The invention relates to
soldering fluid technique, which is a
modified technique based on prior art, specifically relates to a
mildew resistant antibiotic low-corrosivity water-based
soldering fluid, comprising components with following percentage by weight (): 1.0% of
active agent, 1.0% of micro-enwrapping agent, 0.1% of surfactant, 0.01% of
mildew resistant antibiotic agent, residue is
solvent of de-ionized water, and the weight sum of each components are 100 The advantages of the invention are: the
soldering fluid contains no volatile
organic matter or
halide, and can inhibit development of microorganisms such as
bacteria and fungi and
mildew; circuit and conveyor are not eroded during
welding, no cleaning is needed after welded, and the soldering fluid is safe and environmentally-friendly; the soldering fluid can be coated on the PCB plate weld face by spraying, dipping or foaming mode to implement leadless
welding of electronic products. The invented soldering fluid is practical and has great
market potential.