The invention discloses a plating method for an iron-nickel alloy frame. The plating method comprises the following steps that 1, the iron-nickel alloy frame is fixed, specifically, the iron-nickel alloy frame is fixedly hung on a bracket; 2, cathode-anode combined degreasing is conducted; 3, pickling is carried out; 4, copper pre-plating is conducted; 5, copper plating is conducted, specifically, the iron-nickel alloy frame subjected to copper pre-plating treatment is put into a copper sulfate electrolytic solution to be used as a cathode, a copper plate serves as an anode, and a power source is connected; after copper plating is finished, the iron-nickel alloy frame is washed by clear water for the third time; 6, copper protecting is carried out, specifically, the bracket is put in a copper protective agent solution, and it is ensured that the iron-nickel alloy frame is immersed into the solution entirely; a layer of colorless and transparent thin film is formed on the surface of the iron-nickel alloy frame; and 7, drying is carried out, specifically, the iron-nickel alloy frame is taken down from the bracket, and the plating process is completed. The iron-nickel alloy leading wire frame obtained through the plating method has the advantages that the conductive performance is good, and the production and use standards of a semiconductor chip are met.