25 results about "Glass waveguide" patented technology

A thin and light optical waveguide lens, which can be applied to a display device. The optical waveguide lens comprises waveguide plates (1) made of a wide bandgap semiconductor material and protective films (2) made of an optical resin material; at least one surface of the waveguide plates (1) is provided with a grating structure (11); the protective films (2) are arranged on the surfaces of the waveguide plates (1), and are embedded in grating gaps of the grating structure (11); and the outer side surfaces of the corresponding protective film (2) and the grating structure (11) are approximately located on the same plane, and / or said protective film (2) covers the outer side surface of the grating structure (11). According to the optical waveguide lens, high-refractive-index glass waveguide plates (1) having a refractive index of 1.7-1.9 are replaced with the waveguide plates (1) made of the wide bandgap semiconductor material, and cover glass is replaced with the protective films (2) made of the optical resin material, such that hardening, scratch resistance, anti-fog, anti-slip, anti-smudge, high light transmittance and other functions are integrated while the waveguide plates (1) are protected on both sides, the overall thickness of the optical waveguide lens is reduced and the optical properties are improved.

Described herein are pluggable fiber-attach-first techniques and related manufacturing methods for assembling photonic chips according to the fiber-attach-first technique. The techniques may be used in several fields including, but not limited to, 2D, 2.5D, and 3D package architectures, wafer scale packaging technologies, and transceiver technologies. A photonic device comprises a photonic stack (120), a glass substrate (140) and epoxy configured to hold the photonic stack (120) and the glass substrate (140) together. The photonic stack (120) comprises one or more alignment features. The glass substrate comprises one or more alignment features (142) wherein each of the one or more alignment features (142) of the glass substrate (140) engage with a corresponding alignment feature (132) of the photonic stack (120) such that one or more waveguides of the photonic stack are optically coupled with one or more glass waveguides (144) of the glass substrate (140).

A glass substrate architecture for mounting RF components may be configured for heat dissipation. Existing millimeter wave radiofrequency (RF) systems mount the radiofrequency integrated circuits (RFICs) on a printed circuit board on the opposite side of a heat sink, making it difficult to dissipate heat away from the RFICs during operation. This architecture mounts the RFICs directly to a back side of a glass waveguide substrate, and thermally couples the top side of the RFICs to a conductive pad on the underlying printed circuit board with a thermal pathway to the heatsink. This leads to a much more effective dissipation of heat away from the RFICs and eliminates the need for additional cooling systems or throttling the performance of the radar system.

Described herein are systems and techniques for providing photonic devices having efficient optical coupling between waveguides. The photonic devices comprise a glass substrate having glass waveguides and a photonic integrated circuit (PIC) having PIC waveguides evanescently coupled with the glass waveguides. The waveguides may have recesses disposed between adjacent waveguides to allow for excess adhesive to be squeezed out. The PIC may have a trench exposing the waveguide layer of the PIC, thus reducing the gap between the PIC waveguides and the glass waveguides when coupled.

The present invention discloses a glass waveguide-based optoelectronic hybrid device and a manufacturing method thereof, comprising: a first organic substrate, a glass substrate, and an optoelectronic chip; a glass waveguide and an electrical interconnection structure connecting the upper and lower surfaces of the glass substrate are provided on the inner side of the upper surface of the glass substrate; the optoelectronic chip is mounted on the outer side of the upper surface of the glass substrate, an electrical connection port of the optoelectronic chip is connected to the electrical interconnection structure, and the optical connection port of the optoelectronic chip is arranged opposite the first end of the glass waveguide so that light passing through the first end enters the optical connection port; the lower surface of the glass substrate is connected to the first organic substrate and is connected to a first conductive circuit provided in the first organic substrate via the electrical interconnection structure, so that the first conductive circuit is connected to the electrical connection port of the optoelectronic chip; the coupling degree of the optical path and the light transmission efficiency are improved.

According to the photoelectric packaging structure provided by the utility model, the glass waveguide layer structure is constructed by combining the glass complex with the protective layer, the first groove and the second groove for exposing the glass waveguide layer are formed, the optical lens is arranged in the first groove, and the optical connector is connected in the second groove. And the optical signal port of the optical chip and the optical lens are correspondingly arranged, so that the optical connection between the optical lens and the glass waveguide layer and the optical connection between the optical connector and the glass waveguide layer are realized, thereby forming an optical transmission path, and photoelectric interconnection can be realized through the electric chip, the rewiring and the metal column. Therefore, efficient and accurate transmission of photoelectric signals is ensured, the packaging size is reduced, the power consumption is reduced, the reliability is improved, the device is suitable for high-density integrated packaging, and good photoelectric transmission can be realized.

