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73results about How to "Increase choice flexibility" patented technology

Quantum dot film, preparation method thereof, QLED (Quantum dot Light-Emitting Diode) device and preparation method thereof

The invention belongs to the technical field of quantum dots, and particularly relates to a quantum dot film, a preparation method thereof, a QLED (Quantum dot Light-Emitting Diode) device and a preparation method thereof. The preparation method of the quantum dot film comprises the steps of providing a quantum dot prefabricated film and a solution containing a displacement ligand, wherein the quantum dot in the quantum dot prefabricated film contains an initial surface ligand, the structural general formula of the displacement ligand is X1-R-X2, both X1 and X2 are a functional group capable of being bound with the surface of the quantum dot, and R is an alkyl or alkyl derivative with a conjugated group; and carrying out gas-phase ligand displacement on the quantum dot prefabricated film and the solution containing the displacement ligand to obtain a quantum dot film with the quantum dot surface being bound with the displacement ligand. The displacement ligand with the conjugated groupis adopted to carry out ligand displacement without the problem of solution settlement, the carrier transmission in the quantum dot film is improved, and the light-emitting performance of the devicecan be correspondingly improved.
Owner:TCL CORPORATION

Fan-out wafer-level chip packaging structure and method

The present invention provides a fan-out wafer-level chip packaging structure and method. The fan-out wafer-level chip packaging structure comprises: a conducting layer, wherein one groove configuredto arrange one chip is formed on the conducting layer, and the conducting layer is arranged on a substrate; an insulation layer arranged between the conducting layer and the substrate and configured to fill a gap between the conducting layer and the substrate; a packaging body arranged at the upper surface of the conducting layer, wherein the chip is packaged in the packaging body, one bonding padof each chip is exposed out of the packaging body; a conducting column arranged in the packaging body, wherein one end of the conducting column is coupled to the conducting layer, the other end of the conducting column is exposed out of the packaging body, and the conducting column is connected with a ground wire. The chip is arranged in the groove on the conducting layer, and the conducting layer is connected with the ground wire through the conducting column to form an electromagnetic shielding structure located in the fan-out wafer-level chip packaging structure, and therefore, the possibility can be reduced that the chip is subjected to electromagnetic wave interference by devices in the packaging structure and external devices, the preparation difficulty is small and the production cost is low.
Owner:NAT CENT FOR ADVANCED PACKAGING

Multifunctional HART (Highway Addressable Remote Transducer) communication interface

The invention relates to a multifunctional HART (Highway Addressable Remote Transducer) communication interface, comprising a communication interface bottom board and a digital board card, wherein the communication interface bottom board comprises a communication interface module, a power module and an HART communication channel; the digital board card is a logical chip circuit board card or a digital board card with a MCU (micro control unit); HART site equipment sends data into the digital board card for data processing and protocol conversion by the HART communication channel and is connected with a main station by the communication interface module; and the power module supplies power to the modules on the communication interface bottom board. The multifunctional HART communication interface has the advantages that different main-station communication physical interfaces are provided and can be conveniently replaced with any of RS232, RS485, USB (Universal Serial Bus) and Bluetooth, and the selection flexibility for the physical interfaces is large; seamless connection between multiple main-station protocols and HART field buses is realized, so that the HART equipment can be more conveniently accessed into the existing main-station system; and a complete HART main-station data link layer is established inside and can be compatible with all HART site equipment.
Owner:SHANGHAI INST OF PROCESS AUTOMATION & INSTR

