14 results about "Glass waveguide" patented technology

A glass substrate architecture for mounting RF components may be configured for heat dissipation. Existing millimeter wave radiofrequency (RF) systems mount the radiofrequency integrated circuits (RFICs) on a printed circuit board on the opposite side of a heat sink, making it difficult to dissipate heat away from the RFICs during operation. This architecture mounts the RFICs directly to a back side of a glass waveguide substrate, and thermally couples the top side of the RFICs to a conductive pad on the underlying printed circuit board with a thermal pathway to the heatsink. This leads to a much more effective dissipation of heat away from the RFICs and eliminates the need for additional cooling systems or throttling the performance of the radar system.

Described herein are systems and techniques for providing photonic devices having efficient optical coupling between waveguides. The photonic devices comprise a glass substrate having glass waveguides and a photonic integrated circuit (PIC) having PIC waveguides evanescently coupled with the glass waveguides. The waveguides may have recesses disposed between adjacent waveguides to allow for excess adhesive to be squeezed out. The PIC may have a trench exposing the waveguide layer of the PIC, thus reducing the gap between the PIC waveguides and the glass waveguides when coupled.

The application discloses an optoelectronic module based on a glass-based waveguide substrate, which comprises a glass-based waveguide substrate, an organic medium layer arranged outside the upper surface of the glass-based waveguide substrate and an optoelectronic chip; a glass waveguide is arranged in the upper surface of the glass-based waveguide substrate, the first end of the glass waveguide is provided with a bevel with a preset angle, and the bevel with the preset angle is used for reflecting light incident from the second end of the glass waveguide in a direction away from the upper surface of the glass-based waveguide substrate; the organic medium layer is provided with a light through hole and a conductive circuit, one end of the light through hole is connected to the first end, so that the light reflected by the bevel with the preset angle passes through the light through hole to the other end of the light through hole; the optoelectronic chip comprises an optical connection port and an electrical connection port, the electrical connection port is connected to the conductive circuit when the optoelectronic chip is installed, and the optical connection port is connected to the other end of the light through hole; so that the optical path loss is effectively reduced, and the optical path transmission efficiency is improved.

The application provides a millimeter wave rectangular waveguide embedded gap waveguide filter, which comprises, from top to bottom, an upper metal cover plate, an intermediate metal block and a lower metal cover plate; the upper metal cover plate is provided with a coaxial input port; the lower metal cover plate is provided with a coaxial output port; the upper surface and the lower surface of the intermediate metal block are provided with a first periodic metal pin array and a second periodic metal pin array; the first periodic metal pin array and the second periodic metal pin array are respectively provided with a gap between the upper metal cover plate and the lower metal cover plate; the first periodic metal pin array surrounds a first slot gap waveguide resonant cavity on the upper surface of the intermediate metal block; the second periodic metal pin array surrounds a second slot gap waveguide resonant cavity on the lower surface of the intermediate metal block; a rectangular waveguide resonant cavity formed by hollowing out the inside of the intermediate metal block is in communication with the first slot gap waveguide resonant cavity and the second slot gap waveguide resonant cavity respectively.

The invention provides an optical interconnection packaging structure and a manufacturing method thereof, which can better adapt to the transmission of high-speed signals and can improve the optical port density of optical coupling, thereby improving the density of interconnection bandwidth and improving the photoelectric fusion efficiency. The optical interconnection package structure includes: a glass substrate in which a groove is formed on an upper surface side and a glass waveguide that couples a side surface of the groove to a side surface of the glass substrate is formed; the optical chip is embedded in the groove and is used for transmitting and receiving optical signals from the outside through the glass waveguide; and an electrical chip which is disposed on the upper surface of the glass substrate, is electrically connected to the optical chip via the glass substrate, and transmits and receives electrical signals to and from the optical chip.

An integrated glass waveguide assembly is provided. The integrated glass waveguide assembly includes a core unit assembly, and the core unit assembly includes a substrate, a transceiver chip attached to the substrate, and a polarization maintaining optical waveguide comprising a first end and a second end. The first end is connected to the transceiver chip, the second end is positioned proximate to an edge of the substrate, and the second end is configured to be connected to a polarization maintaining fiber to form an optical path with a laser module.

Described herein are fiber-connection structures for photonic integrated circuits (PICs). These fiber connection structures enable efficient optical coupling between integrated waveguides and corresponding optical fibers by facilitating reliable edge coupling. The fiber-connection designs developed by the inventor improve upon conventional approaches by increasing fan-out fiber capability, coupling efficiency and scalability. A photonic package comprises a substrate, a PIC, an application-specific integrated circuit (ASIC) and a glass coupler. The PIC is attached to the substrate and comprises a PIC waveguide having an end adjacent an edge of the PIC. The ASIC is attached to the PIC. The glass coupler is attached to the PIC and comprises a glass waveguide optically coupled to the PIC waveguide.

