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90results about How to "Increased switching losses" patented technology

United electric energy quality controller based on series multiplex of transformer and chain type construction

The invention relates to a unified power energy quality controller based on the serial-connection multiplicity of transformers and a chain structure, which belongs to the technical filed of flexible AC transmission and distribution of an electric power system and the power electronic. The unified power quality controller comprises a single-phase serial-connection multiple transformer bank and a single-phase chain H bridge converter, wherein the transformer bank consists of m single-phase transformers which form the serial-connection multiple transformer bank together with n voltage source converters connected with n secondary windings of m single-phase transformers respectively; the single-phase chain H bridge converter is provided with n chains and is formed by connecting n DC voltage supporting units and n power source converters, and an AC port of the n-chain single-phase chain H bridge converter is directly connected with the electric fence through a reactor, m and n are signless integrals equal to or more than 2, and m is less than or equal to n. The invention can realize accurate current control, has high dynamic responding speed, and can solve the problems of the traction substation of an electrified railway that the three-phase voltage is unstable and fluctuates, the power factor is low and the harmonic pollution exists, and the like.
Owner:TSINGHUA UNIV

Reverse blocking type IGBT and manufacturing method therefor

The invention discloses a reverse blocking type IGBT and a manufacturing method therefor, and belongs to the technical field of a power semiconductor device. By introducing a floating P type body region on one side of a trench gate and introducing a trench collector structure in a collector region and a field stop layer, the positive breakdown voltage of a device is improved without influencing the threshold voltage and switch-on of an IGBT device; the gate-collector capacitance is lowered, and adverse influence caused by a Miller effect can be relieved; the overall gate capacitance is lowered, the switching speed of the device is improved, the switching loss of the device is lowered, and the compromising relation between forward switch-on voltage drop and switch-off loss of the conventional CSTBT device is improved; the problems of current, voltage oscillation and EMI in the device starting dynamic process can be avoided, and device reliability is improved; the current carrier enhancement effect at the emitter end of the device is improved, the current carrier concentration distribution in a drift region can be improved, and compromising between forward switch-on voltage drop andswitch-off loss can be further improved; and the reverse breakdown voltage of the device is improved, and high forward characteristic of the device is ensured while excellent reverse blocking performance is obtained.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Trench gate insulated gate bipolar transistor (IGBT) device and manufacturing method thereof

The present invention relates to a trench gate IGBT device and a manufacturing method thereof, and belongs to the power semiconductor device technology field, and relates to an insulated gate bipolar transistor. According to the present invention, by introducing a composite trench structure and a carrier storage layer which are coupled mutually, and introducing an electrode connected with an emitter at the bottom of a gate electrode of an injection enhanced gate transistor (IEGT) device, on one hand, the depth and width of the gate electrode are reduced under a certain trench depth and width, on the other hand, by the shielding effect of the introduced electrode connected with the emitter, the gate capacitance, especially the gate-collector capacitance of the device is reduced, the switching speed of the device is improved, the switching loss of the device is reduced. Meanwhile, by introducing the coupled carrier storage layer, the adverse effect to the positive conduction characteristic of the device which is caused by introducing the gate electrode connected with the emitter is compensated, further the carrier concentration distribution of a whole drift region is improved, and the better compromise of the device positive conduction voltage drop and the switching loss is obtained.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Novel three-level NPC current converter modulation and midpoint level control strategy

InactiveCN108768196AReduce switching lossesLow switching loss and high efficiencyAc-dc conversionThree levelPower factor
The invention discloses a novel three-level NPC current converter modulation and midpoint level control strategy comprising the steps of 1, firstly acquiring an upward modulating wave U*p and a downward modulating wave U*n; 2, decomposing the upward modulating wave U*p into U*p1 and U*p2, decomposing the downward modulating wave U*n into U*n1 and U*n2, and thus acquiring an analytic expression ofthe downward modulating waves under different modulating degrees m; 3, using a model prediction control method, and predicting the midpoint voltage of a (k+1) moment and a (k+2) moment; and 4, comparing the midpoint voltage of the (k+1) moment and the (k+2) moment with a reference voltage Uref, and then deciding whether to switch the modulating wave; then outputting a final PWM pulse to the three-level NPC current converter after the modulating wave is compared with a carrier wave. The control strategy provided by the invention selects the modulating wave through predicting the midpoint voltage values of two future moments to serve as a criterion; and provided is the three-level NPC current converter modulation and midpoint level control strategy which achieves balanced midpoint voltage, small switching loss and high efficiency under full modulating degrees and full power factors.
Owner:XIAN UNIV OF TECH +1

