The invention relates to an
irradiation treatment system for local modification of a
semiconductor, and belongs to the technical field of
semiconductor processing. The
irradiation treatment system for local modification of the
semiconductor comprises a bearing table, a shielding mechanism, a positioning detection
assembly and a control module, wherein the bearing table is used for bearing and fixing a semiconductor
wafer; the shielding mechanism comprises a shielding plate and a driving
assembly, and a
radiation opening is formed in the shielding plate; the surface, facing the
radioactive source, of the
wafer is a
processing surface; the edge position of the shielding plate is fixed, and the driving
assembly is connected with the center point of the shielding plate and drives the center point to ascend and descend in the axial direction, so that the shielding plate generates elastic deformation to form an arc-shaped surface; the positioning detection assembly is used for detecting contact between the shielding plate and the
machining face. The control module controls the center point of the shielding plate to ascend and descend according to the contact
signal, so that the arc-shaped
face shape of the shielding plate is matched with the arc-shaped shape of the
machining face. According to the
irradiation treatment system for semiconductor local modification, the reliability and the yield of a semiconductor local modification process can be improved.