Described herein are fiber-connection structures for photonic integrated circuits (PICs). These fiber connection structures enable efficient optical coupling between integrated waveguides and corresponding optical fibers by facilitating reliable edge coupling. The fiber-connection designs developed by the inventor improve upon conventional approaches by increasing fan-out fiber capability, coupling efficiency and scalability. A photonic package comprises a substrate, a PIC, an application-specific integrated circuit (ASIC) and a glass coupler. The PIC is attached to the substrate and comprises a PIC waveguide having an end adjacent an edge of the PIC. The ASIC is attached to the PIC. The glass coupler is attached to the PIC and comprises a glass waveguide optically coupled to the PIC waveguide.

The present invention belongs to the technical field of semiconductor manufacturing. Provided are a 3D optoelectronic interconnection packaging structure and a preparation method therefor. A glass waveguide structure can be constructed using a glass composite in combination with a dielectric layer. By means of forming a through trench which exposes a glass waveguide layer and bonding a lateral light-emitting chip in the through trench, a light transmission path can be constructed by a photosensitive region of the lateral light-emitting chip and the glass waveguide layer; and optoelectronic interconnection can be realized by means of the interconnection between metal pillars, redistribution layers and an adapter plate. The present invention can achieve optoelectronic interconnection integration, reduce package size, lower power consumption and improve reliability, and is applicable to high-density integration packaging and can achieve good optoelectronic transmission.

The invention relates to a photoelectric packaging structure, and the structure comprises a glass substrate, and the two opposite sides of the glass substrate are a first surface and a second surface respectively; the vertical glass waveguide vertically extends along the thickness direction of the glass substrate and penetrates through two opposite surfaces of the glass substrate; the optical chip is attached to the first surface of the glass substrate, and an optical signal port of the optical chip is connected with one end of the vertical glass waveguide to form optical coupling; and the optical fiber array is fixed on the second surface of the glass substrate, and optical fibers in the optical fiber array are connected with the other end of the vertical glass waveguide to form optical coupling.

Provided are a photoelectric hybrid device based on glass waveguide and manufacturing method thereof. The device comprises a first organic substrate, a glass substrate and a photoelectric chip; an inner side of an upper surface of the glass substrate is provided with a glass waveguide and an electrical interconnection structure communicating the upper surface and a lower surface of the glass substrate; the photoelectric chip is installed on an outer side of the upper surface of the glass substrate, an electrical connection port of the photoelectric chip is connected with the electrical interconnection structure, and an optical connection port of the photoelectric chip is arranged opposite to a first end of the glass waveguide; and the lower surface of the glass substrate is connected with the first organic substrate, and also connected with the first conductive trace arranged in the first organic substrate through the electrical interconnection structure.

This utility model relates to the field of augmented reality display technology, and discloses a waveguide device and an augmented reality device. The waveguide device includes a projection module and a waveguide module. The projection module is used to project an image source. The waveguide module is used to conduct and emit an image beam, including a thin-film waveguide layer, a lens substrate, a blocking layer, and a compensation layer for compensating the emitted image beam. The thin-film waveguide layer includes a dielectric thin film, and a coupling grating, a folding grating, and an output grating disposed on the dielectric thin film. After the image source is projected by the projection module, it enters the folding grating through the coupling grating, and then exits through the output grating. After being compensated by the compensation layer, it is emitted. This utility model replaces the traditional block glass waveguide with a thin-film waveguide layer, realizing the decoupling of the light transmission medium and the lens substrate. This facilitates a more reasonable configuration that meets application requirements, effectively improves the manufacturing yield and durability, and reduces costs, which is beneficial for large-scale production and market promotion.

The invention relates to an AR glasses waveguide ghosting dynamic correction method based on brightness optimization, and the method comprises the following steps: 1, enabling an optical machine to project a detection image to a left lens and a right lens, and enabling cameras disposed on the left lens and the right lens to shoot the detection image; step 2, defining a selected area for the edge position of the detection image, detecting the maximum brightness value and the average brightness value of the selected area, if the maximum brightness value of the selected area is greater than a set threshold value and the number of repeated detection times does not reach the maximum set number of times, executing the next step, otherwise, executing step 8; 3, recording the initial angle positions of the left light machine and the right light machine and the maximum brightness value of the corresponding selected area, recording the initial angle position of the left light machine as txLinitial, and recording the initial angle position of the right light machine as txRinitial. According to the invention, the projection position of the ray machine can be accurately adjusted in an automatic and data-driven manner, so that the ghosting is removed, and misjudgment caused by the ghosting during subsequent ghosting detection is prevented.

The invention discloses a photoelectric co-packaging structure and a preparation method thereof. The photoelectric co-packaging structure comprises an optical waveguide amplifier, an optical fiber connector, an LED vertical pumping array, an electronic integrated chip, a photonic integrated chip and an evanescent wave interlayer coupling structure, electric signal transmission between the chips is realized through electrical interconnection structures such as TGV and RDL; wherein the evanescent wave interlayer coupling between the optical waveguide amplifier and the photonic integrated chip adopts a gain material as a binder. According to the invention, a spin-coated gain material with matched refractive index is used as a binder for coupling between evanescent wave layers between a glass waveguide and a photonic integrated chip in photoelectric co-packaging based on a glass adapter plate, and an LED vertical pump array is introduced into a packaging structure to provide pump light, so that coupling between evanescent wave layers with a loss compensation function is realized; the gain material can be used as a binder in a scheme that any waveguide passes through evanescent wave interlayer coupling.