A dense-
pitch small-pad
copper wire bonded double IC
chip stack
package comprises a plastic
package body, in which a
lead frame carrier and a frame lead inner pin are arranged; the upper surface of the
lead frame carrier is fixedly connected with a first IC
chip; a second IC
chip is stacked on the first IC chip; the upper surface of the first IC chip and the upper surface of the second IC chip are respectively provided with a plurality of pads which are arranged as two lines of pad groups in parallel; the two pad groups are respectively a first pad group and a second pad group; a
metal ball is implanted on each pad; each
metal ball is connected with a first
copper bonding ball; and a third
copper bonding wire is formed by looping and arching on a corresponding
metal ball between the second IC chip and the first IC chip. The preparation process of the present invention comprises
thinning, scribing, loading the chip, performing pressure
welding,
plastic packaging and post-curing, trimming,
electroplating, printing, forming and separating, and packaging. The
package and the preparation method of the invention avoid the hidden danger of open circuit of a
plastic packaging punching wire caused by the crater on the pad, the
short circuit of adjacent
welding spots, and the easy damage of a previous wire.