Vertical agitator

The invention discloses a vertical agitator, which comprises a machine base which is composed of a base and a machine head, wherein a driving mechanism, which is used for driving an agitating component, is arranged in the machine head; the driving mechanism comprises a DC (direct current) motor which is arranged in a perpendicular mode, and a planetary gear reducer; the axle of a sun gear of the planetary gear reducer is connected to an output shaft of the DC motor, and one of planet gears of the planetary gear reducer is connected to the agitating component; and the output shaft of the DC motor and the axle of the sun gear are coaxially arranged with the center of an agitating bowl which is arranged on the base when used. The vertical agitator disclosed by the invention, with the adoption of the DC motor, is low in noise, low in energy consumption and high in torque; since the DC motor is arranged in the center of the agitating bowl in a perpendicular mode and power is directly outputted to the agitating component by virtue of the planetary gear reducer, the vertical agitator is short in transmission distance and compact in structure, and the overall dimensions of a finished product are greatly diminished; and by virtue of the planetary gear reducer, the number of product parts and assembling errors are reduced, and the service life of the finished product is prolonged.
Owner:GUANGDONG XINBAO ELECTRICAL APPLIANCES HLDG CO LTD

Sample conveying device

PendingCN109946470ADoes not affect the normal sampling processSimplify Timing DesignMaterial analysisEngineeringPosition control
The invention provides a sample conveying device comprising a sample suction track for transporting sample racks and a control unit. The sample suction track includes a sample suction zone and a waiting zone; a stepped separation blade mechanism for locating sample racks in the sample suction zone is arranged at the side of the sample suction zone; a first separation blade mechanism for locating sample racks in the waiting zone, a second separation blade mechanism for locating first test tubes of the sample racks in the waiting zone at sample suction positions, and a positioning control mechanism for driving the first separation blade mechanism and the second separation blade mechanism to move are arranged at the side of the waiting zone. The control unit controls the sample suction track,the stepped separation blade mechanism and the positioning control mechanism to work. With the sample conveying device, before the previous sample rack completes sample suction of all samples, the next sample rack enters the sample suction track; and when the previous sample rack completes sample suction of all samples and does not exit from the sample suction track completely, the first test tube of the next sample rack can make sample suction preparation. Therefore, sample suction waiting time of conversion of two adjacent sample racks is equal to sample suction waiting time of conversion of two adjacent test tubes in the same sample racks.
Owner:宁波美康盛德生物科技有限公司

Wall body vertical greening system

The invention discloses a wall body vertical greening system. The system comprises a vertical stand which is arranged tight against a wall space, a spray irrigation device which is arranged above the vertical stand and paving plants which are arranged on the surfaces of the vertical stand; the vertical stand comprises a first vertical placing face and a second vertical placing face which are arranged parallel to each other and tight against each other, wherein the first vertical placing face is located between the wall space and the second vertical placing face and comprises a plurality of first placing units which are distributed evenly on the wall space, first conducting grooves which are corresponding to the first placing units one to one are formed in the second vertical placing face, the first placing units can extend into the first conducing grooves, and the second vertical placing face can shift in the direction close to or far away from the first vertical placing face. Through the arrangement of the first vertical placing face and the second vertical placing face, the wall body vertical greening system has a relatively high utilization flexibility, can make corresponding sheltering according to different paving plants, and can still keep the vertical greening of surface of the wall body when the external environment is relatively bad.
Owner:绿地集团森茂园林有限公司

MIMO (Multiple-Input Multiple-Output)-OFDM (Orthogonal Frequency Division Multiplexing)-CDMA (Code Division Multiple Access) spread spectrum method combined with selected mapping

The invention belongs to the technical field of wireless communication, and discloses an MIMO (Multiple-Input Multiple-Output)-OFDM (Orthogonal Frequency Division Multiplexing)-CDMA (Code Division Multiple Access) spread spectrum method combined with selected mapping. The method comprises the steps of respectively performing constellation mapping, serial-parallel conversion and spread spectrum processing on information of each user, and then adding the information together to serve as an original frequency domain signal; selecting a variety of spread spectrum codes to serve as alternative sequences in a phase sequence generator, multiplying the alternative sequences with the original frequency domain signal to perform phase rotation on different subcarriers, respectively performing an IFFT(Inverse Fast Fourier Transform) operation after multi-channel transformation, and selecting the minimum PAPR (Peak to Average Power Ratio) to serve as a transmission time domain signal; performing FFT and signal combination on received signals to obtain a frequency domain signal after the phase rotation sequence; and restoring the user information according to sideband information, and de-spreading and restoring the signal through spread spectrum codes of different user information. The method disclosed by the invention improves the flexibility of the phase selection sequence, and is greatlyimproved on the aspects of peak-to-average ratio and bit error rate.
Owner:XIDIAN UNIV

