5 results about "Cathode bias" patented technology

The invention provides an electroplating device which comprises an electroplating cavity used for containing electroplating liquid; the anode is positioned in the electroplating cavity; the substrate holding device is used for clamping the substrate and immersing the plating surface of the substrate into the electroplating liquid during electroplating; the substrate extension assembly comprises an extension cavity, an extension cathode and a diaphragm, the extension cathode is located in the extension cavity and is biased by the cathode, and the diaphragm is used for isolating the extension cathode from the electroplating cavity; wherein the extension cavity is provided with a drainage part facing the anode, the drainage part is provided with an opening, and during electroplating, the drainage part is located below the substrate, surrounds the radial outer side of the substrate, is parallel to the plating surface of the substrate and is used for enabling current from the anode to partially flow to the extension cathode through the drainage part; and the drainage part forms an extending plating surface on the radial outer side of the substrate. According to the electroplating device, the negative influence of the edge effect on the substrate is effectively inhibited or even eliminated.

This application discloses an optocoupler driving circuit with cathode bias, relating to the field of semiconductor devices. The optocoupler driving circuit with cathode bias includes: a current-limiting resistor and a resistor divider circuit; a control pin of a microcontroller is connected to one end of the current-limiting resistor; the other end of the current-limiting resistor is connected to the anode of the optocoupler light-emitting diode (LED); the resistor divider circuit is connected to the cathode of the LED; the resistor divider circuit provides a bias voltage to the cathode of the LED. This application can prevent false triggering of the optocoupler input side due to interference, improving the reliability of the optocoupler drive.

An electrolyteless fuel cell system includes an anode; a cathode; an electrical grid between the anode and cathode; an anode side grid bias electrode; a cathode side grid bias electrode; and an electrical grid power supply, wherein the electrical grid is biased negative with respect to the anode through the anode side grid bias electrode and the electrical grid power supply, or wherein the electrical grid is biased positive with respect to the cathode through the cathode side grid bias electrode and the electrical grid power supply. In electrolyteless electrolyzer mode steam is introduced to the cathode, wherein the electrical grid is biased positive with respect to the cathode through the cathode side grid bias electrode and the electrical grid power supply.

An electroplating apparatus, comprising an electroplating cavity (31) for accommodating an electroplating solution; an anode (32) located inside the electroplating cavity (31); a substrate holding device (33) for holding a substrate (10) and immersing a plating surface (101) of the substrate (10) in the electroplating solution during electroplating; and a substrate extension assembly (34), comprising an extended cavity (342), an extended cathode (341) and a diaphragm (343), wherein the extended cathode (341) is located inside the extended cavity (342) and is cathode-biased, and the diaphragm (343) is used for isolating the extended cathode (341) from the electroplating cavity (31). The extended cavity (342) comprises a current guide portion (344) facing the anode (32), and the current guide portion (344) is provided with an opening. During electroplating, the current guide portion (344) is located below the substrate (10), surrounds the radial outer side of the substrate (10) and is parallel to the plating surface (101) during electroplating, and is used for enabling part of a current from the anode (32) to flow through the current guide portion (344) to the extended cathode (341), such that the current guide portion (344) forms an extended plating surface (340) on the radial outer side of the substrate (10). The electroplating apparatus effectively suppresses or even eliminates the negative impact of edge effects on substrates.

An amplifier circuit including a first stage, second stage and output stage. The first stage includes a cathode biased triode. The amplifier circuit includes a second stage having two long tailed pair triodes, each of the second stage tubes output signals inverted from each other wherein the long-tailed pair triodes are direct current coupled to the output tube's grids, Each cathode biased triode section is direct current coupled to one of the two long tailed pair triodes. The output stage includes two output tubes are in a Circlotron configuration with each output tube's cathode connected to the loudspeaker terminals. Each Bluetooth receiver's ground is connected to the ground of the first stage and the output of each Bluetooth is connected to the grid of the first stage.