113results about How to "Improve the coupling rate" patented technology

A noncontact type power feeder system for feeding a power to a mobile object, in which a power feeding portion and a power receiving portion can be easily manufactured at low costs and which can transmit a high power. The noncontact type power feeder system for a mobile object, comprises a power feeding portion provided in a surface on which the mobile object runs, and a power receiving portion provided in the lower part of the mobile object at a position facing to the power supply portion, the each of the power feeding portion and the power receiving portion is composed of windings formed in an oval shape, and a magnetic planar core formed therein with a recess in which the windings are accommodated so that the longitudinal direction of the oval shape of the windings is extended along the travel direction of the mobile object, the planer core is composed of several planar blocks each having a rectangular surface, several blocks being laid so that long sides of the rectangular surfaces are extended in the travel direction of the mobile object, in which several blocks are also laid in the direction orthogonal to the travel direction, and several blocks being superposed one upon another, the recess of the planar core is defined by thick wall parts in which the planar cores are superposed on the surface of the planar core, outside and inside of the oval shape part of the windings.

A three dimensional (3D) transformer includes a first coil and a second coil. Each coil includes a first port, a second port, a top layer metal line, inter-layer inner metal lines, inter-layer outer metal lines and a bottom layer metal line. Each metal line of the first coil and that of the second coil are correspondingly arranged to the opposite side of each other. Each of the first port is electrically connected to each of the top metal line. Each coil is arranged clockwise from the top metal line, the inter layer inner metal line down to the bottom layer metal line and arranged clockwise from the bottom layer metal line, the inter layer outer metal line up to the upper metal line of the inter layer outer metal line. Each upper metal line of the inter layer outer metal line is electrically connected to each second port.

An illumination structure with multiple light sources in projector has first, second, third integration rods, first and second light sources. The second integration rod having a light incident surface, a light outgoing surface and a light reflection surface, is placed along the first integration rod. The light incident surface is parallel to the second integration rod, forming an angle between the light incident surface and light reflection surface. The first light source is vertically placed with respect to the second light source. The light emitted from the first light source is focused to the light incident surface of the first integration rod. The light emitted from the second light source is incident to the light incident surface of the second integration rod, and then reflected by the light reflection surface. The light reflected by the light reflection surface propagates forward the light outgoing surface of the second integration rod.

The invention discloses a single-fiber bidirectional transceiver module which comprises a laser diode, a photodiode, a first lens and a second lens, wherein an optical splitter is arranged between the first lens and the second lens; the optical splitter is plated with an anti-reflection film and an anti-incidence film; and the first lens, the second lens, the laser diode and the photodiode have the same optical axis, and the optical axis is a straight line. The invention further discloses the capsulation for the module and an application method thereof. In the invention, the lens in the prior art and the hemispherical end surface of the photodiode are improved into the hemispherical lens or spherical lens in the direction of the laser diode, thereby reducing the dimension of an optical module in the direction of the laser diode and ensuring that multiple optical transceivers can be arranged on the circuit board with the same dimension or the same optical transceivers can be arranged; and the area of the circuit board is small, thereby enabling the dimension of the whole optical device to be reduced. In the invention, the focusing is carried out on optical signals by adopting the hemispherical lens or the spherical lens, thereby greatly enhancing the coupling ratio of the photodiode, the optical fiber and the optical path of the laser diode.

A flash memory cell array comprises a substrate, a string of memory cell structures and source region/drain region. Each of memory cell structures includes a stack gate structure including a select gate dielectric layer, a select gate and a gate cap layer formed on the substrate; a spacer is set on the sidewall of the select gate; a control gate connected to the stack gate structure is set on the one side of the stack gate structure; a floating gate is set between the control gate and the substrate; an inter-gate dielectric layer is set between the control gate and the floating gate; and a tunneling dielectric layer is set between the floating gate and the substrate. The source region/drain region is set in the substrate near outer control gate and stack gate structure of the flash memory cell array.

The invention relates to a three-dimensional multilayer waveguide mode multiplexing and de-multiplexing device and a preparation method thereof and belongs to the optical communication device technical field, in particular, a mode division multiplexing system. According to the three-dimensional multilayer waveguide mode multiplexing and de-multiplexing device and the preparation method thereof ofthe invention, a three-dimensional multilayer waveguide integrated structure is adopted, and therefore, the limitations of a traditional two-dimensional planar waveguide structure can be eliminated, the integration dimensions of the device can be increased, the integration and flexibility of the device can be enhanced, and the communication capacity of a system can be improved. The boundary of anyone side of the upper-layer waveguide of the three-dimensional waveguide is aligned with the boundary of any one side of the lower-layer waveguide of the three-dimensional waveguide, so that the direct three-dimensional coupling of a fundamental mode and a high-order mode is realized, and therefore, a defect that a traditional three-dimensional mode multiplexer fails to realize direct coupling ofmodes can be eliminated, and the structure and complexity of the device can be simplified. The device of the invention is prepared based on a mature CMOS process, so that high efficiency, low cost and mass production of the device can be realized. With the three-dimensional multilayer waveguide mode multiplexing and de-multiplexing device and the preparation method thereof of the invention adopted, the flexible three-dimensional coupling of the modes can be realized, a solid foundation is laid for on-chip mode multiplexing technology. The three-dimensional multilayer waveguide mode multiplexing and de-multiplexing device and the preparation method thereof can be further applied to the flexible mode routing of a mode division multiplexing network.

