An interback-type device in which a substrate 9 is carried into the device from one side of the device and is inverted in the device to be carried out and returned to the same side, a plurality of vacuum processing chambers 21, 22, 23 are longitudinally-provided and hermetically connected, and a carry system which passes through these vacuum chambers for carrying the substrate along established carry lines 94, 95L, 95R is provided. The carry line includes an outward carry line 94 toward an inversion position and return carry lines 95L, 95R returning from the inversion position, and the outward line 94 and return carry lines 94, 95L, 95R are different parallel paths, and the return carry lines 95L, 95R are branched in plurality. The outward carry line 94 and return carry lines 95L, 95R are established to pass through the same three processing chambers 21, 22, 23.