Trench-gate charge storage type IGBT and manufacturing method therefor

The invention discloses a trench-gate charge storage type IGBT and a manufacturing method therefor, and belongs to the technical field of semiconductor power devices. A trench-gate emitter structure connected with a P-type volume region is introduced to an N-type drift region at one side of a trench gate in a conventional CSTBT device, thereby enabling the gate-collector capacitance into gate-emitter capacitance, and improving the adverse effect of Miller capacitance. A thick dielectric layer of the trench-gate emitter structure avoids an electric field concentration effect at the bottom of atrench, and improves the breakdown voltage of a device. The depth of a gate electrode is enabled to be less than the junction depth of an N-type charge storage layer, thereby reducing the overall gatecapacitance under the condition that the connection of an IGBT is not affected, improving the switching speed of the device, reducing the switching loss of the device, and improving the compromise characteristics between a positive conduction voltage and the switching-off loss. According to the invention, the existing of the P-type volume region can reduce the extraction area of a hole, and improves the carrier concentration distribution of the whole N-type drift region. Moreover, the noise impact is reduced, and the EMI effect is avoided.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Trench gate charge storage type IGBT and manufacturing method thereof

The invention discloses a trench gate charge storage type IGBT, and belongs to the technical field of semiconductor power devices. A conventional trench gate structure is widened, and a side wall gateelectrode structure is employed for forming a mesa structure located below a base region. moreover, a shielding trench structure for shielding the electric field of a charge storage layer is introduced, thereby improving the carrier injection enhancement effect, and improving the compromise between a forwarding ON voltage drop Vceon and the OFF loss Eoff. The electric field concentration effect at the tip of the bottom of a trench is alleviated, and the breakdown voltage of a device is effectively improved. The gate capacitance of the device, especially the Miller capacitance CGC and the gatecharge QG, is reduced, the switching speed of the device is improved, the switching loss of the device is reduced, and the requirements for the capability of a gate drive circuit are reduced. The constraint on the doping concentration of an N-type charge storage layer and the withstand voltage of the device from the thickness are avoided, the saturation current density is reduced, and a short-circuit safe operating region (SCSOA) of the device is improved. Moreover, an EMI effect is effectively inhibited when the device is turned on. In addition, the manufacturing method is compatible with aconventional trench gate charge storage type IGBT manufacturing method.
Owner:UNIV OF ELECTRONIC SCI & TECH OF CHINA

Bi-directional trench gate charge storage type IGBT (insulated-gate bipolar transistor) and manufacturing method thereof

The invention provides a bi-directional trench gate charge storage type IGBT (insulated-gate bipolar transistor) and belongs to the technical field of a semiconductor power device. By means of widening of a traditional trench gate structure, formation of a mesa structure below a base region by a side wall gate electrode structure as well as introduction of a shielding trench structure, carrier injection enhancement effect is increased while symmetric forward / reverse conduction and turn-off characteristics of the device are realized, and compromise between forward voltage drop Vceon and turn-off loss Eoff is improved; electric field concentration effect at a sharp corner of the bottom of a trench is reduced, and breakdown voltage of the device is effectively increased; gate capacitance of the device is reduced, so that switching speed of the device is increased, switching loss of the device is reduced, and the requirement for capacity of a gate driven circuit is reduced; limitation of doping concentration and thickness of an N-type charge storage layer to device withstand voltage is avoided; saturation current density is reduced, and a short circuit safe operating area of the deviceis improved; further, EMI (electro-magnetic interference) effect produced when the device is conducted is effectively inhibited. Besides, a manufacturing method is compatible with a traditional CSTBTmanufacturing method.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA
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