Disclosed is an optical coupling element for enabling evanescent coupling between a PIC waveguide and a glass waveguide that includes an optical waveguide, wherein a first end of the optical waveguide has a first tapered structure to enable first optical coupling with the PIC waveguide, and wherein a second end of the optical waveguide has a second tapered structure to enable second optical coupling with the glass waveguide, wherein each of the first and second tapered structures are configured to enable maximum coupling efficiency between the PIC waveguide and the glass waveguide.

The application discloses an optoelectronic module based on a glass-based waveguide substrate, which comprises a glass-based waveguide substrate, an organic medium layer arranged outside the upper surface of the glass-based waveguide substrate and an optoelectronic chip; a glass waveguide is arranged in the upper surface of the glass-based waveguide substrate, the first end of the glass waveguide is provided with a bevel with a preset angle, and the bevel with the preset angle is used for reflecting light incident from the second end of the glass waveguide in a direction away from the upper surface of the glass-based waveguide substrate; the organic medium layer is provided with a light through hole and a conductive circuit, one end of the light through hole is connected to the first end, so that the light reflected by the bevel with the preset angle passes through the light through hole to the other end of the light through hole; the optoelectronic chip comprises an optical connection port and an electrical connection port, the electrical connection port is connected to the conductive circuit when the optoelectronic chip is installed, and the optical connection port is connected to the other end of the light through hole; so that the optical path loss is effectively reduced, and the optical path transmission efficiency is improved.

The application provides a millimeter wave rectangular waveguide embedded gap waveguide filter, which comprises, from top to bottom, an upper metal cover plate, an intermediate metal block and a lower metal cover plate; the upper metal cover plate is provided with a coaxial input port; the lower metal cover plate is provided with a coaxial output port; the upper surface and the lower surface of the intermediate metal block are provided with a first periodic metal pin array and a second periodic metal pin array; the first periodic metal pin array and the second periodic metal pin array are respectively provided with a gap between the upper metal cover plate and the lower metal cover plate; the first periodic metal pin array surrounds a first slot gap waveguide resonant cavity on the upper surface of the intermediate metal block; the second periodic metal pin array surrounds a second slot gap waveguide resonant cavity on the lower surface of the intermediate metal block; a rectangular waveguide resonant cavity formed by hollowing out the inside of the intermediate metal block is in communication with the first slot gap waveguide resonant cavity and the second slot gap waveguide resonant cavity respectively.

The invention provides an optical interconnection packaging structure and a manufacturing method thereof, which can better adapt to the transmission of high-speed signals and can improve the optical port density of optical coupling, thereby improving the density of interconnection bandwidth and improving the photoelectric fusion efficiency. The optical interconnection package structure includes: a glass substrate in which a groove is formed on an upper surface side and a glass waveguide that couples a side surface of the groove to a side surface of the glass substrate is formed; the optical chip is embedded in the groove and is used for transmitting and receiving optical signals from the outside through the glass waveguide; and an electrical chip which is disposed on the upper surface of the glass substrate, is electrically connected to the optical chip via the glass substrate, and transmits and receives electrical signals to and from the optical chip.

An integrated glass waveguide assembly is provided. The integrated glass waveguide assembly includes a core unit assembly, and the core unit assembly includes a substrate, a transceiver chip attached to the substrate, and a polarization maintaining optical waveguide comprising a first end and a second end. The first end is connected to the transceiver chip, the second end is positioned proximate to an edge of the substrate, and the second end is configured to be connected to a polarization maintaining fiber to form an optical path with a laser module.

The invention discloses an asymmetric Y-type multiplexer based on lithium niobate and chalcogenide glass material, which comprises a Z-cut lithium niobate film layer and a chalcogenide glass waveguide layer, the chalcogenide glass waveguide layer is arranged on the surface of the Z-cut lithium niobate film layer, the chalcogenide glass waveguide layer comprises a chalcogenide glass film and a Y-type waveguide, and the Y-type waveguide is arranged on the surface of the Z-cut lithium niobate film layer. The Y-shaped waveguide is composed of a first auxiliary waveguide, a second auxiliary waveguide, a coupling area and a main waveguide, the first auxiliary waveguide and the second auxiliary waveguide form a heat insulation coupler, the width of the first auxiliary waveguide is gradually narrowed to W3 from W1, the width of the second auxiliary waveguide is gradually widened to W3 from W2, W1 is larger than W2, and W3 is larger than W2. One ends of the first auxiliary waveguide and the second auxiliary waveguide with the same width of W3 are respectively connected with one end of the coupling area, and the other end of the coupling area is connected with the main waveguide. The multiplexer can realize high-precision phase matching among different modes, effectively suppress mode crosstalk, improve mode separation and transmission efficiency, and has a good application prospect in a high-performance mode division multiplexing integrated optical path.

