other crystal films on the surface of a crystal material, influence factors such as the initial state, preferred orientation, surface / interface roughness and the like of the material can not be considered, the method can be used for a plane / special-shaped surface, the applicability is high, and nondestructive testing is effectively carried out.

The methods and devices described herein provide for thin and high-quality oxide layers with controlled interfacial roughness. In some embodiments, the aforementioned oxide layers are formed using radical oxidation processes with slow oxidation rates and relatively low-to-moderate temperatures, followed by nitrogen (N2) annealing at relatively high temperatures to densify the oxide layer(s) while also relieving (e.g., relaxing) interfacial stresses by inducing the viscous flow of the oxide.

The utility model provides a device for testing the adhesive property of cement mortar. The device comprises a forming mold and an adhesive interface processing mold, the forming mold is provided with a rectangular groove, the rectangular groove is defined by a first side wall, a second side wall, a third side wall and a fourth side wall, the first side wall is opposite to the third side wall, and the second side wall is opposite to the fourth side wall; the bonding interface processing mold is provided with a first side face, a second side face, a third side face and a fourth side face, the first side face is opposite to the third side face, and the second side face is opposite to the fourth side face; the bonding interface processing mold can be inserted into the rectangular groove of the forming mold, and interface textures are arranged on at least one of the second side face and the fourth side face of the bonding interface processing mold. The device solves the problems that in the traditional cement mortar mechanical property detection experiment process, the difficulty of forming and bonding test molds is large, the process operation steps are tedious, the roughness of a bonding interface is not easy to control, and the detection result is easy to have errors.

The present application relates to the technical field of underground building leakage treatment polishing equipment, and discloses a deformation joint interface roughness polishing device and polishing method for leakage treatment, wherein the device comprises a handheld inner-joint polishing handle and an external box, and the handheld inner-joint polishing handle comprises a polishing execution rod. In the present application, the concrete roughness evaluation is usually performed by adopting the CSP grade, the roughness grade range of the interface bonding degree of the waterproof material and the concrete is CSP2-5, the device adopts replaceable roughening grinding discs, provides type I, type II and type III roughening grinding discs, a first roughening surface is obtained by the type I grinding disc, a shallow, dense and continuous texture rough surface, and corresponds to CSP2-3, a second roughening surface is obtained by the type II grinding disc, a medium peak-valley and relatively continuous texture rough surface, and corresponds to CSP3-4, and a third roughening surface is obtained by the type III grinding disc, a deep, sparse and obvious relief texture rough surface, and corresponds to CSP4-5.

The utility model discloses a ribbed prestressed composite board, including the composite board, be provided with a plurality of longitudinal prestressed reinforcement along its length direction extension in the composite board, and along the width direction interval distribution of one side board of composite board has a plurality of rib structure along the length direction extension of composite board, the rib structure is provided with a plurality of recessed structure and convex structure alternately on one side away from the composite board. The utility model discloses the special-shaped rib formed by recessed structure and convex structure, makes the rib structure surface form the structure of the staggered height, can satisfy rigidity need, and the area of new and old concrete contact surface has been increased, and the new and old concrete adhesion is increased, the interface roughness is increased, the interface shear capacity is strengthened, prevents new and old concrete and happens the stagger of interface. At the same time, recessed structure is convenient for the pipeline of wearing and setting, and convex structure can be used for supporting top reinforcement, reduces the cost, improves construction efficiency.

The methods and devices described herein provide for thin and high-quality oxide layers with controlled interfacial roughness. In some embodiments, the aforementioned oxide layers are formed using radical oxidation processes with slow oxidation rates and relatively low-to-moderate temperatures, followed by nitrogen (N2) annealing at relatively high temperatures to densify the oxide layer(s) while also relieving (e.g., relaxing) interfacial stresses by inducing the viscous flow of the oxide.

The application provides a 3D printing concrete interface roughness measurement method for interface bonding, and belongs to the technical field of interface processing of 3D printing concrete, and comprises the following steps: constructing an original point cloud and performing pretreatment, and constructing a roughness field according to the pretreated point cloud; based on the roughness field, a roughness index system and the calculation method of each index are defined; based on the roughness index system, a roughness-bonding semi-empirical model for multiple working conditions is constructed, the roughness contribution is decomposed into an effective contact factor and a mechanical engagement factor, and a fillable penalty and a time penalty are introduced, which are used to uniformly represent the non-monotonic effect caused by insufficient fillability in the interface between new and old concrete and the interface between 3D printing layers and the re-fusion attenuation caused by the time interval between layers; and the effective roughness is calculated based on the constructed model. The scheme can quantitatively reflect the influence of the concrete interface roughness on the bonding performance, and provides a calculable variable for inferring the process parameters of the best bonding performance.

The invention provides a mirror surface grinding and polishing processing method of a tungsten target material and application of the mirror surface grinding and polishing processing method. The mirror surface grinding and polishing processing method comprises chemical mechanical grinding treatment and chemical mechanical polishing treatment which are carried out in sequence. The tungsten target material with a smooth and flat interface can be obtained through grinding-polishing treatment, the interface roughness is reduced to 0.10 [mu] m or below, a crystal boundary diagram obtained through corrosion is clear, and the grain size of the tungsten target can be conveniently detected.

A clad steel plate having tensile strength (TS) of 780 MPa or more, excellent ductility, bendability, collision resistance, and LME resistance. The clad steel plate having a base metal and a cladding metal on front and back surfaces of the base metal, and the chemical composition and microstructure of the base metal and the cladding metal being appropriately controlled so that the average Vickers hardness (HVL) of the cladding metal is 260 or less, the average Vickers hardness (HVL) of the cladding metal divided by the average Vickers hardness (HVB) of the base metal is 0.80 or less, the boundary roughness between the base metal and the cladding metal is 50 μm or less at the maximum height Ry, and the number of voids at the boundary between the base metal and the cladding metal is controlled to 20 or fewer per 10 mm length of the boundary.

The application provides a device and method for preparing ceramic-based copper-clad plate, and belongs to the technical field of ceramic substrates. The device provided by the application realizes micro-reduction of the surface of the ceramic substrate by using a Kaufman ion source device, realizes injection of metal elements by using a high-energy ion beam device, forms a ceramic-metal mixed layer by the ceramic matrix and the injected metal atoms, simultaneously forms a transition layer by using a low-energy ion beam device, the ceramic-metal mixed layer has good bonding force with the ceramic substrate layer and the transition layer, thereby improving the bonding force between the ceramic substrate and the copper film layer deposited by the subsequent high-pulse low-energy ion beam device, and enhancing the anti-peeling strength of the copper film layer. The device provided by the application can solve the problem that the traditional copper cladding technology cannot simultaneously meet the high-density ultra-thin copper cladding layer, high peeling strength and low interface roughness of the ceramic-based copper-clad plate, and meet the ceramic-based copper-clad plate with high frequency requirements.