A leadless hyperthermia electronic solder and preparing method thereof are disclosed. The solder is composed of alloy elements according to flowing percentage by weight: 10-224546014f Sb, 1-84550160f Cu, 0.01-224446740f Ni, 0-0.012f X, residue percent of Sn; wherein X represents zero species, one species or composition of optimal several species of Ga, P and mixed rare earth; the fusion point of the solder is between 240 DEG C to 320 DEG C, the tensile strength is 58-84MPa; the preparing method of the solder is: thermal insulating the prepared each alloy element at a temperature ranging from 850 DEG C to 900 DEG C for 1-2 hours by using a vacuum melting furnace or an antivacuum smelting furnace to melt them sufficiently, and mixing them sufficiently before discharged from the furnace, pouring, solidifying to obtain the solder; the solder is made into at least one of solder master alloy, solder block, soldered ball, soldering ring, soldering foil, soldering powder or soldering cream; the solder is provided with a higher fusion point to improve the fusion activity of solder, enhanced credibility of device, good antioxidant ability and excellent humectation performance.