The application relates to the field of
semiconductor manufacturing, and discloses a
wafer rotating wet treatment device which comprises fixing mechanisms arranged in four groups and distributed at equal intervals along the axis of a rotating cylinder, wherein the fixing mechanisms comprise communicating columns, the outer surfaces of the communicating columns are fixedly connected with support plates and limiting cylinders respectively, the outer surfaces of the limiting cylinders are sleeved with buffer cylinders, and the outer surfaces of the buffer cylinders are fixedly connected with containing cylinders through connecting columns. Negative pressure is generated in the inner cavities of the communicating tubes, the negative pressure is finally applied to the lower surface of a
wafer at the top of a suction disc under the communicating action of communicating cavities, communicating columns and hoses, so that
suction force for fixing the
wafer is generated, the
suction force can maintain the wafer in a state of relative static with the fixing mechanism as a whole at the lowest value when the wafer rotates, the design greatly simplifies the structure of the device, and the negative pressure adsorption and fixing function of the wafer is also achieved, and the fixing effect is good.