Described herein are pluggable fiber-attach-first techniques and related manufacturing methods for assembling photonic chips according to the fiber-attach-first technique. The techniques may be used in several fields including, but not limited to, 2D, 2.5D, and 3D package architectures, wafer scale packaging technologies, and transceiver technologies. A photonic device comprises a photonic stack, a glass substrate and epoxy configured to hold the photonic stack and the glass substrate together. The photonic stack comprises one or more alignment features. The glass substrate comprises one or more alignment features, wherein each of the one or more alignment features of the glass substrate engage with a corresponding alignment feature of the photonic stack such that one or more waveguides of the photonic stack are optically coupled with one or more glass waveguides of the glass substrate.

To provide a see-through computer display system having a desirable vision correction and an improved content density.SOLUTION: The specification of the present application provides an example of an impact-resistive glass waveguide structure for a see-through head part equipment type computer display. In the embodiment, the structure includes a vision correction through an electrochromic and / or photochromic system and a content density control.SELECTED DRAWING: Figure 4

The invention provides a millimeter wave rectangular waveguide embedded gap waveguide filter. The filter comprises an upper metal cover plate, a middle metal block and a lower metal cover plate which are sequentially assembled from top to bottom, the upper metal cover plate is provided with a coaxial input port. The lower metal cover plate is provided with a coaxial output port. A first periodic metal pin array and a second periodic metal pin array are arranged on the upper surface and the lower surface of the middle metal block; gaps are formed between the first periodic metal pin array and the upper-layer metal cover plate and between the second periodic metal pin array and the lower-layer metal cover plate respectively; the first periodic metal pin array encloses a first slot gap waveguide resonant cavity on the upper surface of the middle metal block; the second periodic metal pin array encloses a second slot gap waveguide resonant cavity on the lower surface of the middle metal block; and a rectangular waveguide resonant cavity formed by hollowing in the middle metal block is respectively communicated with the first slot gap waveguide resonant cavity and the second slot gap waveguide resonant cavity.

The invention discloses a porous silicon-based three-dimensional optical waveguide preparation method based on a femtosecond laser local induced collapse densification mechanism, and belongs to the technical field of three-dimensional photon integration. By utilizing the hot working characteristic of high repetition frequency femtosecond laser, local collapse of a porous structure is induced through femtosecond laser direct writing in an oxidized porous silicon thin film material on a silicon substrate to form a densified track with an improved refractive index, and the size of a single track exceeds the Abbe diffraction limit; and arranging a plurality of sub-diffraction precision tracks in space according to a photonic lattice-like structure to form the porous silicon-based three-dimensional waveguide. According to the femtosecond laser direct writing glass waveguide, sub-diffraction order precision three-dimensional regulation and control of the waveguide section shape and the refractive index are achieved, the refractive index change is in the magnitude of 10 <-2 >, a more compact bending design superior to other reported femtosecond laser direct writing glass waveguides is provided, and by designing the waveguide structure, the bending performance of the femtosecond laser direct writing glass waveguide is improved. Flexible control of a mode field and low insertion loss when a standard optical fiber system is accessed are realized.

Described herein are fiber-connection structures for photonic integrated circuits (PICs). These fiber connection structures enable efficient optical coupling between integrated waveguides and corresponding optical fibers by facilitating reliable edge coupling. The fiber-connection designs developed by the inventor improve upon conventional approaches by increasing fan-out fiber capability, coupling efficiency and scalability. A photonic package comprises a substrate, a PIC, an application-specific integrated circuit (ASIC) and a glass coupler. The PIC is attached to the substrate and comprises a PIC waveguide having an end adjacent an edge of the PIC. The ASIC is attached to the PIC. The glass coupler is attached to the PIC and comprises a glass waveguide optically coupled to the PIC waveguide.

Described herein are fiber-connection structures for photonic integrated circuits (PICs). These fiber connection structures enable efficient optical coupling between integrated waveguides and corresponding optical fibers by facilitating reliable edge coupling. The fiber-connection designs developed by the inventor improve upon conventional approaches by increasing fan-out fiber capability, coupling efficiency and scalability. A photonic package comprises a substrate, a PIC, an application-specific integrated circuit (ASIC) and a glass coupler. The PIC is attached to the substrate and comprises a PIC waveguide having an end adjacent an edge of the PIC. The ASIC is attached to the PIC. The glass coupler is attached to the PIC and comprises a glass waveguide optically coupled to the PIC waveguide.

The present invention belongs to the technical field of semiconductor manufacturing. Provided are a 3D optoelectronic interconnection packaging structure and a preparation method therefor. A glass waveguide structure can be constructed using a glass composite in combination with a dielectric layer. By means of forming a through trench which exposes a glass waveguide layer and bonding a lateral light-emitting chip in the through trench, a light transmission path can be constructed by a photosensitive region of the lateral light-emitting chip and the glass waveguide layer; and optoelectronic interconnection can be realized by means of the interconnection between metal pillars, redistribution layers and an adapter plate. The present invention can achieve optoelectronic interconnection integration, reduce package size, lower power consumption and improve reliability, and is applicable to high-density integration packaging and can achieve good optoelectronic transmission.