The invention belongs to the field of coupling testing and provides a coupled antenna and a complete machine testing system. The coupled antenna comprises a dipole used for coupling radio-frequency signals of a preset frequency band, a feeder line and a coupling testing interface. The dipole comprises two symmetric antenna elements and one of the symmetric antenna elements is grounded; one end of the feeder line is connected to a connecting point on the symmetric axis of the dipole and used for transmitting the radio-frequency signals received by coupling of the dipole to the coupling test interface; the coupling test interface is arranged at the other end of the feeder line and used for being externally connected with a gauge so as to accomplish whole machine testing. Thus, in the complete machine testing system, the coupled antenna is used for replacing a traditional coupling board and the coupling efficiency of the radio-frequency signals sent by the antenna of a coupling terminal device is improved, so that complete machine testing is accurately conducted through the radio-frequency signals coupled by the coupled antenna.

The invention belongs to the technical field of semiconductor memories, and particularly relates to a semiconductor device which comprises at least one semiconductor substrate, a source region, a drain region, a floating gate, a control gate and a grid-control p-n junction diode used for connecting the floating gate and the substrate. The semiconductor device is used for storing information of the floating gate and charging and discharging the floating gate through the grid-control p-n junction diode, and has the advantages that coupling efficiency of the control gate is high, and operation voltage in storage of data is low. By means of the semiconductor device, quick storage and compatible manufacturing of logic devices and flash memory devices can be achieved.

A method of manufacturing a flash memory device. According to the invention, a floating gate can be formed and a distance between cells can be secured sufficiently by using one conductive layer without using a SA-STI process that cannot be applied to the manufacture process of high-integrated semiconductor devices. It is therefore possible to minimize an interference phenomenon between neighboring cells. Furthermore, an isolation film is etched after a photoresist film covering only a high-voltage transistor region is formed, or a gate oxide film is formed after a semiconductor substrate is etched at a thickness, which is the same as that of the gate oxide film of the high-voltage transistor region, so that a step between the cell region and the high-voltage transistor region is the same. Accordingly, the coupling ratio can be increased even by the gate oxide film of the high-voltage transistor region, which is thicker than the tunnel oxide film of the cell region. In addition, damage to a tunnel oxide film, a semiconductor substrate or a floating gate while an isolation film is etched at a predetermined depth in order to control the EFH can be prevented by controlling the EFH in such a manner than conductive layer spacers are formed on sidewalls of the floating gate and the isolation film is further etched.

The invention relates to a semiconductor memory device and a preparation method thereof. The method comprises the following steps: providing a semiconductor substrate and forming a tunneling oxide layer, a floating gate layer and a mask layer on the semiconductor substrate; patterning the mask layer, the floating gate layer, the tunneling oxide layer and the semiconductor substrate to form shallow trenches in the semiconductor substrate on the two sides of a floating gate laminate while the floating gate laminate is formed; selecting an isolation material to fill the shallow trenches so as to form a shallow trench isolation structure; removing the mask layer to form a groove on the upper side of the floating gate layer; etching back the isolation material on the two sides of the groove to increase the critical size of the groove; depositing a semi-spherical floating gate film at the bottom and on the side wall of the groove with the increased critical size to form a floating gate structure. The floating gate structure comprises a semi-spherical floating gate film, so the surface area of the floating gate structure is increased, the electric capacity formed by the floating gate is increased, and the performance of the device is improved.

The invention discloses a floating gate preparation method. The method comprises steps: S1, a shallow trench isolation structure whose upper surface is higher than the first height H1 of the upper surface of a semiconductor substrate is formed on a semiconductor substrate; S2, an active region is formed on the semiconductor substrate through ion implantation; S3, a tunnel oxide layer is formed on the semiconductor substrate; S4, a floating gate material layer is deposited on the tunnel oxide layer; S5, the floating gate material layer is flattened to enable the upper surface of the shallow trench isolation structure to be exposed; and S6, part of the shallow trench isolation structure is removed by etching to form the floating gate. S6 further comprises steps of adopting wet etching to remove the shallow trench isolation structure with a second height H2 to enable coupling efficiency between the floating gates and control gates formed subsequently to be high, and adopting dry etching to remove the shallow trench isolation structure with a third height H3 to form the floating gates. When the technical scheme of the invention is applied, the coupling efficiency between the floating gate and control gates formed subsequently is high, and the risk of short circuit between the active region and the control gates can be avoided.