Composite type ultra-thin non-core substrate and manufacturing method thereof

The invention relates to a composite type ultra-thin non-core substrate and a manufacturing method thereof. The composite type ultra-thin non-core substrate comprises a PI core plate which comprises a PI substrate and copper foil placed on the front face and the back face of the PI substrate. The copper foil adheres to the front face and the back face of the PI substrate respectively through adhesive layers. The copper foil is subjected to etching, and core layer patterns are formed. PTHs are formed in the PI core plate. The core layer patterns on the front face and the back face of the PI core plate are connected through the PTHs. The front face and the back face of the PI core plate are respectively provided with one or more PP dielectric layers in a pressing-fitting mode. Outer layer circuit patterns are arranged on the PP dielectric layers and are connected with the copper foil. The PI substrate is used as a core layer, inner layer patterns are formed, and then manufacturing of the multi-layer substrate is achieved through a layer-adding technology. According to the method, the intensity of the core layer is greatly improved, the whole intensity of the substrate is improved, meanwhile, the PI substrate technology is mature, the thickness can meet the requirement, the method can be compatible with a common substrate technology, and extra auxiliary technologies and equipment are of no need.
Owner:NAT CENT FOR ADVANCED PACKAGING

Electrical impedance tomography imaging system and electrode shielding method thereof

The invention discloses an electrical impedance tomography imaging system and an electrode shielding method, which mainly solve the problem that a too small capacitive reactance due to high working frequency, an increase in capacitance due to increase in wire length and the like affect the signal amplitude on a passageway of an electrode in the prior art. The electrical impedance tomography imaging system, comprises master control equipment, an image processing and displaying device, a signal processor and analogue and digital converter circuit, a switch system, a shield driving circuit and an excitation source generating circuit which are respectively connected with the master control equipment, and a shielded electrode which is connected with the switch system and the shielding driving circuit, wherein the switch system is respectively connected with the signal processor and analogue and digital converter circuit, the shield driving circuit and the excitation source generating circuit. Based on the electrical impedance tomography imaging system, the invention also provides a corresponding electrode shielding method, which is efficient and requires low cost for shielding the electrode.
Owner:SEALAND TECH CHENGDU

White-light quantum dot light-emitting diode and preparation method thereof

The invention relates to a white-light quantum dot light-emitting diode and a preparation method thereof. The preparation method comprises the steps of providing a bottom electrode; preparing a quantum dot prefabricated film on the bottom electrode, wherein the surface of a quantum dot in the quantum dot prefabricated film is connected with an initial ligand; placing the quantum dot prefabricatedfilm in a device capable of being sealed, and introducing a gaseous displacement ligand for gas-phase ligand displacement to obtain a first quantum dot film with the surface of the quantum dot being bound with the displacement ligand, wherein the displacement ligand can be connected to at least two quantum dots; preparing N laminated quantum dot films by adopting the preparation method of the first quantum dot film to obtain a light-emitting laminated layer; or preparing (N-1) laminated quantum dot films by adopting the preparation method of the first quantum dot film, preparing an organic light-emitting film on the (N-1)th quantum dot film to obtain a light-emitting laminated layer, wherein N is a positive integer which is greater than or equal to 2 and less than or equal to 10, the light-emitting laminated layer compositely emits white light, the bottom electrode is an anode, the top electrode is a cathode, or the bottom electrode is a cathode, and the top electrode is an anode.
Owner:TCL CORPORATION
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