The invention relates to a photoelectric packaging structure, and the structure comprises a glass substrate, and the two opposite sides of the glass substrate are a first surface and a second surface respectively; the vertical glass waveguide vertically extends along the thickness direction of the glass substrate and penetrates through two opposite surfaces of the glass substrate; the optical chip is attached to the first surface of the glass substrate, and an optical signal port of the optical chip is connected with one end of the vertical glass waveguide to form optical coupling; and the optical fiber array is fixed on the second surface of the glass substrate, and optical fibers in the optical fiber array are connected with the other end of the vertical glass waveguide to form optical coupling.

Provided are a photoelectric hybrid device based on glass waveguide and manufacturing method thereof. The device comprises a first organic substrate, a glass substrate and a photoelectric chip; an inner side of an upper surface of the glass substrate is provided with a glass waveguide and an electrical interconnection structure communicating the upper surface and a lower surface of the glass substrate; the photoelectric chip is installed on an outer side of the upper surface of the glass substrate, an electrical connection port of the photoelectric chip is connected with the electrical interconnection structure, and an optical connection port of the photoelectric chip is arranged opposite to a first end of the glass waveguide; and the lower surface of the glass substrate is connected with the first organic substrate, and also connected with the first conductive trace arranged in the first organic substrate through the electrical interconnection structure.

This utility model relates to the field of augmented reality display technology, and discloses a waveguide device and an augmented reality device. The waveguide device includes a projection module and a waveguide module. The projection module is used to project an image source. The waveguide module is used to conduct and emit an image beam, including a thin-film waveguide layer, a lens substrate, a blocking layer, and a compensation layer for compensating the emitted image beam. The thin-film waveguide layer includes a dielectric thin film, and a coupling grating, a folding grating, and an output grating disposed on the dielectric thin film. After the image source is projected by the projection module, it enters the folding grating through the coupling grating, and then exits through the output grating. After being compensated by the compensation layer, it is emitted. This utility model replaces the traditional block glass waveguide with a thin-film waveguide layer, realizing the decoupling of the light transmission medium and the lens substrate. This facilitates a more reasonable configuration that meets application requirements, effectively improves the manufacturing yield and durability, and reduces costs, which is beneficial for large-scale production and market promotion.

The present invention discloses a head-up display and an operating method thereof, wherein the head-up display includes an image generating unit and a waveguide glass. The waveguide glass faces the image generating unit. The waveguide glass includes a first microstructure, a second microstructure, and a third microstructure. The first microstructure has a first width. The second microstructure is adjacent to the first microstructure. The third microstructure is adjacent to the second microstructure. The third microstructure has adjacent joint regions. The spacing between two adjacent joint regions is less than half the first width.

The invention relates to an AR glasses waveguide ghosting dynamic correction method based on brightness optimization, and the method comprises the following steps: 1, enabling an optical machine to project a detection image to a left lens and a right lens, and enabling cameras disposed on the left lens and the right lens to shoot the detection image; step 2, defining a selected area for the edge position of the detection image, detecting the maximum brightness value and the average brightness value of the selected area, if the maximum brightness value of the selected area is greater than a set threshold value and the number of repeated detection times does not reach the maximum set number of times, executing the next step, otherwise, executing step 8; 3, recording the initial angle positions of the left light machine and the right light machine and the maximum brightness value of the corresponding selected area, recording the initial angle position of the left light machine as txLinitial, and recording the initial angle position of the right light machine as txRinitial. According to the invention, the projection position of the ray machine can be accurately adjusted in an automatic and data-driven manner, so that the ghosting is removed, and misjudgment caused by the ghosting during subsequent ghosting detection is prevented.

The invention discloses a photoelectric co-packaging structure and a preparation method thereof. The photoelectric co-packaging structure comprises an optical waveguide amplifier, an optical fiber connector, an LED vertical pumping array, an electronic integrated chip, a photonic integrated chip and an evanescent wave interlayer coupling structure, electric signal transmission between the chips is realized through electrical interconnection structures such as TGV and RDL; wherein the evanescent wave interlayer coupling between the optical waveguide amplifier and the photonic integrated chip adopts a gain material as a binder. According to the invention, a spin-coated gain material with matched refractive index is used as a binder for coupling between evanescent wave layers between a glass waveguide and a photonic integrated chip in photoelectric co-packaging based on a glass adapter plate, and an LED vertical pump array is introduced into a packaging structure to provide pump light, so that coupling between evanescent wave layers with a loss compensation function is realized; the gain material can be used as a binder in a scheme that any waveguide passes through evanescent wave interlayer coupling.