51results about How to "Reduce stress loss" patented technology

The invention discloses a rail-mounted vertical circulating three-dimensional garage which comprises a body frame, a basket parking unit and a drive chain wheel. The garage is characterized in that the body frame comprises a front frame and a rear frame, the front frame and the rear frame are each provided with a pair of symmetrical chain wheel track grooves in a fastened mode, an idler wheel trolley chain is installed in each chain track groove, the drive chain wheels are symmetrically installed below the front frame and the rear frame respectively and drive the idler wheel trolley chains respectively to move on the vertical face up and down in a circulating mode, the idler wheel trolley chains drive the basket parking unit to move up and down in a circulating mode, and all the components form the rail-mounted vertical circulating three-dimensional garage. The garage has the advantages of being simple and reasonable in structure, safe, reliable, easy to install, convenient to maintain, small in occupied area, large in parking number, and capable of achieving the purpose of increasing parking lots by improving structural strength of the frame and increasing the structural height.

The invention discloses a continuous coating production system of sheet substrates. The continuous coating production system comprises a feeding area, a working area and a discharge area, all of which are orderly communicated with each other; the feeding area comprises a sheet feeding table; the working area comprises a plurality of pre-vacuumizing chambers, a first transition chamber, a coating deposition chamber, a quick atmosphere annealing chamber and a plurality of pre-vacuumizing chambers orderly in the coating process flow direction; the discharge area comprises a discharge table; each chamber of the working area is provided with the desired vacuum environment. The continuous coating production system further comprises a transporting device capable of realizing linear transmission; the transporting device penetrates through the whole feeding area, the working area and the discharge area. The continuous coating system has the advantages that the regional continuous film deposition and annealing of a one-layer or multi-layer composite film containing a hot color coating material in the same production line are realized, the production efficiency is obviously improved, and meanwhile, the material loss cost of the material in the off-line annealing process after coating is reduced. Due to unique structural design of the system, the problem of tempering stress loss can be obviously solved; the stress of the tempered glass based smart glass produced by the system is up to the stress standard of the national building energy-saving safety glass, namely greater than or equal to 90Mpa.

The invention discloses a clip type pre-stress anchor cable active clip feeding and tension locking device and a use method. The clip type pre-stress anchor cable active clip feeding and tension locking device comprises a steel strand, a working anchor, a clip, an anchor matching plate, a tool anchor, a tool anchor clip and a jack, and is characterized in that the jack is a composite center hole jack, one end of the composite center hole jack is provided with a tension jack, and the other end of the composite center hole jack is used for locking a clip feeding and locking jack of the steel strand. The use method of the clip type pre-stress anchor cable active clip feeding and tension locking device includes the steps that after the tensioning force reaches a designed value and is stable, a clip feeding piston of the clip feeding and locking jack pushes the anchor matching plate, the anchor matching plate pushes the working anchor clip to move into a conical wedge hole of the working anchor, and therefore a steel strand bundle is actively wedged and locked. The clip type pre-stress anchor cable active clip feeding and tension locking device and the use method have the advantages that the clip feeding and locking jack pushes the corresponding anchor matching plate so as to enable the clip to move towards the wedge hole of the working anchor, the working anchor clip is wedged into the wedge hole of the working anchor while thrust of the clip feeding and locking jack increases, and therefore the steel strand bundle is clamped tightly; in this way, the steel strand can not be drawn back, the loss value of pre-stress does not need to be estimated, operation is more accurate, and errors are smaller.

This invention provides a sliding component of a compressor that has a high tensile strength, can develop satisfactory durability during operation, can realize ''familiarity'' in the earliest possible stage, and does not cause seizing during abnormal operation. Sliding components of compressors (17, 23, 24, 26, 39, 60, 96, 310b, 524, 526, 644, 646, 724, 726, 734, 736, 817, 821, 823, 824, 825, 826, 827, 921, and 924)comprise 2.0 to 2.7% by weight of carbon and 1.0 to 3.0% by weight of silicon with the balance consisting of iron containing unavoidable impurities. In this case, graphite is smaller than flake graphite in flake graphite cast iron, and the hardness of at least a part thereof is higher than HRB90 and lower than HRB100.

The invention discloses a stretchable quick stress compensation type steel frame connection structure used for connecting steel frames in tunnel primary support. The structure is provided with two opposite flange end plates, at least three inner thread connection elements connected with two opposite screws are arranged between the two flange end plates, and the inner thread connection elements are connected with the two screws with opposite thread directions. The structure has the advantages of being convenient to install, good in stability and little in stress loss, and can be used for connecting structural steel frames and grating steel frames in tunnel primary support steel frame stiffening.

The invention provides a forming method of a semiconductor device. The method is characterized in that a step of forming source/drain regions comprises the following substeps: determining a junction region and forming an auxiliary layer; with the auxiliary layer, a gate stack structure and isolation regions as masks, removing partial thickness of a semiconductor substrate in an active region to form a groove; and generating semiconductor materials in the groove to fill the groove, wherein the auxiliary layer covers the junction region; and the junction region comprises partial width of activeregion connected with the isolation regions. The invention also provides the semiconductor device. The semiconductor device is characterized in that semiconductor substrate materials are sandwiched between the source/drain regions and the isolation regions. The semiconductor device and the method are beneficial to leakage reduction.