The invention discloses a parallel connection type descending operation track train and a transporting method thereof. The parallel connection type descending operation track train comprises a return closed descending track line, an operation track line, descending trains running on the descending track line, and operation trains running on the operation track line, wherein the two track lines are both provided with descending segments and curve rotation segments, and the descending segments of the descending track line and the descending segments of the operation track line are in equidistant and parallel arrangement; and the descending trains and the operation trains respectively operate in an equidirectional and independent manner on the descending track line and the operation track line, and the descending trains and the operation trains are connected in parallel and operate at an equal speed periodically at the descending segment of the operation track line. According to the invention, getting on and off the trains in an intensive and partitioned manner at all lines are realized, the carrying capacity is large, the interval time between trips is short, the average travelling speed is high, each long-range passenger of whom the range is more than two thousands of meters directly reaches destinations without stopping halfway, the problems that the passengers travel inconveniently and uncomfortably, the travelling is crowded and the time is consumed are solved in a centralized manner, and at the same time, the load factor of the trains is increased at time periods and road segments with fewer flows of passengers.

The invention discloses a nonvolatile memory which comprises a substrate, a plurality of doped regions, a first grid, a conductor layer, a first contact window plug and a dielectric layer, wherein the doped regions are arranged in the substrate; the first grid is arranged on the substrate between two adjacent doped regions; the conductor layer is arranged above the first grid; the first contact window plug is arranged between the first grid and the conductor layer; and the dielectric layer is arranged between the first grid and the first contact window plug.

A flash memory cell array comprises a substrate, a string of memory cell structures and source region/drain region. Each of memory cell structures includes a stack gate structure including a select gate dielectric layer, a select gate and a gate cap layer formed on the substrate; a spacer is set on the sidewall of the select gate; a control gate connected to the stack gate structure is set on the one side of the stack gate structure; a floating gate is set between the control gate and the substrate; an inter-gate dielectric layer is set between the control gate and the floating gate; and a tunneling dielectric layer is set between the floating gate and the substrate. The source region/drain region is set in the substrate near outer control gate and stack gate structure of the flash memory cell array.

The present invention provides a cell recess oxide etching method of improving a deep-submicron flash memory device coupling rate. The method is characterized by combining a first dry etching step, a wet etching step and a second dry etching step; the dry etching effectively overcomes the characteristic that the density of the filling oxides is uneven, and the oxides in a density loose area at an opening in a cell recess are removed by the first dry etching step, so that the subsequently etched oxide interfaces are same in height and even and consistent in density; then, the oxide side walls at the side walls of the polycrystalline floating gates caused by the first dry etching are removed by the wet etching, so that the side walls are totally not covered by the oxides; and then, the cell recess oxide bottoms of consistent height and the oxide side walls at the bottoms of the side walls of the polycrystalline floating gates of uniform morphology and protecting the tunneling oxide layers are realized by the second dry etching, and then the ONO deposition is carried out to form the consistent ONO capacitors formed by the contact of the ONO and the polycrystalline floating gates, thereby achieving the purposes of improving the coupling rate of a deep-submicron flash memory device and improving the product qualified rate and service life.

The prewent invention discloses a manufacture method for flash memory to increasethe coupling ratio, which first defines two isolation structures projected above the surface of semiconductor substrate and then executes ion implanting so as to form adoping region on the semiconductor substrate at two sides of the isolation structure as well as forms dielectric isolation part at the side wall of two projected isolation structures, and at least, forms tunnelling dielectric layer and floating grid between the dielectric isolation parts in sequence to make the lower surface area of the floating grid smaller than the upper surface area of it for increasing the capacity coupling ratio.

The invention discloses a flash memory. Each flash memory is formed in the same active region, poly-silicon control gates at the same line are connected to form a poly-silicon line, N+ diffusion regions are symmetrically formed at two sides of each poly-silicon floating gate, each N+ diffusion region at the same row is connected to form an N+ diffusion region row, channel regions are arranged among the N+ diffusion region rows and are covered by the poly-silicon floating gates, each poly-silicon floating gate is formed by laminating a bottom poly-silicon floating gate and a top poly-silicon floating gate, the length of the top poly-silicon floating gate is smaller than the length of the bottom of the bottom poly-silicon floating gate, the length of the channel region is defined by the bottom poly-silicon floating gate in an alignment way, a third dielectric layer covers a surface of each N+ diffusion region, and a surface of the third dielectric layer is lower than or equal to a surface of the bottom poly-silicon floating gate. The invention also discloses a manufacturing method of the flash memory. By the flash memory, the coupling rate between the poly-silicon control gate and the poly-silicon floating gate can be improved, and meanwhile, the mutual interference between adjacent poly-silicon floating gates can be reduced.