The invention discloses a large-span floor slab reinforcing method. The large-span floor slab reinforcing method is characterized in that a diverter is arranged in the middle of a concrete floor slab between a wall and one concrete beam, a diverter is arranged in the middle of a concrete floor slab between every two adjacent concrete beams, a polyethylene board adheres to the top of one diverter, the thickness of each polyethylene board is 4mm, the top face of each polyethylene board is made to be a circular arc, the polyethylene boards are arranged at the tops of the diverters, prestressed tendons in the concrete floor slabs are distributed in a zigzag shape, preformed holes are formed in the concrete floor slabs, high-strength plastic casing pipes are embedded into the preformed holes, the diameter of each high-strength plastic casing pipe is 35-40mm, the prestressed tendons are arranged inside the high-strength plastic casing pipes, the inner sides of the high-strength plastic casing pipes are coated by molybdenumdimanganese, and a fine stone concrete layer is arranged on the concrete floor slabs.

The invention discloses an isolation area, which comprises a first groove embedded in a semiconductor substrate and an insulating layer filled in the first groove, wherein the first groove comprises a first side wall, a bottom wall and a second side wall which extends from the bottom wall and is connected with the first side wall, and an included angle between the first side wall and a normal line of the semiconductor substrate is more than a standard value. A forming method of the isolation area comprises the steps of: forming the first groove on the semiconductor substrate, wherein the included angle between the first side wall of the first groove and a normal line of the semiconductor substrate is more than the standard value; forming a mask on the side wall and forming a second groove on the semiconductor substrate by using the mask; and forming an insulating layer to fill the first groove and the second groove. In a semiconductor device and a forming method thereof, a semiconductor substrate material is clamped between the second groove for bearing a semiconductor layer, which is used for formation of a source area and a drain area, and the first side wall and the second side wall. The isolating area and the semiconductor device in the invention are beneficial to decrease of electric leakage.

The present invention is method of raising the piezoelectric performance and magnetoelectric performance of composite material with cross-linking polymer. The cross-linking polymer for the composite material may be polyvinylidene fluoride, polyethylene, epoxy resin, phenolic resin, unsaturated polyester resin, rubber or nylon. The present invention features that linear polymer is made to form crosslinked structure chemically or through irradiation. The chemical crosslinking process is to adding crosslinking agent or initiator into the composite material and the composite material is formed through mixing and hot pressing. The irradiating crosslinking process includes mixing the cross-linking polymer with the composition material, cold pressing to form at room temperature, and irradiating for crosslinking the polymer in the composite material.

A hybrid bi-directional DC/DC converter Bi-directional DC/DC convert is commonly used in new energy vehicle, a microgrid and that like have high power density, high efficiency, etc, the converter provided by the invention is based on a hybrid isolated three-level converter, coupled inductor, full bridge circuit, Half-bridge circuit composition, which has the same output and transmission characteristics as the traditional half-bridge converter, In addition, the converter can reduce the stress loss of the switch, greatly improve the transmission efficiency of the converter, and solve the problemof excessive loss of power devices and magnetic components caused by the mismatch of input and output voltages, so as to improve the transmission efficiency of the converter.

The invention relates to the technical field of bridge engineering, and discloses a self-resetting prefabricated assembled pier and a construction method thereof. The self-resetting prefabricated assembled pier comprises a prefabricated pier column and a foundation platform and further comprises prestressed tendons and energy dissipation connecting pieces; the prefabricated pier column and the foundation platform are connected into a whole through the prestressed tendons, one end of each prestressed tendon is used for anchoring a carrying structure at the top of the prefabricated pier column,and the other end anchors the foundation platform. The energy dissipation connecting pieces are connected with the bottoms of the prefabricated pier columns and the foundation platform. The assembledpier is simple in structure, convenient to operate and high in construction efficiency, the constructed assembled pier has self-resetting performance and good overturning resistance, the problem thatpier corner parts of existing assembled piers are prone to damage and breakage due to stress concentration is effectively solved, and the damaged parts are easy to repair.

The invention relates to the technical field of bridge construction, in particular to a cantilever beam vertical pipeline grouting double-pipe joint injection construction method. The construction method comprises the following steps: firstly, blanking the vertical prestressed tendon and the vertical prestressed casing; next, the vertical prestressed casing after blanking is processed into holes;next, the vertical prestressed tendon is assembled; next, the assembled vertical prestressed tendons are positioned and installed at the same time of the web reinforcement binding; next, the bottom oftwo adjacent vertical prestressed casing pipes are communicated; next, the vertical prestressed steel bar is tensioned; finally, the grout is pressed into the vertical prestressed casing. By adoptingthe construction method, the grouting in the vertical prestressed tendons can be made more dense and full, so that the bonding effect of the grouting concrete on the prestressed tendons is more prominent, the stress loss of the vertical prestressed tendons is avoided to a greater extent, and the cantilever beam concrete has better crack resistance.